Changqing Liu

3.7k total citations · 1 hit paper
212 papers, 2.8k citations indexed

About

Changqing Liu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Changqing Liu has authored 212 papers receiving a total of 2.8k indexed citations (citations by other indexed papers that have themselves been cited), including 163 papers in Electrical and Electronic Engineering, 86 papers in Mechanical Engineering and 42 papers in Biomedical Engineering. Recurrent topics in Changqing Liu's work include Electronic Packaging and Soldering Technologies (104 papers), 3D IC and TSV technologies (56 papers) and Aluminum Alloys Composites Properties (29 papers). Changqing Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (104 papers), 3D IC and TSV technologies (56 papers) and Aluminum Alloys Composites Properties (29 papers). Changqing Liu collaborates with scholars based in United Kingdom, China and Hong Kong. Changqing Liu's co-authors include Paul Conway, Vadim V. Silberschmidt, Dezhi Li, David A. Hutt, Fengshun Wu, Jicheng Gong, Guang Yang, Yingguang Li, Yutai Su and D.C. Whalley and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Journal of Hazardous Materials.

In The Last Decade

Changqing Liu

197 papers receiving 2.7k citations

Hit Papers

Statistical effects of pore features on mechanical proper... 2022 2026 2023 2024 2022 40 80 120
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Statistical effects of pore features on mechanical properties and fracture behaviors of heterogeneous random porous materials by phase-field modeling
    2022 130 citations Yutai Su, Liguo Zhao et al. profile →

Peers

Changqing Liu
Jing Cao China
Yu‐Lin Shen United States
Wei Tong China
Seung Jun Lee South Korea
Fei Peng China
Shuang He China
Xinyu Liu China
Suresh V. Garimella United States
Shan Tang China
Hao Yi China
Jing Cao China
Changqing Liu
Citations per year, relative to Changqing Liu Changqing Liu (= 1×) peers Jing Cao

Countries citing papers authored by Changqing Liu

Since Specialization
Citations

This map shows the geographic impact of Changqing Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Changqing Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Changqing Liu more than expected).

Fields of papers citing papers by Changqing Liu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Changqing Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Changqing Liu. The network helps show where Changqing Liu may publish in the future.

Co-authorship network of co-authors of Changqing Liu

This figure shows the co-authorship network connecting the top 25 collaborators of Changqing Liu. A scholar is included among the top collaborators of Changqing Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Changqing Liu. Changqing Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Liu, Li, Qian Wang, Stuart Robertson, et al.. (2025). Study on sintering parameters and bonding mechanism of Cu@Ag preform via electromagnetic compaction for power electronics. Journal of Alloys and Compounds. 1030. 180842–180842.
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Yang, Xue‐Mei, Xiang Zhao, Yadong Xu, et al.. (2024). Spatio-temporal variation of air quality and its driving factors in Jinan and Qingdao during 2014–2022. Journal of Hazardous Materials. 486. 137065–137065. 2 indexed citations
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Chen, Yu, et al.. (2024). Application of generative AI-based data augmentation technique in transformer winding deformation fault diagnosis. Engineering Failure Analysis. 159. 108115–108115. 13 indexed citations
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Robertson, Stuart, Kenny Jolley, Han Zhou, et al.. (2024). Measuring coefficient of thermal expansion of materials of micrometre size using SEM/FIB microscope with in situ MEMS heating stage. Journal of Microscopy. 295(2). 191–198. 2 indexed citations
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Zhang, Li, et al.. (2023). Heat transfer in phase change materials for integrated batteries and power electronics systems. Applied Thermal Engineering. 232. 120997–120997. 5 indexed citations
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Jiang, Han, Stuart Robertson, Shuibao Liang, et al.. (2022). Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite. Materials Today Communications. 33. 104623–104623. 10 indexed citations
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Chen, Zhiwen, Fan Yang, Sheng Liu, et al.. (2022). Creep behavior of intermetallic compounds at elevated temperatures and its effect on fatigue life evaluation of Cu pillar bumps. Intermetallics. 144. 107526–107526. 6 indexed citations
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Liang, Shuibao, Yi Zhong, Stuart Robertson, et al.. (2022). Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding. Microelectronics Reliability. 138. 114654–114654. 1 indexed citations
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Su, Yutai, Guicui Fu, Changqing Liu, et al.. (2021). Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores. Computer Methods in Applied Mechanics and Engineering. 378. 113729–113729. 47 indexed citations
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Robertson, Stuart, et al.. (2020). Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters. Journal of Microscopy. 279(3). 212–216. 1 indexed citations
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Li, Xiang, et al.. (2020). Circuit Model for the Effect of Nonradiative Recombination in a High-Speed Distributed-Feedback Laser. Current Optics and Photonics. 4(5). 434–440. 5 indexed citations
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Chen, Guang, Hao Peng, Vadim V. Silberschmidt, et al.. (2016). Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing. Journal of Alloys and Compounds. 685. 680–689. 66 indexed citations
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Liu, Changqing, Songbai Chen, Chikun Ding, & Jiliang Jing. (2010). Kerr-Taub-NUT black hole as Particle Accelerators. arXiv (Cornell University). 3 indexed citations
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Liu, Changqing, et al.. (1992). EVALUATION OF ADHESION AND PLASTICITY OF PVD FILMS. Acta Metallurgica Sinica. 28(4). 77–82. 2 indexed citations
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Liu, Changqing, et al.. (1992). TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE. Acta Metallurgica Sinica. 28(8). 126–129. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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