Don Son Jiang
Impact in
- Mechanical Engineering top 10%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 31
- 3D IC and TSV technologies 29
- Electromagnetic Compatibility and Noise Suppression 3
-
- Aluminum Alloys Composites Properties 6
- Metal Forming Simulation Techniques 3
- Advanced Materials and Mechanics 3
- Co-authors
- Cheng–En Ho (1 shared paper)Shenghao Yang (1 shared paper)C. R. Kao (1 shared paper)T. S. Lui (4 shared papers)C. S. Hsiao (5 shared papers)Jeng‐Haur Horng (1 shared paper)Chih Chen (1 shared paper)Yi‐Cheng Chu (1 shared paper)
- Journals
- Microelectronics Reliability (3 papers)International Journal of Cast Metals Research (2 papers)Journal of Electronic Materials (1 paper)Scripta Materialia (1 paper)Electronic Materials Letters (1 paper)
- Partner nations
- TaiwanAustraliaUnited States
In The Last Decade
Don Son Jiang
33 papers receiving 347 citations
Peers
Comparison fields: 5 of 29
- Mechanical Engineering 210
- Electrical and Electronic Engineering 298
- General Materials Science 10
- Aerospace Engineering 55
- Electronic, Optical and Magnetic Materials 30
Countries citing papers authored by Don Son Jiang
This map shows the geographic impact of Don Son Jiang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Don Son Jiang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Don Son Jiang more than expected).
Fields of papers citing papers by Don Son Jiang
This network shows the impact of papers produced by Don Son Jiang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Don Son Jiang. The network helps show where Don Son Jiang may publish in the future.
Co-authors
The 21 scholars most cited alongside Don Son Jiang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 36 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 121 | |
| 2 | 2005 | 42 | |
| 3 | 2012 | 41 | |
| 4 | 1997 | 25 | |
| 5 | 2000 | 15 | |
| 6 | 2013 | 14 | |
| 7 | 2017 | 12 | |
| 8 | 1999 | 11 | |
| 9 | 2021 | 9 | |
| 10 | 2007 | 8 | |
| 11 | 2014 | 8 | |
| 12 | 2007 | 7 | |
| 13 | 2007 | 5 | |
| 14 | 2007 | 4 | |
| 15 | 2014 | 4 | |
| 16 | 2017 | 3 | |
| 17 | 2011 | 3 | |
| 18 | 1999 | 3 | |
| 19 | 2014 | 3 | |
| 20 | 2017 | 2 |
About Don Son Jiang
Don Son Jiang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Aerospace Engineering and Industrial and Manufacturing Engineering, having authored 36 papers that have together received 359 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (29 papers), Aluminum Alloys Composites Properties (6 papers), Aluminum Alloy Microstructure Properties (4 papers), Metal Forming Simulation Techniques (3 papers), Advanced Materials and Mechanics (3 papers), Electromagnetic Compatibility and Noise Suppression (3 papers) and Metal and Thin Film Mechanics (2 papers). The work is most often cited by research in Mechanical Engineering (210 citations), Electrical and Electronic Engineering (298 citations), General Materials Science (10 citations), Aerospace Engineering (55 citations) and Electronic, Optical and Magnetic Materials (30 citations). Don Son Jiang has collaborated with scholars based in Taiwan, Australia and United States. Frequent co-authors include Cheng–En Ho, Shenghao Yang, C. R. Kao, T. S. Lui, C. S. Hsiao, Jeng‐Haur Horng, Chih Chen, Yi‐Cheng Chu, Yu-Po Wang and Eason Chen. Their work appears in journals such as Microelectronics Reliability, International Journal of Cast Metals Research, Journal of Electronic Materials, Scripta Materialia and Electronic Materials Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.