V. Sarihan

618 total citations
37 papers, 455 citations indexed

About

V. Sarihan is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, V. Sarihan has authored 37 papers receiving a total of 455 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 14 papers in Mechanics of Materials and 9 papers in Mechanical Engineering. Recurrent topics in V. Sarihan's work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (14 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers). V. Sarihan is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (14 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers). V. Sarihan collaborates with scholars based in United States, Germany and France. V. Sarihan's co-authors include L.L. Mercado, Yifan Guo, Subrata Mukherjee, D. R. Frear, I. Dutta, W. W. Gerberich, Alex A. Volinsky, Joseph B. Vella, Betty Leung and Gary Li and has published in prestigious journals such as Materials Science and Engineering A, International Journal of Solids and Structures and Journal of Mechanical Design.

In The Last Decade

V. Sarihan

37 papers receiving 425 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
V. Sarihan United States 12 352 167 155 55 43 37 455
A. Nishimura Japan 16 540 1.5× 278 1.7× 109 0.7× 78 1.4× 47 1.1× 52 610
H. Pape Germany 15 578 1.6× 279 1.7× 194 1.3× 48 0.9× 83 1.9× 58 713
Hun Shen Ng Singapore 13 607 1.7× 165 1.0× 116 0.7× 16 0.3× 35 0.8× 26 630
L.L. Mercado United States 15 544 1.5× 166 1.0× 147 0.9× 104 1.9× 32 0.7× 37 618
Soonwan Chung South Korea 9 262 0.7× 143 0.9× 112 0.7× 51 0.9× 26 0.6× 30 366
R.N. Master United States 13 355 1.0× 62 0.4× 70 0.5× 36 0.7× 45 1.0× 40 414
Paresh Limaye Belgium 13 480 1.4× 64 0.4× 177 1.1× 44 0.8× 40 0.9× 30 523
Xiao Ma China 11 173 0.5× 144 0.9× 128 0.8× 124 2.3× 54 1.3× 39 437
Timwah Luk United States 10 352 1.0× 76 0.5× 100 0.6× 36 0.7× 16 0.4× 43 399
W. T. Chen United States 9 282 0.8× 372 2.2× 118 0.8× 48 0.9× 58 1.3× 15 563

Countries citing papers authored by V. Sarihan

Since Specialization
Citations

This map shows the geographic impact of V. Sarihan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Sarihan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Sarihan more than expected).

Fields of papers citing papers by V. Sarihan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by V. Sarihan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Sarihan. The network helps show where V. Sarihan may publish in the future.

Co-authorship network of co-authors of V. Sarihan

This figure shows the co-authorship network connecting the top 25 collaborators of V. Sarihan. A scholar is included among the top collaborators of V. Sarihan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with V. Sarihan. V. Sarihan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Sarihan, V., et al.. (2009). Package Designs and Associated Challenges for Environment Sensitive MEMS Sensors. 501–505. 3 indexed citations
2.
3.
Sarihan, V.. (2005). Role of film intrinsic stress in packaging of multi-layer microelectronic structures. Materials Science and Engineering A. 421(1-2). 109–117. 6 indexed citations
4.
5.
Mercado, L.L. & V. Sarihan. (2003). Evaluation of die edge cracking in flip-chip PBGA packages. IEEE Transactions on Components and Packaging Technologies. 26(4). 719–723. 25 indexed citations
6.
Mercado, L.L., et al.. (2003). Impact of solder pad size on solder joint reliability in flip chip PBGA packages. 255–259. 5 indexed citations
7.
Guo, Yifan, et al.. (2002). JACS-Pak/sup TM/ flip-chip chip scale package development and characterization. 21. 511–517. 1 indexed citations
8.
Sarihan, V., et al.. (2002). Impacting electronic package design by validated simulations. 1. 330–335. 1 indexed citations
9.
Mercado, L.L. & V. Sarihan. (2002). Evaluation of die edge cracking in flip-chip PBGA packages. 73–78. 4 indexed citations
10.
Mercado, L.L., et al.. (2002). An analysis of interface delamination in flip-chip packages. 1332–1337. 11 indexed citations
11.
Mercado, L.L., et al.. (2002). Failure Mechanism Study of Anisotropic Conductive Film (ACF) Packages. 523–530. 2 indexed citations
12.
Guo, Yifan, et al.. (2001). Methodology for studying the impact of intrinsic stress on the reliability of the electroless Ni UBM structure. IEEE Transactions on Components and Packaging Technologies. 24(4). 667–672. 14 indexed citations
13.
Mercado, L.L., et al.. (2000). Impact of solder pad size on solder joint reliability in flip chip PBGA packages. IEEE Transactions on Advanced Packaging. 23(3). 415–420. 28 indexed citations
14.
Guo, Yifan, et al.. (2000). A testing method and device for intrinsic stress measurement in wafer bumping process. IEEE Transactions on Components and Packaging Technologies. 23(2). 388–392. 3 indexed citations
15.
Mercado, L.L., et al.. (1999). A Performance & Manufacturability Evaluation of Bump Chip Carrier Packages. 61–67. 1 indexed citations
16.
Guo, Yifan, et al.. (1998). Accelerated life testing for micro-machined chemical sensors. IEEE Transactions on Reliability. 47(2). 135–141. 15 indexed citations
17.
Sarihan, V., et al.. (1996). Impact of Polymerization on Warpage Prediction of Molded Plastic Packages. 127–131. 3 indexed citations
18.
Sarihan, V.. (1994). Energy based methodology for damage and life prediction of solder joints under thermal cycling. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 17(4). 626–631. 42 indexed citations
19.
Sarihan, V.. (1993). Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling. Journal of Electronic Packaging. 115(1). 16–21. 35 indexed citations
20.
Sarihan, V., et al.. (1990). Optimization of the Wrist Pin End of an Automobile Engine Connecting Rod With an Interference Fit. Journal of Mechanical Design. 112(3). 406–412. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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