Young-Eui Shin
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Mechanics of Materials
- Aerospace Engineering
- Biomedical Engineering
- Co-authors
- Seung‐Boo JungChang-Chae ShurChang‐Bae LeeMin-Soo KangJong‐Min KimSung Hyun KimJeong‐Won YoonCheol‐Woong Yang
- Topics
- Electronic Packaging and Soldering Technologies (32 papers)3D IC and TSV technologies (23 papers)Advanced Welding Techniques Analysis (10 papers)
- Partner nations
- South KoreaJapanUnited States
In The Last Decade
Young-Eui Shin
37 papers receiving 365 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 329
- Mechanical Engineering 222
- Mechanics of Materials 60
- Aerospace Engineering 59
- Biomedical Engineering 22
Countries citing papers authored by Young-Eui Shin
This map shows the geographic impact of Young-Eui Shin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Young-Eui Shin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Young-Eui Shin more than expected).
Fields of papers citing papers by Young-Eui Shin
This network shows the impact of papers produced by Young-Eui Shin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Young-Eui Shin. The network helps show where Young-Eui Shin may publish in the future.
Co-authorship network of co-authors of Young-Eui Shin
This figure shows the co-authorship network connecting the top 25 collaborators of Young-Eui Shin. A scholar is included among the top collaborators of Young-Eui Shin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Young-Eui Shin. Young-Eui Shin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 7 | |
| 3 | 3 | |
| 4 | 1 | |
| 5 | 7 | |
| 6 | 6 | |
| 7 | 7 | |
| 8 | 0 | |
| 9 | 8 | |
| 10 | A Study on the Fracture Mode Characteristics of Automotive Application Component Lead-free Solder Joints | 3 |
| 11 | 4 | |
| 12 | 1 | |
| 13 | 7 | |
| 14 | Reliability of Sn-8Zn-3Bi Solder Paste Applied to Lead and Lead-free Plating on Lead-frame under Thermal Shock Test | 0 |
| 15 | 7 | |
| 16 | 7 | |
| 17 | 3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material | 3 |
| 18 | 77 | |
| 19 | 9 | |
| 20 | 58 |
About Young-Eui Shin
Young-Eui Shin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering, having authored 44 papers that have together received 386 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (23 papers) and Advanced Welding Techniques Analysis (10 papers). The work is most often cited by research in General Materials Science (19 citations), Mechanical Engineering (222 citations) and Electrical and Electronic Engineering (329 citations). Young-Eui Shin has collaborated with scholars based in South Korea, Japan and United States. Frequent co-authors include Seung‐Boo Jung, Chang-Chae Shur, Chang‐Bae Lee, Min-Soo Kang, Jong‐Min Kim, Sung Hyun Kim, Jeong‐Won Yoon, Cheol‐Woong Yang, Doseok Kim and Su‐Jeong Suh. Their work appears in journals such as Japanese Journal of Applied Physics, Materials and Energies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.