Fengshun Wu
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 2%
- Materials Chemistry
- Civil and Structural Engineering top 10%
- Electronic, Optical and Magnetic Materials
- Topics
- Electronic Packaging and Soldering Technologies (91 papers)3D IC and TSV technologies (60 papers)Aluminum Alloys Composites Properties (26 papers)
- Partner nations
- ChinaHong KongUnited Kingdom
In The Last Decade
Fengshun Wu
115 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 59
- Electrical and Electronic Engineering 954
- Mechanical Engineering 728
- Materials Chemistry 295
- Civil and Structural Engineering 161
- Electronic, Optical and Magnetic Materials 138
Countries citing papers authored by Fengshun Wu
This map shows the geographic impact of Fengshun Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fengshun Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fengshun Wu more than expected).
Fields of papers citing papers by Fengshun Wu
This network shows the impact of papers produced by Fengshun Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fengshun Wu. The network helps show where Fengshun Wu may publish in the future.
Co-authorship network of co-authors of Fengshun Wu
This figure shows the co-authorship network connecting the top 25 collaborators of Fengshun Wu. A scholar is included among the top collaborators of Fengshun Wu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fengshun Wu. Fengshun Wu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 11 | |
| 2 | 51 | |
| 3 | 1 | |
| 4 | 89 | |
| 5 | 1 | |
| 6 | 1 | |
| 7 | 5 | |
| 8 | 14 | |
| 9 | 1 | |
| 10 | 3 | |
| 11 | 66 | |
| 12 | 1 | |
| 13 | 18 | |
| 14 | 12 | |
| 15 | 4 | |
| 16 | 13 | |
| 17 | 4 | |
| 18 | 8 | |
| 19 | [Superfine comminution of Glycyrrhiza uralensis roots by vibration mill]. | 1 |
| 20 | 4 |
About Fengshun Wu
Fengshun Wu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, having authored 119 papers that have together received 1.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (91 papers), 3D IC and TSV technologies (60 papers) and Aluminum Alloys Composites Properties (26 papers). The work is most often cited by research in Mechanical Engineering (728 citations), Electrical and Electronic Engineering (954 citations) and General Materials Science (50 citations). Fengshun Wu has collaborated with scholars based in China, Hong Kong and United Kingdom. Frequent co-authors include Y.C. Chan, Changqing Liu, Vadim V. Silberschmidt, Guang Chen, Ze Zhu, Bing An, Zheng Zhou, Huayu Sun, Bao Lu and Yan‐Cheong Chan. Their work appears in journals such as Journal of Power Sources, Scientific Reports and Journal of Materials Chemistry A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.