Guangbin Dou

468 total citations
43 papers, 376 citations indexed

About

Guangbin Dou is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Guangbin Dou has authored 43 papers receiving a total of 376 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 23 papers in Biomedical Engineering and 8 papers in Mechanical Engineering. Recurrent topics in Guangbin Dou's work include Advanced Sensor and Energy Harvesting Materials (13 papers), Electronic Packaging and Soldering Technologies (12 papers) and Advanced MEMS and NEMS Technologies (7 papers). Guangbin Dou is often cited by papers focused on Advanced Sensor and Energy Harvesting Materials (13 papers), Electronic Packaging and Soldering Technologies (12 papers) and Advanced MEMS and NEMS Technologies (7 papers). Guangbin Dou collaborates with scholars based in United Kingdom, China and Bangladesh. Guangbin Dou's co-authors include Litao Sun, Haizhou Huang, D.C. Whalley, Huafeng Liu, W. T. Pike, Y.C. Chan, N. J. Wu, Johan Liu, Shi Su and Changqing Liu and has published in prestigious journals such as Advanced Materials, SHILAP Revista de lepidopterología and Applied Physics Letters.

In The Last Decade

Guangbin Dou

40 papers receiving 364 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Guangbin Dou United Kingdom	11	183	181	62	53	43	43	376
Muhammad Murtaza China	8	129 0.7×	169 0.9×	55 0.9×	152 2.9×	41 1.0×	19	376
Qingda Xu China	11	217 1.2×	159 0.9×	27 0.4×	21 0.4×	54 1.3×	39	397
Kirill Keller Austria	9	209 1.1×	137 0.8×	38 0.6×	73 1.4×	17 0.4×	18	317
Orhan Akar Türkiye	8	221 1.2×	288 1.6×	55 0.9×	53 1.0×	22 0.5×	15	459
Seok Kim South Korea	12	257 1.4×	88 0.5×	51 0.8×	38 0.7×	13 0.3×	22	425
David Coulon France	9	303 1.7×	102 0.6×	150 2.4×	54 1.0×	16 0.4×	14	470
Jinyuan Yao China	15	314 1.7×	301 1.7×	65 1.0×	69 1.3×	9 0.2×	31	521
Wonsuk Choi South Korea	10	154 0.8×	130 0.7×	35 0.6×	91 1.7×	41 1.0×	41	354
Hongen Tu United States	12	264 1.4×	190 1.0×	37 0.6×	31 0.6×	92 2.1×	25	475

Countries citing papers authored by Guangbin Dou

Since Specialization

Citations

This map shows the geographic impact of Guangbin Dou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guangbin Dou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guangbin Dou more than expected).

Fields of papers citing papers by Guangbin Dou

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Guangbin Dou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guangbin Dou. The network helps show where Guangbin Dou may publish in the future.

Co-authorship network of co-authors of Guangbin Dou

This figure shows the co-authorship network connecting the top 25 collaborators of Guangbin Dou. A scholar is included among the top collaborators of Guangbin Dou based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Guangbin Dou. Guangbin Dou is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Liu, Jingli, et al.. (2025). Precise Morphology Tailoring of Through Glass Vias Perforated by Selective Laser-Induced Etching on Fused Silica. JOM. 77(6). 4150–4160. 2 indexed citations

Yin, Chunyan, et al.. (2025). Design strategy and micromachining technology of AT-cut high-frequency quartz resonators: A review. Materials Science in Semiconductor Processing. 193. 109465–109465.

Liu, Jingli, et al.. (2024). Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser‐Induced Etching with Nanochannels. Advanced Engineering Materials. 26(13). 3 indexed citations

Yin, Chunyan, et al.. (2024). Numerical Modeling and Experimental Study on Wafer Warpage of Embedded Interconnect Bridge in Organic Interposer. 1–6. 2 indexed citations

Dou, Guangbin, et al.. (2024). Design and fabrication of an accelerometer structure using glass fiber reinforced epoxy resin for seismic P-wave early warning. Measurement. 242. 115842–115842.

Zhou, Yike, Haizhou Huang, Bosong Zhang, et al.. (2024). Etching of quartz crystals in liquid phase environment: A review. Nanotechnology and Precision Engineering. 7(2). 6 indexed citations

Nie, Meng, et al.. (2023). Wearable Recognition System for Complex Motions Based on Hybrid Deep‐Learning‐Enhanced Strain Sensors. SHILAP Revista de lepidopterología. 5(11). 5 indexed citations

Huang, Haizhou, et al.. (2021). Directional Sweat Transport and Breathable Sandwiched Electrodes for Electrocardiogram Monitoring System. Advanced Materials Interfaces. 9(4). 16 indexed citations

Dou, Guangbin & Andrew S. Holmes. (2020). System Integration for Plastic Electronics Using Room‐Temperature Ultrasonic Welding. Advanced Engineering Materials. 22(5). 4 indexed citations

10.

Song, Xiaoxiao, Huafeng Liu, Guangbin Dou, et al.. (2018). A method for alleviating the effect of pinhole defects in inter-metal dielectric films. Journal of Micromechanics and Microengineering. 29(1). 15012–15012. 4 indexed citations

11.

Liu, Wei, Chunqing Wang, Guangbin Dou, Yanhong Tian, & Lei Yang. (2016). Laser-induced actuation of individual microsize liquid metal droplets on an open solid surface. Applied Physics Express. 10(1). 17202–17202. 3 indexed citations

12.

Dou, Guangbin, M. C. Gower, & Andrew S. Holmes. (2016). Micro-welding using laser-generated ultrasound. 236. 1–4. 1 indexed citations

13.

Dou, Guangbin, et al.. (2011). Transfer of Functional Ceramic Thin Films Using a Thermal Release Process. Advanced Materials. 23(10). 1252–1256. 3 indexed citations

14.

Dou, Guangbin, D.C. Whalley, Changqing Liu, & Y.C. Chan. (2010). An experimental methodology for the study of co‐planarity variation effects in anisotropic conductive adhesive assemblies. Soldering and Surface Mount Technology. 22(1). 47–55. 10 indexed citations

15.

Pu, Suan Hui, Andrew S. Holmes, Eric M. Yeatman, et al.. (2008). High-Q continuously tunable zipping varactors with large tuning range. ePrints Soton (University of Southampton). 1–4. 2 indexed citations

16.

Dou, Guangbin, D.C. Whalley, & Changqing Liu. (2008). Mechanical characterization of individual Ni∕Au coated microsize polymer particles. Applied Physics Letters. 92(10). 13 indexed citations

17.

Dou, Guangbin, D.C. Whalley, & Changqing Liu. (2006). Mechanical and Electrical Characterisation of Individual ACA Conductor Particles. Loughborough University Institutional Repository (Loughborough University). 1–9. 6 indexed citations

18.

Dou, Guangbin, D.C. Whalley, & Changqing Liu. (2006). Deformation Property Measurement for Single Anisotropic Conductive Adhesive Particles. Loughborough University Institutional Repository (Loughborough University). 840–847. 2 indexed citations

19.

Dou, Guangbin, D.C. Whalley, & Changqing Liu. (2006). The Effect of Co-planarity Variation on Anisotropic Conductive Adhesive Assemblies. Loughborough University Institutional Repository (Loughborough University). 18. 932–938. 10 indexed citations

20.

Dou, Guangbin, Y.C. Chan, & Johan Liu. (2003). Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles. Journal of Electronic Packaging. 125(4). 609–616. 29 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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