A.C.K. So

416 total citations
8 papers, 349 citations indexed

About

A.C.K. So is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Computational Mechanics. According to data from OpenAlex, A.C.K. So has authored 8 papers receiving a total of 349 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Mechanical Engineering, 6 papers in Electrical and Electronic Engineering and 2 papers in Computational Mechanics. Recurrent topics in A.C.K. So's work include Electronic Packaging and Soldering Technologies (6 papers), Intermetallics and Advanced Alloy Properties (4 papers) and 3D IC and TSV technologies (3 papers). A.C.K. So is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Intermetallics and Advanced Alloy Properties (4 papers) and 3D IC and TSV technologies (3 papers). A.C.K. So collaborates with scholars based in Hong Kong. A.C.K. So's co-authors include Y.C. Chan, J.K.L. Lai, Y. C. Chan, Y.C. Chan, P.L. Tu and Xing Dai and has published in prestigious journals such as Materials Science and Engineering B, Optics and Lasers in Engineering and IEEE Transactions on Components Packaging and Manufacturing Technology Part B.

In The Last Decade

A.C.K. So

8 papers receiving 339 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
A.C.K. So Hong Kong	7	331	249	50	21	18	8	349
P.L. Tu Hong Kong	10	510 1.5×	358 1.4×	66 1.3×	47 2.2×	42 2.3×	18	537
G.Y. Li Singapore	8	298 0.9×	261 1.0×	71 1.4×	36 1.7×	20 1.1×	12	352
Jong‐Kai Lin United States	12	381 1.2×	187 0.8×	33 0.7×	36 1.7×	19 1.1×	33	394
Kuo-Chuan Liu United States	11	333 1.0×	214 0.9×	52 1.0×	19 0.9×	11 0.6×	24	352
Tama Fouzder Bangladesh	9	403 1.2×	347 1.4×	54 1.1×	18 0.9×	19 1.1×	18	423
Sang-Won Kim South Korea	7	510 1.5×	430 1.7×	44 0.9×	18 0.9×	32 1.8×	11	517
Young-Doo Jeon South Korea	11	345 1.0×	180 0.7×	10 0.2×	26 1.2×	17 0.9×	18	359
Ranjit Pandher United States	8	291 0.9×	130 0.5×	54 1.1×	31 1.5×	14 0.8×	25	324
Luke Wentlent United States	13	414 1.3×	263 1.1×	125 2.5×	111 5.3×	13 0.7×	27	430

Countries citing papers authored by A.C.K. So

Since Specialization

Citations

This map shows the geographic impact of A.C.K. So's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A.C.K. So with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A.C.K. So more than expected).

Fields of papers citing papers by A.C.K. So

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A.C.K. So. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A.C.K. So. The network helps show where A.C.K. So may publish in the future.

Co-authorship network of co-authors of A.C.K. So

This figure shows the co-authorship network connecting the top 25 collaborators of A.C.K. So. A scholar is included among the top collaborators of A.C.K. So based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with A.C.K. So. A.C.K. So is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

8 of 8 papers shown

1.

Chan, Y.C., et al.. (2004). Characterization of Kovar-to-Kovar laser welded joints and its mechanical strength. Optics and Lasers in Engineering. 43(2). 151–162. 8 indexed citations

2.

So, A.C.K. & Y.C. Chan. (2002). Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints. 1164–1171. 8 indexed citations

3.

So, A.C.K. & Y.C. Chan. (2002). Reliability studies of surface mount, solder joints-effect of Cu-Sn intermetallic compounds. 1073–1080. 2 indexed citations

4.

Dai, Xing, Y.C. Chan, & A.C.K. So. (1999). Digital speckle correlation method based on wavelet-packet noise-reduction processing. Applied Optics. 38(16). 3474–3474. 6 indexed citations

5.

Chan, Y.C., A.C.K. So, & J.K.L. Lai. (1998). Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints. Materials Science and Engineering B. 55(1-2). 5–13. 140 indexed citations

6.

So, A.C.K., Y. C. Chan, & J.K.L. Lai. (1997). Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 20(2). 161–166. 53 indexed citations

7.

Chan, Y.C., P.L. Tu, A.C.K. So, & J.K.L. Lai. (1997). Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 20(4). 463–469. 58 indexed citations

8.

So, A.C.K. & Y.C. Chan. (1996). Reliability studies of surface mount solder joints - effect of Cu-Sn intermetallic compounds. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 19(3). 661–668. 74 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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