Shenghao Yang
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 5%
- Materials Chemistry
- Aerospace Engineering
- Electronic, Optical and Magnetic Materials
- Co-authors
- C. R. KaoCheng–En HoDon Son JiangMong‐Hsun TsaiChia-Wei ChangYi-Wun WangMin‐Yeh TsaiRen-Kae Shiue
- Topics
- Intermetallics and Advanced Alloy Properties (7 papers)Electronic Packaging and Soldering Technologies (6 papers)3D IC and TSV technologies (5 papers)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Shenghao Yang
19 papers receiving 588 citations
Peers
Comparison fields: 5 of 53
- Electrical and Electronic Engineering 519
- Mechanical Engineering 396
- Materials Chemistry 87
- Aerospace Engineering 57
- Electronic, Optical and Magnetic Materials 52
Countries citing papers authored by Shenghao Yang
This map shows the geographic impact of Shenghao Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shenghao Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shenghao Yang more than expected).
Fields of papers citing papers by Shenghao Yang
This network shows the impact of papers produced by Shenghao Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shenghao Yang. The network helps show where Shenghao Yang may publish in the future.
Co-authorship network of co-authors of Shenghao Yang
This figure shows the co-authorship network connecting the top 25 collaborators of Shenghao Yang. A scholar is included among the top collaborators of Shenghao Yang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shenghao Yang. Shenghao Yang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 6 | |
| 3 | 1 | |
| 4 | 0 | |
| 5 | 6 | |
| 6 | 1 | |
| 7 | 4 | |
| 8 | 9 | |
| 9 | 4 | |
| 10 | Compressive Strength of Cold-Formed Steel C-shape Columns with Slotted Holes | 8 |
| 11 | 45 | |
| 12 | 25 | |
| 13 | 28 | |
| 14 | 19 | |
| 15 | 16 | |
| 16 | 242 | |
| 17 | 121 | |
| 18 | 19 | |
| 19 | 1 | |
| 20 | 10 |
About Shenghao Yang
Shenghao Yang is a scholar working on Mechanical Engineering, Modeling and Simulation and Numerical Analysis, having authored 21 papers that have together received 605 indexed citations. Recurring topics across this work include Intermetallics and Advanced Alloy Properties (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and 3D IC and TSV technologies (5 papers). The work is most often cited by research in Mechanical Engineering (396 citations), General Materials Science (31 citations) and Electrical and Electronic Engineering (519 citations). Shenghao Yang has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include C. R. Kao, Cheng–En Ho, Don Son Jiang, Mong‐Hsun Tsai, Chia-Wei Chang, Yi-Wun Wang, Min‐Yeh Tsai, Ren-Kae Shiue, S. A. Chen and Kang‐Yung Peng. Their work appears in journals such as Physical review. B, Condensed matter, Applied Physics Letters and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.