Yunhui Mei

3.4k total citations
172 papers, 2.7k citations indexed

About

Yunhui Mei is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Yunhui Mei has authored 172 papers receiving a total of 2.7k indexed citations (citations by other indexed papers that have themselves been cited), including 152 papers in Electrical and Electronic Engineering, 64 papers in Mechanical Engineering and 22 papers in Materials Chemistry. Recurrent topics in Yunhui Mei's work include Electronic Packaging and Soldering Technologies (94 papers), 3D IC and TSV technologies (59 papers) and Silicon Carbide Semiconductor Technologies (52 papers). Yunhui Mei is often cited by papers focused on Electronic Packaging and Soldering Technologies (94 papers), 3D IC and TSV technologies (59 papers) and Silicon Carbide Semiconductor Technologies (52 papers). Yunhui Mei collaborates with scholars based in China, United States and Malaysia. Yunhui Mei's co-authors include Guo‐Quan Lu, Xu Chen, Xin Li, Gang Chen, Xin Li, Meiyu Wang, Shancan Fu, Khai D. T. Ngo, Dimeji Ibitayo and Lei Wang and has published in prestigious journals such as SHILAP Revista de lepidopterología, IEEE Transactions on Power Electronics and Materials Science and Engineering A.

In The Last Decade

Yunhui Mei

161 papers receiving 2.6k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yunhui Mei China 30 2.2k 1.4k 381 276 233 172 2.7k
Chuantong Chen Japan 34 2.3k 1.1× 2.1k 1.5× 533 1.4× 360 1.3× 486 2.1× 199 3.5k
S.H. Mannan United Kingdom 23 1.7k 0.8× 1.4k 1.0× 260 0.7× 152 0.6× 310 1.3× 104 2.3k
Weibin Zhang China 22 688 0.3× 797 0.6× 646 1.7× 297 1.1× 210 0.9× 115 1.7k
Songbai Xue China 31 2.5k 1.2× 2.6k 1.9× 347 0.9× 181 0.7× 161 0.7× 181 3.4k
Y.C. Chan Hong Kong 30 2.2k 1.0× 1.2k 0.8× 271 0.7× 187 0.7× 301 1.3× 113 2.5k
Vesa Vuorinen Finland 24 2.6k 1.2× 2.1k 1.5× 357 0.9× 168 0.6× 171 0.7× 104 3.2k
Guna S Selvaduray United States 12 2.0k 0.9× 1.5k 1.0× 419 1.1× 99 0.4× 282 1.2× 33 2.5k
Hao Lü China 27 617 0.3× 1.7k 1.2× 702 1.8× 130 0.5× 457 2.0× 134 2.4k

Countries citing papers authored by Yunhui Mei

Since Specialization
Citations

This map shows the geographic impact of Yunhui Mei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yunhui Mei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yunhui Mei more than expected).

Fields of papers citing papers by Yunhui Mei

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yunhui Mei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yunhui Mei. The network helps show where Yunhui Mei may publish in the future.

Co-authorship network of co-authors of Yunhui Mei

This figure shows the co-authorship network connecting the top 25 collaborators of Yunhui Mei. A scholar is included among the top collaborators of Yunhui Mei based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yunhui Mei. Yunhui Mei is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, Bowen, Lijia Wang, Yiqing Liu, et al.. (2025). Pulsed electric current-assisted transient liquid phase sintering for extremely reliable Cu-Cu direct bonding. Materials Science and Engineering A. 943. 148766–148766.
2.
Wang, Qi, et al.. (2025). AD2T: Multivariate Time-Series Anomaly Detection With Association Discrepancy Dual-Decoder Transformer. IEEE Sensors Journal. 25(7). 11710–11721.
3.
Lu, H. Q., et al.. (2025). Heat-Pipe-Integrated Shielding for High-Frequency Transformers in Isolated DC–DC Converters: An Electromagnetic-Thermal Holistic Design. IEEE Transactions on Industry Applications. 62(1). 1704–1712.
4.
Zhang, Bowen, et al.. (2025). Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(4). 858–867. 1 indexed citations
5.
Wang, Meiyu, Peng Gao, F.G. Shi, et al.. (2024). Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(9). 1537–1550. 3 indexed citations
6.
Zhang, Bowen, Xinyan Lu, Haoxiang Ma, Di Wang, & Yunhui Mei. (2024). Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(1). 10–17. 5 indexed citations
7.
Mei, Yunhui, et al.. (2023). Insulation and Reliability Enhancement by a Nonlinear Conductive Polymer-Nanoparticle Coating for Packaging of High-Voltage Power Devices. IEEE Transactions on Dielectrics and Electrical Insulation. 30(6). 2514–2521. 15 indexed citations
8.
Wang, Meiyu, Yunhui Mei, Weibo Hu, Xin Li, & Guo‐Quan Lu. (2022). Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science. IEEE Journal of Emerging and Selected Topics in Power Electronics. 10(2). 2645–2655. 29 indexed citations
9.
Tan, Yansong, et al.. (2022). Feasibility Investigation and Characterization of Liquid Dispersant–Assisted Sintering of Silver to Bond Large‐Area Plates. Advanced Engineering Materials. 25(10). 3 indexed citations
10.
Li, Xin, et al.. (2021). A Novel Hermetic Sealing Method for the Metal Package Based on Electric-Current-Assisted Sintering of Silver Paste. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(5). 872–874. 4 indexed citations
11.
Mei, Yunhui, Meiyu Wang, Xin Li, et al.. (2021). Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(6). 983–989. 3 indexed citations
12.
Wang, Meiyu, et al.. (2021). Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging. IEEE Transactions on Power Electronics. 36(11). 12141–12145. 41 indexed citations
13.
Li, Xin, et al.. (2020). Large-Area Substrate Bonding With Single-Printing Silver Paste Sintering for Power Modules. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(1). 11–18. 17 indexed citations
14.
Ding, Chao, et al.. (2020). Heteromagnetic Swinging Inductor and Its Application for Power Factor Correction Converters. IEEE Transactions on Industry Applications. 56(5). 5292–5298. 1 indexed citations
15.
Mei, Yunhui, et al.. (2018). A Multichip Phase-Leg IGBT Module Using Nanosilver Paste by Pressureless Sintering in Formic Acid Atmosphere. IEEE Transactions on Electron Devices. 65(10). 4499–4505. 19 indexed citations
16.
Liu, Junchang, Yunhui Mei, Wen Liu, et al.. (2018). Effects of sintering temperature on properties of toroid cores using NiZnCu ferrites for power applications at >1 MHz. Journal of Magnetism and Magnetic Materials. 454. 6–12. 19 indexed citations
17.
Tan, Yansong, Xin Li, Xu Chen, Guo‐Quan Lu, & Yunhui Mei. (2017). Low-Pressure-Assisted Large-Area (>800 mm2) Sintered-Silver Bonding for High-Power Electronic Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(2). 202–209. 27 indexed citations
18.
Li, Xin, et al.. (2015). Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate. Microelectronics Reliability. 55(12). 2524–2531. 51 indexed citations
19.
Mei, Yunhui. (2004). A Study of Theory and Methods and Innovative Implementation in the New Period Land-use Planning Revision. 1 indexed citations
20.
Mei, Yunhui. (2002). STUDY ON SINGLE-POLE ADAPTIVE RECLOSURE BASED ON ANALYSIS OF VOLTAGE HARMONIC SIGNAL. Power System Technology. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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