E. Ristolainen
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Materials Chemistry
- Mechanics of Materials top 10%
- Biomedical Engineering
- Co-authors
- Pekka HeinoT. LepistöJanne J. SundelinMatti MäntysaloKimmo KaskiL. F. PerondiDongkai ShangguanLaura Frisk
- Topics
- Electronic Packaging and Soldering Technologies (36 papers)3D IC and TSV technologies (36 papers)Microstructure and mechanical properties (7 papers)
- Journals
- Physical review. B, Condensed matterMaterials Science and Engineering AApplied Surface Science
- Partner nations
- FinlandUnited States
In The Last Decade
E. Ristolainen
59 papers receiving 678 citations
Peers
Comparison fields: 5 of 57
- Electrical and Electronic Engineering 620
- Mechanical Engineering 265
- Materials Chemistry 183
- Mechanics of Materials 139
- Biomedical Engineering 84
Countries citing papers authored by E. Ristolainen
This map shows the geographic impact of E. Ristolainen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Ristolainen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Ristolainen more than expected).
Fields of papers citing papers by E. Ristolainen
This network shows the impact of papers produced by E. Ristolainen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Ristolainen. The network helps show where E. Ristolainen may publish in the future.
Co-authorship network of co-authors of E. Ristolainen
This figure shows the co-authorship network connecting the top 25 collaborators of E. Ristolainen. A scholar is included among the top collaborators of E. Ristolainen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E. Ristolainen. E. Ristolainen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 5 | |
| 2 | 2 | |
| 3 | 11 | |
| 4 | 2 | |
| 5 | 9 | |
| 6 | 1 | |
| 7 | 39 | |
| 8 | 2 | |
| 9 | 1 | |
| 10 | 44 | |
| 11 | 7 | |
| 12 | 8 | |
| 13 | 4 | |
| 14 | 2 | |
| 15 | 10 | |
| 16 | 9 | |
| 17 | 6 | |
| 18 | Flip chip joining on FR-4 substrate using ACFs | 7 |
| 19 | 1 | |
| 20 | 4 |
About E. Ristolainen
E. Ristolainen is a scholar working on Electrical and Electronic Engineering, General Materials Science and Automotive Engineering, having authored 63 papers that have together received 799 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (36 papers) and Microstructure and mechanical properties (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (620 citations), Mechanical Engineering (265 citations) and Mechanics of Materials (139 citations). E. Ristolainen has collaborated with scholars based in Finland and United States. Frequent co-authors include Pekka Heino, T. Lepistö, Janne J. Sundelin, Matti Mäntysalo, Kimmo Kaski, L. F. Perondi, Dongkai Shangguan, Laura Frisk, Kimmo Kaija and Janne J. Jokinen. Their work appears in journals such as Physical review. B, Condensed matter, Materials Science and Engineering A and Applied Surface Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.