Yiyu Qian
- Mechanical Engineering top 5%
- Electrical and Electronic Engineering top 10%
- Materials Chemistry
- Aerospace Engineering top 10%
- Mechanics of Materials
- Co-authors
- Xin MaFusahito YOSHIDAFengjiang WangFeng GaoJ.C. FengPeng HeJun LiuHongqin Wang
- Topics
- Electronic Packaging and Soldering Technologies (17 papers)3D IC and TSV technologies (10 papers)Intermetallics and Advanced Alloy Properties (10 papers)
- Partner nations
- ChinaJapanUnited States
In The Last Decade
Yiyu Qian
37 papers receiving 790 citations
Peers
Comparison fields: 5 of 62
- Mechanical Engineering 627
- Electrical and Electronic Engineering 446
- Materials Chemistry 133
- Aerospace Engineering 126
- Mechanics of Materials 75
Countries citing papers authored by Yiyu Qian
This map shows the geographic impact of Yiyu Qian's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yiyu Qian with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yiyu Qian more than expected).
Fields of papers citing papers by Yiyu Qian
This network shows the impact of papers produced by Yiyu Qian. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yiyu Qian. The network helps show where Yiyu Qian may publish in the future.
Co-authorship network of co-authors of Yiyu Qian
This figure shows the co-authorship network connecting the top 25 collaborators of Yiyu Qian. A scholar is included among the top collaborators of Yiyu Qian based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yiyu Qian. Yiyu Qian is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 5 | |
| 5 | EFFECT OF AG NANOPOWDERS ON MICROSTRUCTURE, HARDNESS AND ELASTIC MODULUS OF SN-BI SOLDERS | 1 |
| 6 | Microstructure and Strength of the TiB2 Cermet/TiAl Joint Diffusion Bonded with Ni Interlayer | 1 |
| 7 | DIFFUSION BONDING OF TiAl TO Ti AND TC4 ALLOY | 1 |
| 8 | Simulation on Thermal Integrity of the Fin/Tube Brazed Joint of Heat Exchangers | 1 |
| 9 | A New Model of Interfacial Physical Contact in Diffusion Bonding | 3 |
| 10 | 15 | |
| 11 | 23 | |
| 12 | 36 | |
| 13 | 5 | |
| 14 | 42 | |
| 15 | 45 | |
| 16 | 13 | |
| 17 | 102 | |
| 18 | 68 | |
| 19 | 1 | |
| 20 | 2 |
About Yiyu Qian
Yiyu Qian is a scholar working on Ceramics and Composites, Mechanical Engineering and General Materials Science, having authored 41 papers that have together received 827 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (10 papers) and Intermetallics and Advanced Alloy Properties (10 papers). The work is most often cited by research in Mechanical Engineering (627 citations), General Materials Science (42 citations) and Electrical and Electronic Engineering (446 citations). Yiyu Qian has collaborated with scholars based in China, Japan and United States. Frequent co-authors include Xin Ma, Fusahito YOSHIDA, Fengjiang Wang, Feng Gao, J.C. Feng, Peng He, Jun Liu, Hongqin Wang, Dušan P. Sekulić and Peng Zhang. Their work appears in journals such as Materials Science and Engineering A, Journal of Materials Science and Frontiers in Microbiology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.