Arvind Sridhar

1.1k total citations
36 papers, 850 citations indexed

About

Arvind Sridhar is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Computational Mechanics. According to data from OpenAlex, Arvind Sridhar has authored 36 papers receiving a total of 850 indexed citations (citations by other indexed papers that have themselves been cited), including 28 papers in Electrical and Electronic Engineering, 22 papers in Mechanical Engineering and 6 papers in Computational Mechanics. Recurrent topics in Arvind Sridhar's work include Heat Transfer and Optimization (22 papers), 3D IC and TSV technologies (13 papers) and Silicon Carbide Semiconductor Technologies (12 papers). Arvind Sridhar is often cited by papers focused on Heat Transfer and Optimization (22 papers), 3D IC and TSV technologies (13 papers) and Silicon Carbide Semiconductor Technologies (12 papers). Arvind Sridhar collaborates with scholars based in Switzerland, United States and Canada. Arvind Sridhar's co-authors include David Atienza, Thomas Brunschwiler, Alessandro Vincenzi, Martino Ruggiero, Mohamed M. Sabry, José L. Ayala, David Cuesta, Bruno Michel, Mohamed M. Sabry and Chin Lee Ong and has published in prestigious journals such as IEEE Transactions on Computers, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems and IEEE Transactions on Electromagnetic Compatibility.

In The Last Decade

Arvind Sridhar

36 papers receiving 829 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Arvind Sridhar Switzerland 13 681 289 219 134 68 36 850
Alessandro Vincenzi Switzerland 9 557 0.8× 192 0.7× 201 0.9× 116 0.9× 57 0.8× 11 662
Alan J. Weger United States 16 785 1.2× 104 0.4× 364 1.7× 105 0.8× 93 1.4× 58 962
J. Q. Xu China 11 733 1.1× 69 0.2× 221 1.0× 300 2.2× 53 0.8× 42 975
Daeyeon Kim United States 16 905 1.3× 135 0.5× 156 0.7× 112 0.8× 42 0.6× 54 1.1k
Richard Wong United States 25 1.6k 2.3× 105 0.4× 781 3.6× 130 1.0× 97 1.4× 90 1.7k
Sazzadur Chowdhury Canada 13 491 0.7× 68 0.2× 60 0.3× 78 0.6× 42 0.6× 56 679
Zhenglin Liu China 13 251 0.4× 213 0.7× 69 0.3× 140 1.0× 11 0.2× 40 677
S.C. O’Mathuna Ireland 15 579 0.9× 178 0.6× 20 0.1× 85 0.6× 31 0.5× 48 744
Kaladhar Radhakrishnan United States 17 909 1.3× 60 0.2× 100 0.5× 54 0.4× 32 0.5× 61 1.0k
Dong‐Jin Lee South Korea 14 693 1.0× 28 0.1× 271 1.2× 58 0.4× 57 0.8× 50 752

Countries citing papers authored by Arvind Sridhar

Since Specialization
Citations

This map shows the geographic impact of Arvind Sridhar's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Arvind Sridhar with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Arvind Sridhar more than expected).

Fields of papers citing papers by Arvind Sridhar

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Arvind Sridhar. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Arvind Sridhar. The network helps show where Arvind Sridhar may publish in the future.

Co-authorship network of co-authors of Arvind Sridhar

This figure shows the co-authorship network connecting the top 25 collaborators of Arvind Sridhar. A scholar is included among the top collaborators of Arvind Sridhar based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Arvind Sridhar. Arvind Sridhar is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Parida, Pritish R., Mark Schultz, Fanghao Yang, et al.. (2018). Eulerian multiphase conjugate model for embedded two-phase liquid cooled microprocessor. 26–36. 3 indexed citations
2.
Parida, Pritish R., Arvind Sridhar, Mark Schultz, et al.. (2017). Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices. 130–138. 10 indexed citations
3.
Brunschwiler, Thomas, et al.. (2017). Scalable Packaging Platform Supporting High-Performance 3D Chip Stacks. 22(1). 1 indexed citations
4.
Parida, Pritish R., Arvind Sridhar, Augusto Vega, et al.. (2017). Thermal model for embedded two-phase liquid cooled microprocessor. 441–449. 14 indexed citations
5.
Sridhar, Arvind, Mohamed M. Sabry, Marina Zapater, et al.. (2017). PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays. IEEE Transactions on Computers. 67(1). 73–85. 14 indexed citations
6.
Sridhar, Arvind, Mohamed M. Sabry, & David Atienza. (2015). ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network. International Conference on Computer Aided Design. 1(1). 912–915. 6 indexed citations
7.
Sridhar, Arvind, Mohamed M. Sabry, Patrick Ruch, David Atienza, & Bruno Michel. (2014). PowerCool: simulation of integrated microfluidic power generation in bright silicon MPSoCs. International Conference on Computer Aided Design. 1(1). 527–534. 5 indexed citations
8.
Sabry, Mohamed M., Arvind Sridhar, David Atienza, Patrick Ruch, & Bruno Michel. (2014). Integrated microfluidic power generation and cooling for bright silicon MPSoCs. Design, Automation & Test in Europe Conference & Exhibition (DATE), 2014. 1–6. 2 indexed citations
9.
Sridhar, Arvind, Mohamed M. Sabry, & David Atienza. (2014). A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 33(8). 1145–1158. 8 indexed citations
10.
Sridhar, Arvind, Mohamed M. Sabry, Patrick Ruch, David Atienza, & Bruno Michel. (2014). PowerCool: Simulation of integrated microfluidic power generation in bright silicon MPSoCs. Infoscience (Ecole Polytechnique Fédérale de Lausanne). 6. 527–534. 7 indexed citations
11.
Sabry, Mohamed M., Arvind Sridhar, David Atienza, Patrick Ruch, & Bruno Michel. (2014). Integrated microfluidic power generation and cooling for bright silicon MPSoCs. Design, Automation & Test in Europe Conference & Exhibition (DATE), 2014. 1–6. 3 indexed citations
12.
Sridhar, Arvind, et al.. (2013). STEAM: a fast compact thermal model for two-phase cooling of integrated circuits. International Conference on Computer Aided Design. 1(1). 256–263. 6 indexed citations
13.
Sabry, Mohamed M., et al.. (2013). GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 32(4). 524–537. 25 indexed citations
14.
Sabry, Mohamed M., Arvind Sridhar, & David Atienza. (2012). Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation. Design, Automation, and Test in Europe. 1(1). 599–604. 12 indexed citations
15.
Vincenzi, Alessandro, Arvind Sridhar, Martino Ruggiero, & David Atienza. (2011). Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs. 1(1). 151–156. 13 indexed citations
16.
Sridhar, Arvind, Mohamed M. Sabry, & David Atienza. (2011). System-level thermal-aware design of 3D multiprocessors with inter-tier liquid cooling. Infoscience (Ecole Polytechnique Fédérale de Lausanne). 1–9. 6 indexed citations
17.
Vincenzi, Alessandro, Arvind Sridhar, Martino Ruggiero, & David Atienza. (2011). Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs. Infoscience (Ecole Polytechnique Fédérale de Lausanne). 151–156. 11 indexed citations
18.
Sridhar, Arvind, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, & David Atienza. (2010). 3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling. International Conference on Computer Aided Design. 1(1). 463–470. 190 indexed citations
19.
Sridhar, Arvind, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, & David Atienza. (2010). Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries. Infoscience (Ecole Polytechnique Fédérale de Lausanne). 1(1). 105–110. 41 indexed citations
20.
Sridhar, Arvind, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, & David Atienza. (2010). Compact Transient Thermal Model for 3D ICs with Liquid Cooling via Enhanced Heat Transfer Cavity. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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