C. R. Kao

7.6k total citations
259 papers, 6.4k citations indexed

About

C. R. Kao is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, C. R. Kao has authored 259 papers receiving a total of 6.4k indexed citations (citations by other indexed papers that have themselves been cited), including 218 papers in Electrical and Electronic Engineering, 122 papers in Mechanical Engineering and 36 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in C. R. Kao's work include Electronic Packaging and Soldering Technologies (194 papers), 3D IC and TSV technologies (151 papers) and Intermetallics and Advanced Alloy Properties (53 papers). C. R. Kao is often cited by papers focused on Electronic Packaging and Soldering Technologies (194 papers), 3D IC and TSV technologies (151 papers) and Intermetallics and Advanced Alloy Properties (53 papers). C. R. Kao collaborates with scholars based in Taiwan, United States and Japan. C. R. Kao's co-authors include Cheng–En Ho, Yi-Wun Wang, Y. L. Lin, Yan‐Cheng Lin, Shenghao Yang, Cheng‐Hsien Tsai, Yu Hu, Y. A. Chang, W. T. Chen and Jang‐Zern Tsai and has published in prestigious journals such as Advanced Materials, The Journal of Chemical Physics and Applied Physics Letters.

In The Last Decade

C. R. Kao

247 papers receiving 6.2k citations

Peers

Countries citing papers authored by C. R. Kao

Since Specialization

Citations

This map shows the geographic impact of C. R. Kao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. R. Kao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. R. Kao more than expected).

Fields of papers citing papers by C. R. Kao

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. R. Kao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. R. Kao. The network helps show where C. R. Kao may publish in the future.

Co-authorship network of co-authors of C. R. Kao

This figure shows the co-authorship network connecting the top 25 collaborators of C. R. Kao. A scholar is included among the top collaborators of C. R. Kao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. R. Kao. C. R. Kao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Improvement of bonding interface in electroless copper-plated joints using a high copper concentration copper–quadrol complex solution 2025 ·Materials Science in Semiconductor Processing ·J.H. Huang, (unknown), (unknown), Vengudusamy Renganathan, (unknown), Ming H. Hsieh, Chin-Li Kao, Yung‐Sheng Lin, (unknown), Andréa Micke Moreno, Tao Jiang, C. R. Kao	0
2	Diffusion and marker experiments for the newly discovered CuIn2 compound 2024 ·Materials Characterization ·(unknown), (unknown), (unknown), (unknown), C. R. Kao	0
3	Low-temperature phase equilibria of the ternary Cu-In-Sn system at In-rich corner 2024 ·Materialia ·(unknown), Chung‐Kai Chang, Su‐Ying Chien, C. R. Kao	0
4	Experimental and thermodynamic assessment of the Cu–In system 2024 ·Calphad ·(unknown), (unknown), (unknown), C. R. Kao	3
5	Synergistic effects of size-confined mxene nanosheets in self-powered sustainable smart textiles for environmental remediation 2024 ·Nano Energy ·(unknown), Vengudusamy Renganathan, Loganathan Veeramuthu, (unknown), Yu‐Chen Wang, Hyunjin Lee, Tao Zhou, C. R. Kao, Chi‐Ching Kuo	12
6	Sonochemical Assisted Europium(III) Oxide–Graphitic-Carbon Nitride Nanocomposite for Reversible Electrochemical Detection of Quinol 2024 ·Journal of The Electrochemical Society ·(unknown), Vengudusamy Renganathan, Shen‐Ming Chen, Yu-Hsin Lin, (unknown), C. R. Kao	2
7	Facile stoichiometric interfacial surface bonded cerium oxide and graphene oxide heterostructure for efficient electrochemical non-enzymatic detection of dopamine 2024 ·Journal of Materials Chemistry B ·(unknown), Vengudusamy Renganathan, Shen–Ming Chen, C. R. Kao	2
8	Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate 2023 ·Materials ·(unknown), (unknown), (unknown), (unknown), C. R. Kao	3
9	Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging 2023 ·(unknown), (unknown), Dai Ishikawa, C. R. Kao, Thomas Blank	0
10	Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations 2023 ·Scientific Reports ·Hiroaki Tatsumi, C. R. Kao, Hiroshi Nishikawa	18
11	A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging 2023 ·J.H. Huang, (unknown), (unknown), Vengudusamy Renganathan, (unknown), (unknown), Chin‐Li Kao, Yung‐Sheng Lin, (unknown), C. Chiang, C. R. Kao	1
12	Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps 2022 ·Materials ·(unknown), (unknown), (unknown), Weichen Huang, (unknown), C. R. Kao	3
13	Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization 2022 ·Journal of Materials Research and Technology ·(unknown), (unknown), (unknown), Steffen Bickel, (unknown), Iuliana Panchenko, Karlheinz Bock, C. R. Kao	6
14	Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices 2022 ·Materials ·(unknown), Weichen Huang, C. R. Kao	9
15	Numerical fluidic-chemical multi-physics simulation of a mass production model for electroless plating of fine-pitch interconnections in a microchannel for chip packaging applications 2022 ·(unknown), J.H. Huang, (unknown), Vengudusamy Renganathan, (unknown), (unknown), Tsao‐Cheng Huang, C.H. Chen, C. R. Kao	2
16	Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing 2020 ·Journal of Materials Research and Technology ·(unknown), Pei-Tzu Lee, (unknown), C. R. Kao	14
17	Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface 2019 ·Scientific Reports ·Tilo H. Yang, C. R. Kao, Akitsu Shigetou	7
18	Analyses and design for electrochemical migration suppression by alloying indium into silver 2018 ·Journal of Materials Science Materials in Electronics ·(unknown), Jiaqi Wu, (unknown), C. R. Kao	19
19	Microstructure Evolution of Cu/In/Cu Joints After Solid-Liquid Interdiffusion 2018 ·(unknown), C. R. Kao	1
20	Chemical Reaction in Solder Joints of Microelectronic Packages 2003 ·Journal of The Chinese Institute of Chemical Engineers ·Cheng–En Ho, Y. L. Lin, (unknown), C. R. Kao	7

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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