Kunmo Chu
Impact in
- Nuclear Energy and Engineering top 10%
- Polymers and Plastics top 10%
- Conducting polymers and applications
Papers in
-
- Electronic Packaging and Soldering Technologies 15
- 3D IC and TSV technologies 11
- Semiconductor Lasers and Optical Devices 6
-
- Carbon Nanotubes in Composites 8
- Co-authors
- Sung Hoon Park (14 shared papers)Changyoul Moon (5 shared papers)Yoonchul Sohn (7 shared papers)Sang-Eui Lee (5 shared papers)Dongouk Kim (6 shared papers)Duk Young Jeon (9 shared papers)Sung-Chul Lee (1 shared paper)Dong‐Min Kim (2 shared papers)
- Journals
- IEEE Electron Device Letters (4 papers)IEEE Transactions on Advanced Packaging (3 papers)Organic Electronics (2 papers)Scripta Materialia (2 papers)Journal of Materials Science Materials in Electronics (2 papers)
- Partner nations
- South KoreaGermanyUnited States
In The Last Decade
Kunmo Chu
33 papers receiving 756 citations
Peers
Comparison fields: 5 of 60
- Nuclear Energy and Engineering 6
- Polymers and Plastics 183
- Surfaces, Coatings and Films 57
- Biomedical Engineering 333
- Electrical and Electronic Engineering 360
Countries citing papers authored by Kunmo Chu
This map shows the geographic impact of Kunmo Chu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kunmo Chu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kunmo Chu more than expected).
Fields of papers citing papers by Kunmo Chu
This network shows the impact of papers produced by Kunmo Chu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kunmo Chu. The network helps show where Kunmo Chu may publish in the future.
Co-authors
The 25 scholars most cited alongside Kunmo Chu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 34 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 105 | |
| 2 | 2015 | 102 | |
| 3 | 2014 | 96 | |
| 4 | 2013 | 79 | |
| 5 | 2014 | 55 | |
| 6 | 2013 | 45 | |
| 7 | 2015 | 43 | |
| 8 | 2008 | 36 | |
| 9 | 2019 | 23 | |
| 10 | 2016 | 22 | |
| 11 | 2005 | 21 | |
| 12 | 2014 | 17 | |
| 13 | 2008 | 16 | |
| 14 | 2018 | 12 | |
| 15 | 2018 | 11 | |
| 16 | 2007 | 10 | |
| 17 | 2004 | 10 | |
| 18 | 2004 | 9 | |
| 19 | 2017 | 8 | |
| 20 | 2006 | 7 |
About Kunmo Chu
Kunmo Chu is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Biomedical Engineering, Mechanical Engineering and Polymers and Plastics, having authored 34 papers that have together received 770 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers), Carbon Nanotubes in Composites (8 papers), Advanced Sensor and Energy Harvesting Materials (7 papers), Semiconductor Lasers and Optical Devices (6 papers), Advanced Welding Techniques Analysis (5 papers), Smart Materials for Construction (4 papers) and Conducting polymers and applications (3 papers). The work is most often cited by research in Nuclear Energy and Engineering (6 citations), Polymers and Plastics (183 citations), Surfaces, Coatings and Films (57 citations), Biomedical Engineering (333 citations) and Electrical and Electronic Engineering (360 citations). Kunmo Chu has collaborated with scholars based in South Korea, Germany and United States. Frequent co-authors include Sung Hoon Park, Changyoul Moon, Yoonchul Sohn, Sang-Eui Lee, Dongouk Kim, Duk Young Jeon, Sung-Chul Lee, Dong‐Min Kim, Chan‐Moon Chung and Byong Gwon Song. Their work appears in journals such as IEEE Electron Device Letters, IEEE Transactions on Advanced Packaging, Organic Electronics, Scripta Materialia and Journal of Materials Science Materials in Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.