C.J. Hang

444 total citations
9 papers, 381 citations indexed

About

C.J. Hang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, C.J. Hang has authored 9 papers receiving a total of 381 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 3 papers in Mechanical Engineering and 2 papers in Mechanics of Materials. Recurrent topics in C.J. Hang's work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and Mechanical Behavior of Composites (2 papers). C.J. Hang is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and Mechanical Behavior of Composites (2 papers). C.J. Hang collaborates with scholars based in China, Canada and Qatar. C.J. Hang's co-authors include M. Mayer, Y. Zhou, Chunqing Wang, Yanhong Tian, I. Lum, John Persic, J.T. Moon, Dongdong Yang, Sangmoon Lee and Gaoxiang Ouyang and has published in prestigious journals such as Advanced Materials, Journal of Electronic Materials and Microelectronics Reliability.

In The Last Decade

C.J. Hang

9 papers receiving 347 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C.J. Hang China	8	280	223	69	56	55	9	381
Shuibao Liang China	9	213 0.8×	132 0.6×	56 0.8×	42 0.8×	71 1.3×	58	272
Don Son Jiang Taiwan	9	298 1.1×	210 0.9×	55 0.8×	30 0.5×	36 0.7×	36	359
Tamás Hurtony Hungary	13	363 1.3×	243 1.1×	50 0.7×	28 0.5×	39 0.7×	43	411
G.T. Galyon United States	9	424 1.5×	243 1.1×	72 1.0×	101 1.8×	77 1.4×	15	488
Jiwei Fan United States	12	176 0.6×	181 0.8×	61 0.9×	45 0.8×	156 2.8×	21	407
Chunjin Hang China	9	265 0.9×	207 0.9×	31 0.4×	25 0.4×	51 0.9×	22	317
J.T. Moon Canada	12	252 0.9×	165 0.7×	27 0.4×	41 0.7×	72 1.3×	18	341
Pilin Liu United States	8	332 1.2×	169 0.8×	31 0.4×	34 0.6×	76 1.4×	20	377
Masaki Kumagai Japan	7	178 0.6×	190 0.9×	78 1.1×	95 1.7×	69 1.3×	20	341

Countries citing papers authored by C.J. Hang

Since Specialization

Citations

This map shows the geographic impact of C.J. Hang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.J. Hang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.J. Hang more than expected).

Fields of papers citing papers by C.J. Hang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C.J. Hang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.J. Hang. The network helps show where C.J. Hang may publish in the future.

Co-authorship network of co-authors of C.J. Hang

This figure shows the co-authorship network connecting the top 25 collaborators of C.J. Hang. A scholar is included among the top collaborators of C.J. Hang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C.J. Hang. C.J. Hang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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9 of 9 papers shown

1.

Hang, C.J., Chao Zhang, Qing‐Fang Guan, et al.. (2024). Cellulose Nanofiber‐Supported Electrochemical Percolation of Capacitive Nanomaterials with 0D, 1D, and 2D Structures. Advanced Materials. 37(4). e2414904–e2414904. 11 indexed citations

2.

Hang, C.J., et al.. (2010). Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. Microelectronics Reliability. 51(1). 157–165. 26 indexed citations

3.

Lum, I., C.J. Hang, M. Mayer, & Y. Zhou. (2009). In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal. Journal of Electronic Materials. 38(5). 647–654. 13 indexed citations

4.

Hang, C.J., I. Lum, M. Mayer, et al.. (2009). Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force. Microelectronic Engineering. 86(10). 2094–2103. 32 indexed citations

5.

Hang, C.J., et al.. (2009). Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding. Journal of Materials Science Materials in Electronics. 20(11). 1144–1149. 21 indexed citations

6.

Hang, C.J., Chunqing Wang, Yanhong Tian, M. Mayer, & Y. Zhou. (2008). Microstructural study of copper free air balls in thermosonic wire bonding. Microelectronic Engineering. 85(8). 1815–1819. 34 indexed citations

7.

Hang, C.J., I. Lum, M. Mayer, et al.. (2008). Bonding wire characterization using automatic deformability measurement. Microelectronic Engineering. 85(8). 1795–1803. 25 indexed citations

8.

Hang, C.J., et al.. (2007). Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectronics Reliability. 48(3). 416–424. 213 indexed citations

9.

Hang, C.J., I. Lum, M. Mayer, et al.. (2007). On-Line Hardness Characterization of Novel 2-mil Copper Bonding Wires. 25–30. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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