An‐Chou Yeh
- Mechanical Engineering top 0.2%
- Aerospace Engineering top 0.2%
- Materials Chemistry top 5%
- Biomedical Engineering top 5%
- Mechanics of Materials top 5%
- Co-authors
- Sammy TinYao-Jen ChangHideyuki MurakamiJien‐Wei YehChe‐Wei TsaiChen‐Ming KuoWei‐Lin HsuJien-Wei Yeh
- Topics
- High Entropy Alloys Studies (71 papers)High-Temperature Coating Behaviors (69 papers)Additive Manufacturing Materials and Processes (50 papers)
- Journals
- Proceedings of the National Academy of SciencesApplied Physics LettersJournal of The Electrochemical Society
- Partner nations
- TaiwanJapanUnited States
In The Last Decade
An‐Chou Yeh
124 papers receiving 4.6k citations
Hit Papers
Peers
Comparison fields: 5 of 80
- Mechanical Engineering 4.3k
- Aerospace Engineering 2.5k
- Materials Chemistry 943
- Biomedical Engineering 661
- Mechanics of Materials 377
Countries citing papers authored by An‐Chou Yeh
This map shows the geographic impact of An‐Chou Yeh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by An‐Chou Yeh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites An‐Chou Yeh more than expected).
Fields of papers citing papers by An‐Chou Yeh
This network shows the impact of papers produced by An‐Chou Yeh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by An‐Chou Yeh. The network helps show where An‐Chou Yeh may publish in the future.
Co-authorship network of co-authors of An‐Chou Yeh
This figure shows the co-authorship network connecting the top 25 collaborators of An‐Chou Yeh. A scholar is included among the top collaborators of An‐Chou Yeh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with An‐Chou Yeh. An‐Chou Yeh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 1 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | 1 | |
| 6 | 3 | |
| 7 | 3 | |
| 8 | 4 | |
| 9 | 5 | |
| 10 | 2 | |
| 11 | 1 | |
| 12 | 2 | |
| 13 | 2 | |
| 14 | 1 | |
| 15 | 5 | |
| 16 | 72 | |
| 17 | 5 | |
| 18 | 3 | |
| 19 | 15 | |
| 20 | 78 |
About An‐Chou Yeh
An‐Chou Yeh is a scholar working on Mechanical Engineering, Aerospace Engineering and Metals and Alloys, having authored 127 papers that have together received 4.8k indexed citations. Recurring topics across this work include High Entropy Alloys Studies (71 papers), High-Temperature Coating Behaviors (69 papers) and Additive Manufacturing Materials and Processes (50 papers). The work is most often cited by research in Mechanical Engineering (4.3k citations), Aerospace Engineering (2.5k citations) and Automotive Engineering (328 citations). An‐Chou Yeh has collaborated with scholars based in Taiwan, Japan and United States. Frequent co-authors include Sammy Tin, Yao-Jen Chang, Hideyuki Murakami, Jien‐Wei Yeh, Che‐Wei Tsai, Chen‐Ming Kuo, Wei‐Lin Hsu, Jien-Wei Yeh, Stéphane Gorsse and Te‐Kang Tsao. Their work appears in journals such as Proceedings of the National Academy of Sciences, Applied Physics Letters and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.