Erik Jung
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor Lasers and Optical Devices
- Semiconductor materials and devices
- Advanced MEMS and NEMS Technologies
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- Microfluidic and Capillary Electrophoresis Applications
Papers in
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- 3D IC and TSV technologies 35
- Electronic Packaging and Soldering Technologies 23
- Semiconductor Lasers and Optical Devices 11
- Advanced MEMS and NEMS Technologies 6
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- Additive Manufacturing and 3D Printing Technologies 7
- Co-authors
- H. ReichlAndreas OstmannR. AschenbrennerMuamer KadicTobias FrenzelMartin WegenerAlexander NeumannR. Canegallo
- Journals
- IEEE Transactions on Advanced Packaging (3 papers)Sensors and Actuators A Physical (2 papers)Applied Ergonomics (2 papers)Microsystem Technologies (2 papers)IEEE Journal of Solid-State Circuits (2 papers)
- Partner nations
- GermanyItalyUnited Kingdom
In The Last Decade
Erik Jung
64 papers receiving 801 citations
Peers
Comparison fields: 5 of 92
- Electrical and Electronic Engineering 542
- Biomedical Engineering 240
- Cellular and Molecular Neuroscience 94
- Mechanical Engineering 147
- General Materials Science 10
Countries citing papers authored by Erik Jung
This map shows the geographic impact of Erik Jung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Erik Jung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Erik Jung more than expected).
Fields of papers citing papers by Erik Jung
This network shows the impact of papers produced by Erik Jung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Erik Jung. The network helps show where Erik Jung may publish in the future.
Co-authors
The 25 scholars most cited alongside Erik Jung, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 3 | |
| 2 | 2024 | 0 | |
| 3 | 2024 | 0 | |
| 4 | 2019 | 97 | |
| 5 | 2013 | 1 | |
| 6 | 2012 | 2 | |
| 7 | 2011 | 26 | |
| 8 | 2011 | 36 | |
| 9 | 2010 | 4 | |
| 10 | 2009 | 15 | |
| 11 | 2007 | 2 | |
| 12 | 2007 | 2 | |
| 13 | 2003 | 17 | |
| 14 | 2003 | 29 | |
| 15 | 2002 | 8 | |
| 16 | 2002 | 24 | |
| 17 | 1998 | 22 | |
| 18 | 1998 | 19 | |
| 19 | 1998 | 26 | |
| 20 | 1997 | 1 |
About Erik Jung
Erik Jung is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Biomedical Engineering, Conservation and Instrumentation, having authored 69 papers that have together received 853 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (23 papers), Semiconductor Lasers and Optical Devices (11 papers), Microfluidic and Capillary Electrophoresis Applications (9 papers), Microfluidic and Bio-sensing Technologies (8 papers), Additive Manufacturing and 3D Printing Technologies (7 papers), Advanced MEMS and NEMS Technologies (6 papers) and 3D Printing in Biomedical Research (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (542 citations), Biomedical Engineering (240 citations), Cellular and Molecular Neuroscience (94 citations), Mechanical Engineering (147 citations) and General Materials Science (10 citations). Erik Jung has collaborated with scholars based in Germany, Italy and United Kingdom. Frequent co-authors include H. Reichl, Andreas Ostmann, R. Aschenbrenner, Muamer Kadic, Tobias Frenzel, Martin Wegener, Alexander Neumann, R. Canegallo, A. Fazzi and Roberto Guerrieri. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Sensors and Actuators A Physical, Applied Ergonomics, Microsystem Technologies and IEEE Journal of Solid-State Circuits.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.