Fan-Yi Ouyang

1.6k total citations
59 papers, 1.3k citations indexed

About

Fan-Yi Ouyang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Fan-Yi Ouyang has authored 59 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 40 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 18 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Fan-Yi Ouyang's work include Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (23 papers) and Copper Interconnects and Reliability (18 papers). Fan-Yi Ouyang is often cited by papers focused on Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (23 papers) and Copper Interconnects and Reliability (18 papers). Fan-Yi Ouyang collaborates with scholars based in Taiwan, United States and Japan. Fan-Yi Ouyang's co-authors include Ji‐Jung Kai, Chi‐Hung Chang, K. N. Tu, Jianjie Wang, Tao‐Chih Chang, Tsung‐Kuang Yeh, Chih Chen, Hsiang‐Yao Hsiao, Chin-Li Kao and Ge‐Ping Yu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

In The Last Decade

Fan-Yi Ouyang

56 papers receiving 1.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Fan-Yi Ouyang Taiwan 21 731 687 352 253 207 59 1.3k
J. Pstruś Poland 25 1.1k 1.5× 1.2k 1.7× 442 1.3× 270 1.1× 78 0.4× 81 1.7k
M. V. Karpets Ukraine 17 130 0.2× 564 0.8× 452 1.3× 246 1.0× 139 0.7× 143 1.0k
Tomasz Gancarz Poland 21 646 0.9× 824 1.2× 453 1.3× 284 1.1× 39 0.2× 71 1.2k
L. Niewolak Germany 21 379 0.5× 732 1.1× 1.3k 3.7× 894 3.5× 60 0.3× 50 1.7k
Albert T. Wu Taiwan 22 998 1.4× 408 0.6× 538 1.5× 81 0.3× 282 1.4× 88 1.3k
Robert Tirawat United States 14 1.5k 2.1× 306 0.4× 909 2.6× 69 0.3× 39 0.2× 25 2.0k
Jie Kuang China 19 227 0.3× 803 1.2× 575 1.6× 258 1.0× 95 0.5× 42 1.1k
Yee‐Wen Yen Taiwan 22 984 1.3× 825 1.2× 246 0.7× 161 0.6× 133 0.6× 106 1.3k
Donatella Giuranno Italy 21 320 0.4× 955 1.4× 472 1.3× 230 0.9× 32 0.2× 74 1.3k
Degang Xie China 15 174 0.2× 310 0.5× 466 1.3× 81 0.3× 68 0.3× 33 864

Countries citing papers authored by Fan-Yi Ouyang

Since Specialization
Citations

This map shows the geographic impact of Fan-Yi Ouyang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fan-Yi Ouyang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fan-Yi Ouyang more than expected).

Fields of papers citing papers by Fan-Yi Ouyang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fan-Yi Ouyang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fan-Yi Ouyang. The network helps show where Fan-Yi Ouyang may publish in the future.

Co-authorship network of co-authors of Fan-Yi Ouyang

This figure shows the co-authorship network connecting the top 25 collaborators of Fan-Yi Ouyang. A scholar is included among the top collaborators of Fan-Yi Ouyang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fan-Yi Ouyang. Fan-Yi Ouyang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Ouyang, Fan-Yi, et al.. (2025). Effect of substrate temperature on the formation of nanotwin and properties of NiCoFeCrAlTi high-entropy alloy thin films. Journal of Alloys and Compounds. 1013. 178505–178505. 1 indexed citations
2.
Wang, Jianjie, et al.. (2025). Softening-resistant ultra-strong nanotwinned CoCrFeNi medium entropy alloy thin films. Materials Science and Engineering A. 927. 147928–147928. 2 indexed citations
3.
Chou, T.H., et al.. (2025). Thermomigration-induced asymmetric intermetallic growth in Ag/In joints under temperature gradients for low-temperature packaging. Journal of Materials Research and Technology. 39. 8695–8706.
4.
5.
Patel, Maulik, et al.. (2025). Synergistic effect of nanotwins and compositional entropy on the radiation resistance of CoCrFeNi thin films. Acta Materialia. 299. 121420–121420. 1 indexed citations
6.
Ouyang, Fan-Yi, et al.. (2024). Manipulating the thermal stability of the {111}-oriented nanotwinned Ag films by ion bombardment. Surface and Coatings Technology. 480. 130604–130604. 4 indexed citations
7.
Ouyang, Fan-Yi, et al.. (2024). Effect of substrate bias on the formation of nanotwin and properties in Cu thin films for advanced packaging technology. Surface and Coatings Technology. 482. 130737–130737. 4 indexed citations
8.
Ouyang, Fan-Yi, et al.. (2023). The Interfacial Reaction of Ni/In/Ni Sandwich Structure During Solid-State Isothermal Aging. Journal of Electronic Materials. 53(3). 1264–1271. 1 indexed citations
9.
Shen, Yu-An, et al.. (2023). Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy. Intermetallics. 154. 107821–107821. 10 indexed citations
10.
Ouyang, Fan-Yi, et al.. (2022). Low-Temperature Bonding Process by Silver Nanoparticles Paste for Power Electronic Devices. Journal of Electronic Materials. 52(2). 792–800. 3 indexed citations
11.
Wang, Jianjie, et al.. (2022). Optimization of Sputtering Process for Medium Entropy Alloy Nanotwinned CoCrFeNi Thin Films by Taguchi Method. Materials. 15(22). 8238–8238. 4 indexed citations
12.
Huang, Shin‐Yi, et al.. (2021). Low temperature Ag-Ag direct bonding under air atmosphere. Journal of Alloys and Compounds. 862. 158587–158587. 24 indexed citations
13.
Ouyang, Fan-Yi, et al.. (2021). High temperature oxidation behavior of high entropy alloy Al4Co3Cr25Cu10Fe25Ni33 in oxygen-containing atmospheres. Materials Chemistry and Physics. 278. 125678–125678. 29 indexed citations
14.
Wang, Jianjie & Fan-Yi Ouyang. (2021). Oxidation behavior of Al-Cr-Nb-Si-Zr high entropy nitride thin films at 850 °C. Corrosion Science. 187. 109467–109467. 15 indexed citations
15.
Wang, Jianjie, et al.. (2021). Improvement of Ag films with highly (111) surface orientation for metal direct bonding technique: Nanotwinned structure and ion bombardment effect. Materials Chemistry and Physics. 274. 125159–125159. 19 indexed citations
16.
Lu, Cheng‐Hsin, et al.. (2021). Interfacial Solid–Liquid Reaction of Ni/In/Ni Structure During Isothermal Reflow Process. Journal of Electronic Materials. 50(12). 6575–6583. 6 indexed citations
17.
Lin, Wan-Hsuan, et al.. (2018). Electrochemical migration of nano-sized Ag interconnects under deionized water and Cl−-containing electrolyte. Journal of Materials Science Materials in Electronics. 29(21). 18331–18342. 7 indexed citations
18.
Liu, Pilin, et al.. (2009). Solder Joint Electromigration Mechanisms. 703–709. 1 indexed citations
19.
Ouyang, Fan-Yi, Kai Chen, K. N. Tu, & Yi‐Shao Lai. (2007). Effect of current crowding on whisker growth at the anode in flip chip solder joints. Applied Physics Letters. 91(23). 41 indexed citations
20.
Ouyang, Fan-Yi, et al.. (2006). Thermomigration in SnPb composite solder joints and wires. 1974–1978. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026