Michael Toepper

449 total citations
31 papers, 305 citations indexed

About

Michael Toepper is a scholar working on Electrical and Electronic Engineering, Cellular and Molecular Neuroscience and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Michael Toepper has authored 31 papers receiving a total of 305 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 5 papers in Cellular and Molecular Neuroscience and 5 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Michael Toepper's work include 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (13 papers) and Semiconductor materials and devices (6 papers). Michael Toepper is often cited by papers focused on 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (13 papers) and Semiconductor materials and devices (6 papers). Michael Toepper collaborates with scholars based in Germany, United States and France. Michael Toepper's co-authors include Florian Solzbacher, Matthias Klein, Sohee Kim, Prashant Tathireddy, Hermann Oppermann, Rajmohan Bhandari, Sandeep Negi, Loren Rieth, Kai Zoschke and O. Ehrmann and has published in prestigious journals such as Sensors and Actuators A Physical, Biomedical Microdevices and Journal of Physics Conference Series.

In The Last Decade

Michael Toepper

30 papers receiving 292 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Michael Toepper Germany 8 236 133 97 81 25 31 305
Fatima Alrashdan United States 9 193 0.8× 149 1.1× 202 2.1× 36 0.4× 33 1.3× 15 372
Eunseong Moon United States 10 240 1.0× 97 0.7× 133 1.4× 27 0.3× 24 1.0× 19 313
Sweety Deswal India 6 162 0.7× 69 0.5× 238 2.5× 139 1.7× 83 3.3× 9 357
Yan Gong China 8 174 0.7× 185 1.4× 126 1.3× 58 0.7× 46 1.8× 24 317
Max Eickenscheidt Germany 10 207 0.9× 321 2.4× 73 0.8× 166 2.0× 41 1.6× 20 391
Jeong Hoan Park South Korea 14 280 1.2× 190 1.4× 305 3.1× 91 1.1× 29 1.2× 34 473
Ho‐Kun Sung South Korea 9 109 0.5× 42 0.3× 161 1.7× 107 1.3× 43 1.7× 27 295
Jokubas Ausra United States 4 83 0.4× 193 1.5× 223 2.3× 42 0.5× 37 1.5× 4 320
J. F. Ribeiro Portugal 11 205 0.9× 181 1.4× 115 1.2× 74 0.9× 22 0.9× 53 433
Willyan Hasenkamp Switzerland 9 215 0.9× 67 0.5× 245 2.5× 32 0.4× 35 1.4× 15 388

Countries citing papers authored by Michael Toepper

Since Specialization
Citations

This map shows the geographic impact of Michael Toepper's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Toepper with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Toepper more than expected).

Fields of papers citing papers by Michael Toepper

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Michael Toepper. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Toepper. The network helps show where Michael Toepper may publish in the future.

Co-authorship network of co-authors of Michael Toepper

This figure shows the co-authorship network connecting the top 25 collaborators of Michael Toepper. A scholar is included among the top collaborators of Michael Toepper based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Michael Toepper. Michael Toepper is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Braun, Tanja, Karl‐Friedrich Becker, R. Kahle, et al.. (2018). Fan-out wafer level packaging for 5G and mm-Wave applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 247–251. 16 indexed citations
2.
Hichri, Habib, et al.. (2017). Innovative Excimer Laser Dual Damascene Process for Ultra-Fine Line Multi-layer Routing with 10 µm Pitch Micro-Vias for Wafer Level and Panel Level Packaging. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 872–877. 7 indexed citations
3.
Letz, Martin, et al.. (2016). Ultra-thin glasses for semiconductor packaging. IMAPSource Proceedings. 2016(1). 293–298.
4.
Toepper, Michael, Tanja Braun, Martin Wilke, et al.. (2015). BCB-Based Dry Film low k Permanent Polymer with sub 4-μm Vias for Advanced WLP and FO-WLP Applications. IMAPSource Proceedings. 2015(1). 79–85. 1 indexed citations
5.
Wagner, Stefan, Katrin Hoeppner, Michael Toepper, Olaf Wittler, & Klaus‐Dieter Lang. (2014). A critical review of corrosion phenomena in microelectronic systems. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–7. 6 indexed citations
6.
Hoeppner, Katrin, Krystan Marquardt, Robert Hahn, et al.. (2013). Design, Fabrication and Testing of Silicon-integrated Li-ion Secondary Micro Batteries with Side-by-Side Electrodes. Journal of Physics Conference Series. 476. 12086–12086. 10 indexed citations
7.
Wunderle, Bernhard, Mohamad Abo Ras, D. May, et al.. (2013). Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 253–261. 7 indexed citations
8.
Ndip, Ivan, et al.. (2011). Low temperature glass-thin-films for use in power applications. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 255–261. 4 indexed citations
9.
Zoschke, Kai, et al.. (2011). Wafer-level glass-caps for advanced optical applications. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1642–1648. 5 indexed citations
10.
Zoschke, Kai, et al.. (2010). Anodic bonding at low voltage using microstructured borosilicate glass thin-films. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 6 indexed citations
11.
Toepper, Michael, et al.. (2010). Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 2316. 1–5. 1 indexed citations
12.
Fischer, Thorsten, et al.. (2009). Thin hermetic passivation of semiconductors using low temperature borosilicate glass - benchmark of a new wafer-level packaging technology. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 886–891. 2 indexed citations
13.
Kim, Sohee, Rajmohan Bhandari, Matthias Klein, et al.. (2008). Integrated wireless neural interface based on the Utah electrode array. Biomedical Microdevices. 11(2). 453–466. 113 indexed citations
14.
Jung, Erik, Andreas Ostmann, Peter Ramm, et al.. (2008). Through silicon vias as enablers for 3D systems. ArXiv.org. 3. 119–122. 3 indexed citations
15.
Manessis, Dionysios, et al.. (2007). Alternative UBM for Lead Free Solder Bumping using C4NP. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 15–21. 11 indexed citations
16.
Zoschke, Kai, J.K. Wolf, O. Ehrmann, Michael Toepper, & H. Reichl. (2007). Copper / Benzocyclobutene Multi Layer Wiring - A flexible base Technology for Wafer Level Integration of passive Components. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 295–302. 17 indexed citations
17.
Kim, Sohee, Oliver Scholz, Kai Zoschke, et al.. (2006). FEA Simulation of Thin Film Coils to Power Wireless Neural Interfaces. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1(2006). 705–708. 3 indexed citations
18.
Kim, Sohee, Kai Zoschke, Matthias Klein, et al.. (2006). Switchable polymer-based thin film coils as a power module for wireless neural interfaces. Sensors and Actuators A Physical. 136(1). 467–474. 26 indexed citations
19.
Pellet, Claude, et al.. (2005). Capacitive humidity sensors based on oxidized PhotoBCB polymer films: enhanced sensitivity and response time. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 203. 4 pp.–4 pp.. 4 indexed citations
20.
Oppermann, Hermann, et al.. (2005). Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps. MRS Proceedings. 863. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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