Yunhui Mei
- Electrical and Electronic Engineering top 2%
- Mechanical Engineering top 1%
- Materials Chemistry top 10%
- Electronic, Optical and Magnetic Materials top 10%
- Mechanics of Materials top 5%
- Topics
- Electronic Packaging and Soldering Technologies (94 papers)3D IC and TSV technologies (59 papers)Silicon Carbide Semiconductor Technologies (52 papers)
- Journals
- SHILAP Revista de lepidopterologíaIEEE Transactions on Power ElectronicsMaterials Science and Engineering A
- Partner nations
- ChinaUnited StatesMalaysia
In The Last Decade
Yunhui Mei
161 papers receiving 2.6k citations
Peers
Comparison fields: 5 of 72
- Electrical and Electronic Engineering 2.2k
- Mechanical Engineering 1.4k
- Materials Chemistry 381
- Electronic, Optical and Magnetic Materials 276
- Mechanics of Materials 233
Countries citing papers authored by Yunhui Mei
This map shows the geographic impact of Yunhui Mei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yunhui Mei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yunhui Mei more than expected).
Fields of papers citing papers by Yunhui Mei
This network shows the impact of papers produced by Yunhui Mei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yunhui Mei. The network helps show where Yunhui Mei may publish in the future.
Co-authorship network of co-authors of Yunhui Mei
This figure shows the co-authorship network connecting the top 25 collaborators of Yunhui Mei. A scholar is included among the top collaborators of Yunhui Mei based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yunhui Mei. Yunhui Mei is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 1 | |
| 5 | 3 | |
| 6 | 5 | |
| 7 | 7 | |
| 8 | 15 | |
| 9 | 3 | |
| 10 | 29 | |
| 11 | 3 | |
| 12 | 4 | |
| 13 | 41 | |
| 14 | 3 | |
| 15 | 17 | |
| 16 | 9 | |
| 17 | 54 | |
| 18 | 19 | |
| 19 | 29 | |
| 20 | 51 |
About Yunhui Mei
Yunhui Mei is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Ceramics and Composites, having authored 172 papers that have together received 2.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (94 papers), 3D IC and TSV technologies (59 papers) and Silicon Carbide Semiconductor Technologies (52 papers). The work is most often cited by research in Mechanical Engineering (1.4k citations), Electrical and Electronic Engineering (2.2k citations) and Ceramics and Composites (179 citations). Yunhui Mei has collaborated with scholars based in China, United States and Malaysia. Frequent co-authors include Guo‐Quan Lu, Xu Chen, Xin Li, Gang Chen, Xin Li, Meiyu Wang, Shancan Fu, Khai D. T. Ngo, Dimeji Ibitayo and Shufang Luo. Their work appears in journals such as SHILAP Revista de lepidopterología, IEEE Transactions on Power Electronics and Materials Science and Engineering A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.