Yu-Po Wang
- Electrical and Electronic Engineering
- Biomedical Engineering
- Aerospace Engineering
- Mechanical Engineering
- Materials Chemistry
- Topics
- 3D IC and TSV technologies (54 papers)Electronic Packaging and Soldering Technologies (46 papers)Electromagnetic Compatibility and Noise Suppression (12 papers)
- Cited by
- Electrical and Electronic EngineeringHardware and ArchitectureNuclear Energy and Engineering
In The Last Decade
Yu-Po Wang
62 papers receiving 292 citations
Peers
Comparison fields: 5 of 71
- Electrical and Electronic Engineering 229
- Biomedical Engineering 39
- Aerospace Engineering 37
- Mechanical Engineering 33
- Materials Chemistry 23
Countries citing papers authored by Yu-Po Wang
This map shows the geographic impact of Yu-Po Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yu-Po Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yu-Po Wang more than expected).
Fields of papers citing papers by Yu-Po Wang
This network shows the impact of papers produced by Yu-Po Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yu-Po Wang. The network helps show where Yu-Po Wang may publish in the future.
Co-authorship network of co-authors of Yu-Po Wang
This figure shows the co-authorship network connecting the top 25 collaborators of Yu-Po Wang. A scholar is included among the top collaborators of Yu-Po Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yu-Po Wang. Yu-Po Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 0 | |
| 3 | 2 | |
| 4 | 1 | |
| 5 | 8 | |
| 6 | 34 | |
| 7 | 1 | |
| 8 | 0 | |
| 9 | 0 | |
| 10 | 10 | |
| 11 | 1 | |
| 12 | 9 | |
| 13 | 5 | |
| 14 | 11 | |
| 15 | 19 | |
| 16 | 7 | |
| 17 | 4 | |
| 18 | 0 | |
| 19 | 1 | |
| 20 | 1 |
About Yu-Po Wang
Yu-Po Wang is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Industrial and Manufacturing Engineering, having authored 76 papers that have together received 309 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (54 papers), Electronic Packaging and Soldering Technologies (46 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers). The work is most often cited by research in Electrical and Electronic Engineering (229 citations), Hardware and Architecture (20 citations) and Nuclear Energy and Engineering (1 citation). Yu-Po Wang has collaborated with scholars based in Taiwan and China. Frequent co-authors include C. S. Hsiao, Ping‐Feng Pai, Jung-Pin Lai, Chih‐Ming Chen, Eric He, Jay Li, Yanping Zhang, David Ho, Alex J. Hsieh and Andrew H. Kang. Their work appears in journals such as Materials Characterization, Journal of Materials Science Materials in Electronics and Micromachines.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.