C. R. Kao

7.6k total citations
259 papers, 6.4k citations indexed

About

C. R. Kao is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, C. R. Kao has authored 259 papers receiving a total of 6.4k indexed citations (citations by other indexed papers that have themselves been cited), including 218 papers in Electrical and Electronic Engineering, 122 papers in Mechanical Engineering and 36 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in C. R. Kao's work include Electronic Packaging and Soldering Technologies (194 papers), 3D IC and TSV technologies (151 papers) and Intermetallics and Advanced Alloy Properties (53 papers). C. R. Kao is often cited by papers focused on Electronic Packaging and Soldering Technologies (194 papers), 3D IC and TSV technologies (151 papers) and Intermetallics and Advanced Alloy Properties (53 papers). C. R. Kao collaborates with scholars based in Taiwan, United States and Japan. C. R. Kao's co-authors include Cheng–En Ho, Yi-Wun Wang, Y. L. Lin, Yan‐Cheng Lin, Shenghao Yang, Cheng‐Hsien Tsai, Yu Hu, Y. A. Chang, W. T. Chen and Jang‐Zern Tsai and has published in prestigious journals such as Advanced Materials, The Journal of Chemical Physics and Applied Physics Letters.

In The Last Decade

C. R. Kao

247 papers receiving 6.2k citations

Peers

C. R. Kao

EEE

EOMM

Kwang‐Lung Lin Taiwan

Sinn-wen Chen Taiwan

Tung‐Han Chuang Taiwan

Jeong‐Won Yoon South Korea

Cheng–En Ho Taiwan

W. Gąsior Poland

Kazuhiro Ito Japan

Shih‐kang Lin Taiwan

I. Dutta United States

Susumu Arai Japan

Kwang‐Lung Lin Taiwan

C. R. Kao

3.3k ×0.6

EEE

2.1k ×0.5

505 ×0.6

EOMM

705 ×1.1

500 ×0.9

Citations per year, relative to C. R. Kao C. R. Kao (= 1×) peers Kwang‐Lung Lin

Countries citing papers authored by C. R. Kao

Since Specialization

Citations

This map shows the geographic impact of C. R. Kao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. R. Kao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. R. Kao more than expected).

Fields of papers citing papers by C. R. Kao

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. R. Kao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. R. Kao. The network helps show where C. R. Kao may publish in the future.

Co-authorship network of co-authors of C. R. Kao

This figure shows the co-authorship network connecting the top 25 collaborators of C. R. Kao. A scholar is included among the top collaborators of C. R. Kao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. R. Kao. C. R. Kao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Huang, J.H., Vengudusamy Renganathan, Ming H. Hsieh, et al.. (2025). Improvement of bonding interface in electroless copper-plated joints using a high copper concentration copper–quadrol complex solution. Materials Science in Semiconductor Processing. 194. 109601–109601.

Kao, C. R., et al.. (2024). Diffusion and marker experiments for the newly discovered CuIn2 compound. Materials Characterization. 217. 114316–114316.

Chang, Chung‐Kai, et al.. (2024). Low-temperature phase equilibria of the ternary Cu-In-Sn system at In-rich corner. Materialia. 36. 102154–102154.

Kao, C. R., et al.. (2024). Experimental and thermodynamic assessment of the Cu–In system. Calphad. 85. 102700–102700. 3 indexed citations

Renganathan, Vengudusamy, Loganathan Veeramuthu, Yu‐Chen Wang, et al.. (2024). Synergistic effects of size-confined mxene nanosheets in self-powered sustainable smart textiles for environmental remediation. Nano Energy. 133. 110426–110426. 12 indexed citations

Renganathan, Vengudusamy, et al.. (2024). Sonochemical Assisted Europium(III) Oxide–Graphitic-Carbon Nitride Nanocomposite for Reversible Electrochemical Detection of Quinol. Journal of The Electrochemical Society. 171(9). 97520–97520. 2 indexed citations

Renganathan, Vengudusamy, et al.. (2024). Facile stoichiometric interfacial surface bonded cerium oxide and graphene oxide heterostructure for efficient electrochemical non-enzymatic detection of dopamine. Journal of Materials Chemistry B. 12(39). 9979–9990. 2 indexed citations

Kao, C. R., et al.. (2023). Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate. Materials. 16(18). 6263–6263. 3 indexed citations

Ishikawa, Dai, et al.. (2023). Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging. 97–98.

10.

Tatsumi, Hiroaki, C. R. Kao, & Hiroshi Nishikawa. (2023). Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations. Scientific Reports. 13(1). 23030–23030. 18 indexed citations

11.

Huang, J.H., Vengudusamy Renganathan, Chin‐Li Kao, et al.. (2023). A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging. 1660–1663. 1 indexed citations

12.

Huang, Weichen, et al.. (2022). Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps. Materials. 15(12). 4297–4297. 3 indexed citations

13.

Bickel, Steffen, et al.. (2022). Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization. Journal of Materials Research and Technology. 19. 2510–2515. 6 indexed citations

14.

Huang, Weichen, et al.. (2022). Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices. Materials. 15(4). 1397–1397. 9 indexed citations

15.

Huang, J.H., et al.. (2022). Numerical fluidic-chemical multi-physics simulation of a mass production model for electroless plating of fine-pitch interconnections in a microchannel for chip packaging applications. 644–649. 2 indexed citations

16.

Lee, Pei-Tzu, et al.. (2020). Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing. Journal of Materials Research and Technology. 9(6). 12946–12954. 14 indexed citations

17.

Yang, Tilo H., C. R. Kao, & Akitsu Shigetou. (2019). Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface. Scientific Reports. 9(1). 504–504. 7 indexed citations

18.

Wu, Jiaqi, et al.. (2018). Analyses and design for electrochemical migration suppression by alloying indium into silver. Journal of Materials Science Materials in Electronics. 29(16). 13878–13888. 19 indexed citations

19.

Kao, C. R., et al.. (2018). Microstructure Evolution of Cu/In/Cu Joints After Solid-Liquid Interdiffusion. 890–895. 1 indexed citations

20.

Ho, Cheng–En, et al.. (2003). Chemical Reaction in Solder Joints of Microelectronic Packages. Journal of The Chinese Institute of Chemical Engineers. 34(4). 387–391. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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