Changqing Liu
- Electrical and Electronic Engineering top 2%
- Mechanical Engineering top 1%
- Biomedical Engineering top 5%
- Materials Chemistry top 10%
- Mechanics of Materials top 5%
- Co-authors
- Paul ConwayVadim V. SilberschmidtDezhi LiDavid A. HuttFengshun WuJicheng GongGuang YangYingguang Li
- Topics
- Electronic Packaging and Soldering Technologies (104 papers)3D IC and TSV technologies (56 papers)Aluminum Alloys Composites Properties (29 papers)
- Journals
- Applied Physics LettersJournal of The Electrochemical SocietyJournal of Hazardous Materials
- Partner nations
- United KingdomChinaHong Kong
In The Last Decade
Changqing Liu
197 papers receiving 2.7k citations
Hit Papers
Peers
Comparison fields: 5 of 121
- Electrical and Electronic Engineering 1.7k
- Mechanical Engineering 1.2k
- Biomedical Engineering 483
- Materials Chemistry 420
- Mechanics of Materials 302
Countries citing papers authored by Changqing Liu
This map shows the geographic impact of Changqing Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Changqing Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Changqing Liu more than expected).
Fields of papers citing papers by Changqing Liu
This network shows the impact of papers produced by Changqing Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Changqing Liu. The network helps show where Changqing Liu may publish in the future.
Co-authorship network of co-authors of Changqing Liu
This figure shows the co-authorship network connecting the top 25 collaborators of Changqing Liu. A scholar is included among the top collaborators of Changqing Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Changqing Liu. Changqing Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 2 | |
| 3 | 0 | |
| 4 | 0 | |
| 5 | 2 | |
| 6 | 13 | |
| 7 | 2 | |
| 8 | 0 | |
| 9 | 5 | |
| 10 | 1 | |
| 11 | 10 | |
| 12 | 6 | |
| 13 | 1 | |
| 14 | 47 | |
| 15 | 1 | |
| 16 | 5 | |
| 17 | 66 | |
| 18 | Kerr-Taub-NUT black hole as Particle Accelerators | 3 |
| 19 | EVALUATION OF ADHESION AND PLASTICITY OF PVD FILMS | 2 |
| 20 | TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE | 2 |
About Changqing Liu
Changqing Liu is a scholar working on Electrical and Electronic Engineering, General Materials Science and Mechanical Engineering, having authored 212 papers that have together received 2.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (104 papers), 3D IC and TSV technologies (56 papers) and Aluminum Alloys Composites Properties (29 papers). The work is most often cited by research in Mechanical Engineering (1.2k citations), Electrical and Electronic Engineering (1.7k citations) and General Materials Science (68 citations). Changqing Liu has collaborated with scholars based in United Kingdom, China and Hong Kong. Frequent co-authors include Paul Conway, Vadim V. Silberschmidt, Dezhi Li, David A. Hutt, Fengshun Wu, Jicheng Gong, Guang Yang, Yingguang Li, Yutai Su and D.C. Whalley. Their work appears in journals such as Applied Physics Letters, Journal of The Electrochemical Society and Journal of Hazardous Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.