Michael Schiffer

502 total citations
38 papers, 177 citations indexed

About

Michael Schiffer is a scholar working on Electrical and Electronic Engineering, Management of Technology and Innovation and Biomedical Engineering. According to data from OpenAlex, Michael Schiffer has authored 38 papers receiving a total of 177 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 6 papers in Management of Technology and Innovation and 6 papers in Biomedical Engineering. Recurrent topics in Michael Schiffer's work include 3D IC and TSV technologies (10 papers), Silicon Carbide Semiconductor Technologies (8 papers) and Advanced MEMS and NEMS Technologies (6 papers). Michael Schiffer is often cited by papers focused on 3D IC and TSV technologies (10 papers), Silicon Carbide Semiconductor Technologies (8 papers) and Advanced MEMS and NEMS Technologies (6 papers). Michael Schiffer collaborates with scholars based in Germany, United States and Chile. Michael Schiffer's co-authors include Ε. Obermeier, Ha-Duong Ngo, Günther Schuh, Martin Schneider‐Ramelow, Klaus‐Dieter Lang, Jens Arnoscht, Christian Hinke, Tolga Tekin, Markus Bambach� and Johannes Schubert and has published in prestigious journals such as Natural Hazards, Experiments in Fluids and Biomedical Optics Express.

In The Last Decade

Michael Schiffer

35 papers receiving 165 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Michael Schiffer Germany 8 98 43 33 30 26 38 177
Manuel Abreu Portugal 6 63 0.6× 28 0.7× 43 1.3× 18 0.6× 74 2.8× 46 227
Gusztáv Hantos Hungary 9 194 2.0× 34 0.8× 27 0.8× 10 0.3× 31 1.2× 54 291
Fengman Liu China 9 222 2.3× 29 0.7× 34 1.0× 6 0.2× 60 2.3× 62 264
Changhua Qiu China 10 220 2.2× 79 1.8× 9 0.3× 18 0.6× 100 3.8× 30 316
Laertis Economikos United States 10 114 1.2× 97 2.3× 9 0.3× 9 0.3× 32 1.2× 37 198
Shun Taniguchi Japan 8 217 2.2× 50 1.2× 20 0.6× 5 0.2× 41 1.6× 25 303
Ekbert Hering Germany 5 22 0.2× 19 0.4× 6 0.2× 9 0.3× 34 1.3× 34 104
Katarina Grujić Norway 8 117 1.2× 151 3.5× 165 5.0× 21 0.7× 18 0.7× 15 307
J.D. Boyes United States 7 230 2.3× 12 0.3× 18 0.5× 5 0.2× 13 0.5× 23 317
M. Hejjo Al Rifai Germany 6 355 3.6× 81 1.9× 57 1.7× 16 0.5× 10 0.4× 9 423

Countries citing papers authored by Michael Schiffer

Since Specialization
Citations

This map shows the geographic impact of Michael Schiffer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael Schiffer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael Schiffer more than expected).

Fields of papers citing papers by Michael Schiffer

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Michael Schiffer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael Schiffer. The network helps show where Michael Schiffer may publish in the future.

Co-authorship network of co-authors of Michael Schiffer

This figure shows the co-authorship network connecting the top 25 collaborators of Michael Schiffer. A scholar is included among the top collaborators of Michael Schiffer based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Michael Schiffer. Michael Schiffer is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Schiffer, Michael, et al.. (2024). Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 23. 1–6. 2 indexed citations
2.
Kumar, Dhivya Sampath, Michael L. Hall, Xin He, et al.. (2024). Design of BGA style Glass Interposer for 2.5D integration of photonic ICs. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–2. 1 indexed citations
3.
Braun, Tanja, et al.. (2023). A novel FOWLP method to integrate delicate MEMS components. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1279–1284.
4.
Ndip, Ivan, et al.. (2023). RF models for Through SiC Vias for Highly Integrated Interposer Technology. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–5. 1 indexed citations
5.
Wittler, Olaf, et al.. (2022). SiC Fan-out Wafer Level Package for High Power Application. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 104–108. 2 indexed citations
6.
Schiffer, Michael, et al.. (2021). Investigation of Deep Dry Etching of 4H SIC Material for MEMS Applications Using DOE Modelling. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 634–637. 6 indexed citations
7.
Schiffer, Michael, et al.. (2021). Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(3). 437–445. 6 indexed citations
8.
Braun, Tanja, Marco Rossi, Ivan Ndip, et al.. (2021). Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 2009–2015. 10 indexed citations
9.
Harzic, R. Le, Julia C. Neubauer, Iris Riemann, et al.. (2020). Diffraction-based technology for the monitoring of contraction dynamics in 3D and 2D tissue models. Biomedical Optics Express. 11(2). 517–517.
10.
Schiffer, Michael, et al.. (2020). Investigation of Etching SIC VIAS for High Power Elctronics and Harsh Enviornment Mems. 1–6. 5 indexed citations
11.
Fritzsch, T., Michael Schiffer, Astrid Gollhardt, et al.. (2020). Reliability Investigation of Ultra Fine Line, Multi-Layer Copper Routing for Fan-Out Packaging Using a Newly Designed Micro Tensile Test Method. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 893–899. 2 indexed citations
12.
Schiffer, Michael, et al.. (2019). Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 939–942. 1 indexed citations
13.
Schiffer, Michael, et al.. (2016). TOWARDS IMPLEMENTING SYSTEMS ENGINEERING AS PART OF COMMERCIAL VEHICLE DESIGN. 1669–1678. 1 indexed citations
14.
Schuh, Günther, et al.. (2014). Scenario-based determination of product feature uncertainties for robust product architectures. Production Engineering. 8(3). 383–395. 9 indexed citations
15.
Brecher, Christian, Anja Richert, Michael Schiffer, et al.. (2012). Integrative Production Technology for High-wage Countries : Technology Roadmapping for the production in high-wage countries. RWTH Publications (RWTH Aachen). 2 indexed citations
16.
Schuh, Günther, Michael Schiffer, & Jens Arnoscht. (2012). Scenario based development of robust product architectures. RWTH Publications (RWTH Aachen). 2542–2549. 4 indexed citations
17.
Schiffer, Michael, et al.. (2012). Calibration and use of a MEMS surface fence for wall shear stress measurements in turbulent flows. Experiments in Fluids. 53(2). 489–498. 8 indexed citations
18.
Schuh, Günther, et al.. (2011). Developing a production engineering based theory of production. RWTH Publications (RWTH Aachen). 1–9. 1 indexed citations
19.
Schuh, Günther, et al.. (2011). Lean Innovation with Commonality Models. RWTH Publications (RWTH Aachen). 5 indexed citations
20.
Schuh, Günther, et al.. (2011). Technology roadmapping for the production in high-wage countries. Production Engineering. 5(4). 463–473. 21 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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