Shenghao Yang

768 total citations
21 papers, 605 citations indexed

About

Shenghao Yang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Shenghao Yang has authored 21 papers receiving a total of 605 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 6 papers in Materials Chemistry. Recurrent topics in Shenghao Yang's work include Intermetallics and Advanced Alloy Properties (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and 3D IC and TSV technologies (5 papers). Shenghao Yang is often cited by papers focused on Intermetallics and Advanced Alloy Properties (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and 3D IC and TSV technologies (5 papers). Shenghao Yang collaborates with scholars based in Taiwan, United States and China. Shenghao Yang's co-authors include C. R. Kao, Cheng–En Ho, Don Son Jiang, Mong‐Hsun Tsai, Chia-Wei Chang, Yi-Wun Wang, Min‐Yeh Tsai, J. D. White, Thong Leng Lim and Kang‐Yung Peng and has published in prestigious journals such as Physical review. B, Condensed matter, Applied Physics Letters and Journal of Alloys and Compounds.

In The Last Decade

Shenghao Yang

19 papers receiving 588 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Shenghao Yang Taiwan	10	519	396	87	57	52	21	605
Choong-Un Kim United States	12	382 0.7×	135 0.3×	111 1.3×	33 0.6×	108 2.1×	29	460
Jun‐Mo Yang South Korea	9	258 0.5×	64 0.2×	129 1.5×	27 0.5×	61 1.2×	54	348
W.W. So United States	8	195 0.4×	78 0.2×	131 1.5×	8 0.1×	39 0.8×	16	338
Rafi Ud Din Pakistan	11	133 0.3×	115 0.3×	128 1.5×	29 0.5×	57 1.1×	45	346
Jong Tae Park South Korea	14	406 0.8×	69 0.2×	178 2.0×	24 0.4×	86 1.7×	69	515
Chunxiao Xie China	13	86 0.2×	329 0.8×	259 3.0×	161 2.8×	97 1.9×	31	455
Yifeng Gu China	14	248 0.5×	110 0.3×	343 3.9×	24 0.4×	59 1.1×	32	439
E. Sugawara Japan	9	170 0.3×	100 0.3×	84 1.0×	89 1.6×	264 5.1×	24	369
Shang Peng China	11	265 0.5×	62 0.2×	366 4.2×	16 0.3×	44 0.8×	29	461
Doo‐Jin Choi South Korea	11	347 0.7×	66 0.2×	291 3.3×	20 0.4×	88 1.7×	42	533

Countries citing papers authored by Shenghao Yang

Since Specialization

Citations

This map shows the geographic impact of Shenghao Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shenghao Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shenghao Yang more than expected).

Fields of papers citing papers by Shenghao Yang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Shenghao Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shenghao Yang. The network helps show where Shenghao Yang may publish in the future.

Co-authorship network of co-authors of Shenghao Yang

This figure shows the co-authorship network connecting the top 25 collaborators of Shenghao Yang. A scholar is included among the top collaborators of Shenghao Yang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shenghao Yang. Shenghao Yang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Liu, Tingting, et al.. (2025). Influence of crack initiation competition and interaction of cross flaw on the dynamic fracture behavior of granite under biaxial compression. Theoretical and Applied Fracture Mechanics. 136. 104850–104850. 1 indexed citations

Yang, Shenghao, Renai Jiang, Zhujia Yin, & Chun‐Ping Chang. (2025). Does corporate perception influence radical innovation in China?. Asian Journal of Technology Innovation. 33(3). 1158–1186. 6 indexed citations

Liu, Tingting, et al.. (2025). Effects of Stress States and Joint Configurations on Dynamic Mechanical Properties of Rock Masses. Materials. 18(8). 1699–1699.

Ren, Shangjie, et al.. (2025). Macroprudential policy, financial risk and innovation: Cross country evidence. Pacific-Basin Finance Journal. 91. 102749–102749. 1 indexed citations

Yang, Shenghao, et al.. (2021). Targeted pandemic containment through identifying local contact network bottlenecks. PLoS Computational Biology. 17(8). e1009351–e1009351. 6 indexed citations

Demmel, James, et al.. (2021). Parallel and Communication Avoiding Least Angle Regression. SIAM Journal on Scientific Computing. 43(2). C154–C176. 1 indexed citations

Shiue, Ren-Kae, S.K. Wu, Shenghao Yang, & Chun-Kai Liu. (2017). Infrared Dissimilar Joining of Ti50Ni50 and 316L Stainless Steel with Copper Barrier Layer in between Two Silver-Based Fillers. Metals. 7(7). 276–276. 4 indexed citations

Shiue, Ren-Kae, S.K. Wu, & Shenghao Yang. (2016). Infrared Brazing of Ti50Ni50 Shape Memory Alloy and Inconel 600 Alloy with Two Ag-Cu-Ti Active Braze Alloys. Metallurgical and Materials Transactions A. 48(2). 735–744. 9 indexed citations

Shiue, Ren-Kae, et al.. (2015). Infrared brazing of Ti50Ni50 shape memory alloy and 316L stainless steel with Au-22Ni-8Pd filler. Gold bulletin. 48(1-2). 57–62. 4 indexed citations

10.

Xu, Lei, Yan‐Li Shi, & Shenghao Yang. (2014). Compressive Strength of Cold-Formed Steel C-shape Columns with Slotted Holes. 8 indexed citations

11.

Yang, Shenghao, Chia-Wei Chang, Mong‐Hsun Tsai, & C. R. Kao. (2010). Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni. Journal of Alloys and Compounds. 499(2). 149–153. 45 indexed citations

12.

Yang, Shenghao, et al.. (2010). Uncovering the driving force for massive spalling in the Sn–Cu/Ni system. Scripta Materialia. 63(1). 47–49. 28 indexed citations

13.

Tsai, Min‐Yeh, Shenghao Yang, Yi-Wun Wang, & C. R. Kao. (2010). Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn–Zn systems. Journal of Alloys and Compounds. 494(1-2). 123–127. 25 indexed citations

14.

Yang, Shenghao, Yi-Wun Wang, Chia-Wei Chang, & C. R. Kao. (2008). Analysis and Experimental Verification of the Volume Effect in the Reaction Between Zn-Doped Solders and Cu. Journal of Electronic Materials. 37(10). 1591–1597. 19 indexed citations

15.

Ray, S. C., H. M. Tsai, C. W. Pao, et al.. (2007). Size dependence of the electronic structures and electron-phonon coupling in ZnO quantum dots. Applied Physics Letters. 91(26). 16 indexed citations

16.

Ho, Cheng–En, et al.. (2006). Effects of limited cu supply on soldering reactions between SnAgCu and Ni. Journal of Electronic Materials. 35(5). 1017–1024. 121 indexed citations

17.

Ho, Cheng–En, Shenghao Yang, & C. R. Kao. (2006). Interfacial reaction issues for lead-free electronic solders. Journal of Materials Science Materials in Electronics. 18(1-3). 155–174. 242 indexed citations

18.

Pao, C. W., H. M. Tsai, J. W. Chiou, et al.. (2006). Electronic structures of group-III–nitride nanorods studied by x-ray absorption, x-ray emission, and Raman spectroscopy. Applied Physics Letters. 88(22). 19 indexed citations

19.

Chandrasekhar, M, Shenghao Yang, S. Guha, et al.. (2001). Optical transitions in para-phenylenes under hydrostatic pressure. Synthetic Metals. 119(1-3). 657–658. 1 indexed citations

20.

Guha, S., et al.. (1999). Optical Properties of Poly(Para-Phenylenes) under High Pressure. physica status solidi (b). 211(1). 177–188. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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