Fengshun Wu

1.8k total citations
119 papers, 1.4k citations indexed

About

Fengshun Wu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Fengshun Wu has authored 119 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 103 papers in Electrical and Electronic Engineering, 58 papers in Mechanical Engineering and 22 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Fengshun Wu's work include Electronic Packaging and Soldering Technologies (91 papers), 3D IC and TSV technologies (60 papers) and Aluminum Alloys Composites Properties (26 papers). Fengshun Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (91 papers), 3D IC and TSV technologies (60 papers) and Aluminum Alloys Composites Properties (26 papers). Fengshun Wu collaborates with scholars based in China, Hong Kong and United Kingdom. Fengshun Wu's co-authors include Y.C. Chan, Changqing Liu, Vadim V. Silberschmidt, Guang Chen, Ze Zhu, Bing An, Zheng Zhou, Huayu Sun, Bao Lu and Yan‐Cheong Chan and has published in prestigious journals such as Journal of Power Sources, Scientific Reports and Journal of Materials Chemistry A.

In The Last Decade

Fengshun Wu

115 papers receiving 1.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Fengshun Wu China 20 954 728 295 161 138 119 1.4k
Chao Huang China 22 532 0.6× 517 0.7× 453 1.5× 57 0.4× 140 1.0× 75 1.3k
Zhansheng Guo China 25 1.2k 1.2× 508 0.7× 345 1.2× 130 0.8× 178 1.3× 116 1.9k
Guoqing Zhang China 29 1.9k 2.0× 914 1.3× 484 1.6× 60 0.4× 261 1.9× 95 3.0k
Azman Jalar Malaysia 19 796 0.8× 352 0.5× 410 1.4× 52 0.3× 158 1.1× 158 1.3k
Zhilin Long China 20 256 0.3× 414 0.6× 418 1.4× 181 1.1× 104 0.8× 43 1.1k
Zechao Tao China 21 272 0.3× 574 0.8× 626 2.1× 143 0.9× 304 2.2× 54 1.3k
Wonsub Chung South Korea 19 324 0.3× 437 0.6× 653 2.2× 172 1.1× 51 0.4× 67 1.2k
Man Wang China 22 846 0.9× 212 0.3× 322 1.1× 77 0.5× 323 2.3× 61 1.3k
Paul Burke Canada 11 748 0.8× 328 0.5× 383 1.3× 102 0.6× 70 0.5× 17 1.2k
Mohd Arif Anuar Mohd Salleh Malaysia 19 720 0.8× 588 0.8× 225 0.8× 386 2.4× 44 0.3× 138 1.3k

Countries citing papers authored by Fengshun Wu

Since Specialization
Citations

This map shows the geographic impact of Fengshun Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fengshun Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fengshun Wu more than expected).

Fields of papers citing papers by Fengshun Wu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fengshun Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fengshun Wu. The network helps show where Fengshun Wu may publish in the future.

Co-authorship network of co-authors of Fengshun Wu

This figure shows the co-authorship network connecting the top 25 collaborators of Fengshun Wu. A scholar is included among the top collaborators of Fengshun Wu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fengshun Wu. Fengshun Wu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wu, Fengshun, et al.. (2024). Pt-on-CoNi alloy nanoparticles supported on N and P co-doped graphene catalyst for highly efficient hydrogen evolution by acidic water electrolysis. International Journal of Hydrogen Energy. 63. 1128–1136. 11 indexed citations
2.
Wu, Fengshun, et al.. (2024). N, P co-doped graphene-supported monometallic nanoparticles for highly efficient hydrogen evolution by acid electrolysis of water. Journal of Materials Chemistry A. 12(17). 10300–10306. 51 indexed citations
3.
Zhang, Hongjie, et al.. (2024). Analytical Study on the Warpage Deformation of Die Attach Structure in Power Devices. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(11). 1959–1967. 1 indexed citations
4.
Wu, Fengshun, Mingming Wang, Tiejun Liu, et al.. (2023). Increasing flexural strength of CO2 cured cement paste by CaCO3 polymorph control. Cement and Concrete Composites. 141. 105128–105128. 89 indexed citations
5.
6.
7.
8.
Zhu, Ze, Yan‐Cheong Chan, & Fengshun Wu. (2018). Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing. Microelectronics Reliability. 91. 179–182. 14 indexed citations
9.
10.
11.
Chen, Guang, Hao Peng, Vadim V. Silberschmidt, et al.. (2016). Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing. Journal of Alloys and Compounds. 685. 680–689. 66 indexed citations
12.
13.
Peng, Hao, et al.. (2016). An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints. Journal of Materials Science Materials in Electronics. 27(9). 9083–9093. 18 indexed citations
14.
Chen, Guang, et al.. (2016). An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder. Soldering and Surface Mount Technology. 28(2). 84–92. 12 indexed citations
15.
16.
Zhang, Jun, et al.. (2009). AL/NI multilayer used as a local heat source for mounting microelectronic components. 838–842. 13 indexed citations
17.
Jin, Peng, et al.. (2009). Effects of thermal aging on the electrical resistance of Sn-3.5Ag micro SOH solder joints. 1023–1026. 4 indexed citations
18.
19.
Wu, Fengshun, Li Chen, & Yiping Wu. (2005). [Superfine comminution of Glycyrrhiza uralensis roots by vibration mill].. PubMed. 30(3). 185–7. 1 indexed citations
20.
Wu, Fengshun, et al.. (2004). Effects of heating factors on the geometry size of unrestricted lead-free joints. 23. 81–85. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Chao Huang Breakdown of academic impact, for papers by Zhansheng Guo Breakdown of academic impact, for papers by Guoqing Zhang Breakdown of academic impact, for papers by Azman Jalar Breakdown of academic impact, for papers by Zhilin Long Breakdown of academic impact, for papers by Zechao Tao Breakdown of academic impact, for papers by Wonsub Chung Breakdown of academic impact, for papers by Man Wang Breakdown of academic impact, for papers by Paul Burke Breakdown of academic impact, for papers by Mohd Arif Anuar Mohd Salleh
Rankless by CCL
2026