Young-Eui Shin
About
In The Last Decade
Young-Eui Shin
37 papers receiving 365 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 329
- Mechanical Engineering 222
- Mechanics of Materials 60
- Aerospace Engineering 59
- Biomedical Engineering 22
Countries citing papers authored by Young-Eui Shin
This map shows the geographic impact of Young-Eui Shin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Young-Eui Shin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Young-Eui Shin more than expected).
Fields of papers citing papers by Young-Eui Shin
This network shows the impact of papers produced by Young-Eui Shin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Young-Eui Shin. The network helps show where Young-Eui Shin may publish in the future.
Co-authorship network of co-authors of Young-Eui Shin
This figure shows the co-authorship network connecting the top 25 collaborators of Young-Eui Shin. A scholar is included among the top collaborators of Young-Eui Shin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Young-Eui Shin. Young-Eui Shin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Title | Journal | Authors | Indexed citations |
|---|---|---|---|---|
| 1 | Bonding Strengths and Thermal Degradation of Photovoltaic Module Ribbon Solder Joints | International Journal of Precision Engineering and Manufacturing-Green Technology | Min-Soo Kang, Young-Eui Shin et al. | 0 |
| 2 | The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints | Materials | Min-Soo Kang, Sung Hyun Kim et al. | 7 |
| 3 | Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs) | Microelectronics Reliability | Byung-Seung Yim, Young-Eui Shin et al. | 3 |
| 4 | Bonding Characteristics of Underfilled Ball Grid Array Packaging | MATERIALS TRANSACTIONS | Byung-Seung Yim, Young-Eui Shin et al. | 1 |
| 5 | Evaluation of the characteristics of 305SAC lead-free solder joints between a chip electrode and a Cu-pad in automotive electronics | International Journal of Precision Engineering and Manufacturing | Min-Soo Kang, Sung Hyun Kim et al. | 7 |
| 6 | An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler | Microelectronics Reliability | Byung-Seung Yim, Young-Eui Shin et al. | 6 |
| 7 | Characterization of Ag-Pd Nanocomposite Paste for Electrochemical Migration Resistance | Journal of Nanoscience and Nanotechnology | Kwang‐Seok Kim, Kwang‐Ho Jung et al. | 7 |
| 8 | The Study on the Long-term Reliability Characteristics by Solar Cell Ribbon Thickness | Journal of Energy Engineering | Min-Soo Kang, Young-Eui Shin et al. | 0 |
| 9 | Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers | MATERIALS TRANSACTIONS | Byung-Seung Yim, Yuseon Heo et al. | 8 |
| 10 | A Study on the Fracture Mode Characteristics of Automotive Application Component Lead-free Solder Joints | Transactions of Korean Society of Automotive Engineers | Sung Hyun Kim, Young-Eui Shin et al. | 3 |
| 11 | Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding | MATERIALS TRANSACTIONS | Jong‐Min Kim, Yingwei Song et al. | 4 |
| 12 | Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy | The Journal of Adhesion | Jong‐Min Kim, Young-Eui Shin et al. | 1 |
| 13 | Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive) | MATERIALS TRANSACTIONS | Byung-Seung Yim, Jong‐Min Kim et al. | 7 |
| 14 | Reliability of Sn-8Zn-3Bi Solder Paste Applied to Lead and Lead-free Plating on Lead-frame under Thermal Shock Test | Journal of the Microelectronics and Packaging Society | Young-Eui Shin et al. | 0 |
| 15 | Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method | Microelectronic Engineering | Dae‐Gon Kim, Jong‐Woong Kim et al. | 7 |
| 16 | Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill | MATERIALS TRANSACTIONS | Jong‐Min Kim, Dave F. Farson et al. | 7 |
| 17 | 3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material | IEICE Transactions on Electronics | Jong‐Min Kim, Kiyokazu Yasuda et al. | 3 |
| 18 | Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder | MATERIALS TRANSACTIONS | Chang‐Bae Lee, Seung‐Boo Jung et al. | 77 |
| 19 | Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis | MATERIALS TRANSACTIONS | Young-Eui Shin, Kyung-Woo Lee et al. | 9 |
| 20 | The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders | MATERIALS TRANSACTIONS | Chang‐Bae Lee, Seung‐Boo Jung et al. | 58 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.