Yu-Po Wang

528 total citations
76 papers, 309 citations indexed

About

Yu-Po Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Industrial and Manufacturing Engineering. According to data from OpenAlex, Yu-Po Wang has authored 76 papers receiving a total of 309 indexed citations (citations by other indexed papers that have themselves been cited), including 71 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 10 papers in Industrial and Manufacturing Engineering. Recurrent topics in Yu-Po Wang's work include 3D IC and TSV technologies (54 papers), Electronic Packaging and Soldering Technologies (46 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers). Yu-Po Wang is often cited by papers focused on 3D IC and TSV technologies (54 papers), Electronic Packaging and Soldering Technologies (46 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers). Yu-Po Wang collaborates with scholars based in Taiwan and China. Yu-Po Wang's co-authors include C. S. Hsiao, Ping‐Feng Pai, Jung-Pin Lai, Chih‐Ming Chen, Eric He, Jay Li, Yanping Zhang, David Ho, Alex J. Hsieh and Andrew H. Kang and has published in prestigious journals such as Materials Characterization, Journal of Materials Science Materials in Electronics and Micromachines.

In The Last Decade

Yu-Po Wang

62 papers receiving 292 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yu-Po Wang Taiwan 11 229 39 37 33 23 76 309
Scott McCann United States 12 206 0.9× 37 0.9× 13 0.4× 48 1.5× 26 1.1× 26 306
F. Dupont Belgium 9 151 0.7× 62 1.6× 20 0.5× 44 1.3× 24 1.0× 33 248
Bumhee Bae South Korea 13 420 1.8× 69 1.8× 49 1.3× 41 1.2× 9 0.4× 44 448
Ziwei Liu China 12 226 1.0× 15 0.4× 64 1.7× 33 1.0× 15 0.7× 38 277
Nokibul Islam United States 12 349 1.5× 26 0.7× 18 0.5× 81 2.5× 34 1.5× 31 405
Vempati Srinivasa Rao Singapore 10 288 1.3× 30 0.8× 5 0.1× 59 1.8× 10 0.4× 42 330
Tao Guan China 9 170 0.7× 20 0.5× 30 0.8× 35 1.1× 13 0.6× 33 322
Braham Ferreira Netherlands 14 649 2.8× 15 0.4× 11 0.3× 84 2.5× 19 0.8× 48 688
Yangyang Lai United States 11 228 1.0× 48 1.2× 16 0.4× 83 2.5× 17 0.7× 32 272

Countries citing papers authored by Yu-Po Wang

Since Specialization
Citations

This map shows the geographic impact of Yu-Po Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yu-Po Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yu-Po Wang more than expected).

Fields of papers citing papers by Yu-Po Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yu-Po Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yu-Po Wang. The network helps show where Yu-Po Wang may publish in the future.

Co-authorship network of co-authors of Yu-Po Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Yu-Po Wang. A scholar is included among the top collaborators of Yu-Po Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yu-Po Wang. Yu-Po Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lai, Jung-Pin, et al.. (2025). Predicting Thermal Resistance of Packaging Design by Machine Learning Models. Micromachines. 16(3). 350–350. 2 indexed citations
2.
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Wang, Yu-Po, et al.. (2023). Investigation of Solder Resist Opening Uniformity on Flip Chip Substrate. 255–256. 1 indexed citations
5.
Li, Jay, et al.. (2023). Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics. 228–232. 8 indexed citations
6.
Lai, Jung-Pin, et al.. (2023). Tree-Based Machine Learning Models with Optuna in Predicting Impedance Values for Circuit Analysis. Micromachines. 14(2). 265–265. 34 indexed citations
7.
Wang, Yu-Po, et al.. (2023). Assembly Technology for FO-MCM with HBM in HPC Application. IMAPSource Proceedings. 2022(IMAPS Symposium). 1 indexed citations
8.
Zhang, Ken, et al.. (2023). FOPOP Warpage Analysis for Package Design Optimization. 77–78.
9.
Kang, Andrew H., et al.. (2023). Antenna-in-Package Electrical Research for Beyond 5G application. 63–66.
10.
Zhang, Yanping, et al.. (2022). Interfacial reactions between pure indium solder and Au/Ni metallization. Journal of Materials Science Materials in Electronics. 33(16). 13143–13151. 10 indexed citations
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Wang, Yu-Po, et al.. (2022). The Optimal Solution of Fan-Out Embedded Bridge (FO-EB) Package Evaluation during the Process and Reliability Test. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1080–1084. 9 indexed citations
13.
Wang, Yu-Po, et al.. (2021). Fan-Out Embedded Bridge Solution in HPC Application. 222–225. 5 indexed citations
14.
Pan, George, et al.. (2021). Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration. 239–243. 11 indexed citations
15.
Li, Jay, et al.. (2020). EMI Shielding Technology in 5G RF System in Package Module. 931–937. 19 indexed citations
16.
Wang, Xiaoling, Lei Wang, Yu-Po Wang, et al.. (2020). A rapid colloidal gold immunochromatographic assay for the diagnosis of coronavirus disease 2019. Chinese Medical Journal. 133(16). 1986–1988. 7 indexed citations
17.
Ho, David, et al.. (2019). Innovative Flip Chip Package Solutions for Automotive Applications. 1432–1436. 4 indexed citations
18.
Wang, Yu-Po, et al.. (2019). Advanced Die Saw Technology for WLCSP Reliability Enhancement. IMAPSource Proceedings. 2019(1). 323–326.
19.
Wang, Yu-Po, et al.. (2016). Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology. IMAPSource Proceedings. 2016(1). 524–528. 1 indexed citations
20.
Lu, Panfang, et al.. (2003). Flip chip organic substrate with metal column. 95–99. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026