Kunmo Chu

915 total citations
34 papers, 770 citations indexed

About

Kunmo Chu is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Biomedical Engineering. According to data from OpenAlex, Kunmo Chu has authored 34 papers receiving a total of 770 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 11 papers in Materials Chemistry and 9 papers in Biomedical Engineering. Recurrent topics in Kunmo Chu's work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Carbon Nanotubes in Composites (8 papers). Kunmo Chu is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Carbon Nanotubes in Composites (8 papers). Kunmo Chu collaborates with scholars based in South Korea, Germany and United States. Kunmo Chu's co-authors include Sung Hoon Park, Changyoul Moon, Yoonchul Sohn, Sang-Eui Lee, Dongouk Kim, Duk Young Jeon, Dong‐Min Kim, Sung-Chul Lee, Chan‐Moon Chung and Minwoo Park and has published in prestigious journals such as Advanced Functional Materials, Nanoscale and Optics Letters.

In The Last Decade

Kunmo Chu

33 papers receiving 756 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Kunmo Chu South Korea 13 360 333 261 183 183 34 770
Daewon Kim United States 8 205 0.6× 329 1.0× 219 0.8× 102 0.6× 68 0.4× 30 520
Zhenming Chu China 13 411 1.1× 380 1.1× 293 1.1× 151 0.8× 68 0.4× 36 799
Junyu Long China 8 259 0.7× 413 1.2× 163 0.6× 119 0.7× 81 0.4× 13 662
Jae-Boong Choi South Korea 11 324 0.9× 401 1.2× 351 1.3× 91 0.5× 131 0.7× 19 741
Meiling Yan China 13 145 0.4× 160 0.5× 220 0.8× 102 0.6× 171 0.9× 23 623
Jinyou Shao China 13 109 0.3× 161 0.5× 122 0.5× 70 0.4× 115 0.6× 27 448
Shijin Dong China 7 183 0.5× 401 1.2× 102 0.4× 137 0.7× 156 0.9× 12 642
Itai Y. Stein United States 17 87 0.2× 264 0.8× 500 1.9× 143 0.8× 148 0.8× 29 677

Countries citing papers authored by Kunmo Chu

Since Specialization
Citations

This map shows the geographic impact of Kunmo Chu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kunmo Chu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kunmo Chu more than expected).

Fields of papers citing papers by Kunmo Chu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kunmo Chu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kunmo Chu. The network helps show where Kunmo Chu may publish in the future.

Co-authorship network of co-authors of Kunmo Chu

This figure shows the co-authorship network connecting the top 25 collaborators of Kunmo Chu. A scholar is included among the top collaborators of Kunmo Chu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kunmo Chu. Kunmo Chu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Oh, Sang‐Ho, Kunmo Chu, & Byeong‐Joo Lee. (2022). Prediction of Interfacial Reaction Between Cu and In During Low-Temperature Soldering. Journal of Phase Equilibria and Diffusion. 43(6). 876–882. 1 indexed citations
2.
Ha, Ji‐Hwan, Kunmo Chu, & Sung Hoon Park. (2018). Electrical Properties of the Carbon-Nanotube Composites Film Under Extreme Temperature Condition. Journal of Nanoscience and Nanotechnology. 19(3). 1682–1685. 12 indexed citations
3.
Chu, Kunmo, et al.. (2018). Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition. Applied Surface Science. 453. 31–36. 3 indexed citations
4.
Cho, Yujin, Dong‐Min Kim, Inho Song, et al.. (2018). An Oligoimide Particle as a Pickering Emulsion Stabilizer. Polymers. 10(10). 1071–1071. 11 indexed citations
5.
Kim, Dongouk, et al.. (2017). Carbon Nanotube Nanocomposite Having Segregated Network Structure for Wearable Thermotherapy Application. IEEE Electron Device Letters. 38(10). 1489–1491. 8 indexed citations
6.
Chu, Kunmo, et al.. (2017). Effects of Ag addition and Ag 3 Sn formation on the mechanical reliability of Ni/Sn solder joints. Microelectronics Reliability. 75. 53–58. 7 indexed citations
7.
Chu, Kunmo, et al.. (2016). Resistance Complemented Carbon-Nanotube Composite for Laser Printer Fusers Element. IEEE Electron Device Letters. 37(9). 1204–1206. 2 indexed citations
8.
Chu, Kunmo, Yoonchul Sohn, & Changyoul Moon. (2015). A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding. Scripta Materialia. 109. 113–117. 102 indexed citations
9.
Chu, Kunmo, et al.. (2014). Smart conducting polymer composites having zero temperature coefficient of resistance. Nanoscale. 7(2). 471–478. 96 indexed citations
10.
Chu, Kunmo & Sung Hoon Park. (2014). Fabrication of a Hybrid Carbon-Based Composite for Flexible Heating Element With a Zero Temperature Coefficient of Resistance. IEEE Electron Device Letters. 36(1). 50–52. 17 indexed citations
11.
Chu, Kunmo, Sunghee Lee, & Changyoul Moon. (2014). The Characteristics of Cu/Sn/Cu and Ni/Sn/Ni Sandwich Solder Systems for Gold-free Wafer Bonding Technology. IMAPSource Proceedings. 2014(1). 593–597. 1 indexed citations
12.
Chu, Kunmo, Dongouk Kim, Yoonchul Sohn, et al.. (2013). Electrical and Thermal Properties of Carbon-Nanotube Composite for Flexible Electric Heating-Unit Applications. IEEE Electron Device Letters. 34(5). 668–670. 79 indexed citations
13.
Park, Sung Hoon, Paul Theilmann, Kunmo Chu, et al.. (2013). Design of multi-functional dual hole patterned carbon nanotube composites with superhydrophobicity and durability. Nano Research. 6(6). 389–398. 45 indexed citations
14.
Chu, Kunmo, et al.. (2013). Low temperature Si-Si, SiO2-SiO2 covalent bonding structures with thin siloxane layer. IMAPSource Proceedings. 2013(1). 424–428. 2 indexed citations
15.
Song, Inyong, et al.. (2012). Embrittlement study of electroplated nickel films by microindentation. Scripta Materialia. 67(11). 919–922. 4 indexed citations
16.
Lee, Sang-Eui, et al.. (2011). Low temperature reliability of carbon nanotube/silicone superhydrophobic coatings. IMAPSource Proceedings. 2011(1). 857–860. 1 indexed citations
17.
Jang, Ho Seong, Jong Hyuk Kang, Yu-Ho Won, Kunmo Chu, & Duk Young Jeon. (2008). Origin of the discrepancy between photoluminescence brightness of TAG:Ce and electroluminescence brightness of TAG:Ce-based white LED expected from phosphor brightness. Optics Letters. 33(18). 2140–2140. 16 indexed citations
18.
Lee, Jeong-Seop, et al.. (2008). Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development. Microelectronic Engineering. 85(7). 1577–1583. 36 indexed citations
19.
Chu, Kunmo, et al.. (2006). Optoelectronic and Microwave Transmission Characteristics of Indium Solder Bumps for Low-Temperature Flip-Chip Applications. IEEE Transactions on Advanced Packaging. 29(3). 409–414. 7 indexed citations
20.
Chu, Kunmo, Sung Hwan Hwang, Byung Sup Rho, et al.. (2005). Compact packaging of optical and electronic components for on-board optical interconnects. IEEE Transactions on Advanced Packaging. 28(1). 114–120. 21 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Daewon Kim Breakdown of academic impact, for papers by Zhenming Chu Breakdown of academic impact, for papers by Junyu Long Breakdown of academic impact, for papers by Jae-Boong Choi Breakdown of academic impact, for papers by Meiling Yan Breakdown of academic impact, for papers by Jinyou Shao Breakdown of academic impact, for papers by Shijin Dong Breakdown of academic impact, for papers by Itai Y. Stein
Rankless by CCL
2026