C. R. Kao
- Electrical and Electronic Engineering top 0.5%
- Mechanical Engineering top 0.2%
- Electronic, Optical and Magnetic Materials top 2%
- Materials Chemistry top 10%
- Aerospace Engineering top 2%
- Co-authors
- Cheng–En HoYi-Wun WangY. L. LinYan‐Cheng LinShenghao YangCheng‐Hsien TsaiYu HuY. A. Chang
- Topics
- Electronic Packaging and Soldering Technologies (194 papers)3D IC and TSV technologies (151 papers)Intermetallics and Advanced Alloy Properties (53 papers)
- Partner nations
- TaiwanUnited StatesJapan
In The Last Decade
C. R. Kao
247 papers receiving 6.2k citations
Peers
Comparison fields: 5 of 67
- Electrical and Electronic Engineering 5.6k
- Mechanical Engineering 4.0k
- Electronic, Optical and Magnetic Materials 915
- Materials Chemistry 622
- Aerospace Engineering 553
Countries citing papers authored by C. R. Kao
This map shows the geographic impact of C. R. Kao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. R. Kao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. R. Kao more than expected).
Fields of papers citing papers by C. R. Kao
This network shows the impact of papers produced by C. R. Kao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. R. Kao. The network helps show where C. R. Kao may publish in the future.
Co-authorship network of co-authors of C. R. Kao
This figure shows the co-authorship network connecting the top 25 collaborators of C. R. Kao. A scholar is included among the top collaborators of C. R. Kao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. R. Kao. C. R. Kao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 3 | |
| 5 | 12 | |
| 6 | 2 | |
| 7 | 2 | |
| 8 | 3 | |
| 9 | 0 | |
| 10 | 18 | |
| 11 | 1 | |
| 12 | 3 | |
| 13 | 6 | |
| 14 | 9 | |
| 15 | 2 | |
| 16 | 14 | |
| 17 | 7 | |
| 18 | 19 | |
| 19 | 1 | |
| 20 | 7 |
About C. R. Kao
C. R. Kao is a scholar working on General Materials Science, Electrical and Electronic Engineering and Mechanical Engineering, having authored 259 papers that have together received 6.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (194 papers), 3D IC and TSV technologies (151 papers) and Intermetallics and Advanced Alloy Properties (53 papers). The work is most often cited by research in General Materials Science (444 citations), Mechanical Engineering (4.0k citations) and Electrical and Electronic Engineering (5.6k citations). C. R. Kao has collaborated with scholars based in Taiwan, United States and Japan. Frequent co-authors include Cheng–En Ho, Yi-Wun Wang, Y. L. Lin, Yan‐Cheng Lin, Shenghao Yang, Cheng‐Hsien Tsai, Yu Hu, Y. A. Chang, W. T. Chen and Jang‐Zern Tsai. Their work appears in journals such as Advanced Materials, The Journal of Chemical Physics and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.