V. Sarihan
Impact in
- Mechanics of Materials top 10%
- Numerical methods in engineering
- Metal and Thin Film Mechanics
- Fatigue and fracture mechanics
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 29
- 3D IC and TSV technologies 14
- Integrated Circuits and Semiconductor Failure Analysis 7
- Advanced MEMS and NEMS Technologies 5
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- Fatigue and fracture mechanics 5
- Material Properties and Processing 5
- Co-authors
- L.L. Mercado (12 shared papers)Yifan Guo (11 shared papers)Subrata Mukherjee (1 shared paper)D. R. Frear (2 shared papers)I. Dutta (2 shared papers)W. W. Gerberich (1 shared paper)Joseph B. Vella (1 shared paper)Alex A. Volinsky (1 shared paper)
- Journals
- IEEE Transactions on Components and Packaging Technologies (4 papers)IEEE Transactions on Advanced Packaging (2 papers)Journal of Electronic Packaging (2 papers)Journal of Mechanical Design (1 paper)International Journal of Solids and Structures (1 paper)
- Partner nations
- United StatesFranceGermany
In The Last Decade
V. Sarihan
37 papers receiving 425 citations
Peers
Comparison fields: 5 of 40
- Mechanics of Materials 167
- Electrical and Electronic Engineering 352
- Mechanical Engineering 155
- Electronic, Optical and Magnetic Materials 29
- Biomedical Engineering 55
Countries citing papers authored by V. Sarihan
This map shows the geographic impact of V. Sarihan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Sarihan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Sarihan more than expected).
Fields of papers citing papers by V. Sarihan
This network shows the impact of papers produced by V. Sarihan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Sarihan. The network helps show where V. Sarihan may publish in the future.
Co-authors
The 22 scholars most cited alongside V. Sarihan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 37 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 64 | |
| 2 | 2000 | 45 | |
| 3 | 1994 | 42 | |
| 4 | 1982 | 39 | |
| 5 | 2007 | 37 | |
| 6 | 1993 | 35 | |
| 7 | 2000 | 28 | |
| 8 | 2003 | 25 | |
| 9 | 1998 | 15 | |
| 10 | 2001 | 14 | |
| 11 | 1990 | 14 | |
| 12 | 2002 | 11 | |
| 13 | 1997 | 9 | |
| 14 | 2003 | 9 | |
| 15 | 2008 | 8 | |
| 16 | 2005 | 6 | |
| 17 | 2004 | 6 | |
| 18 | 2008 | 5 | |
| 19 | 2003 | 5 | |
| 20 | 2002 | 4 |
About V. Sarihan
V. Sarihan is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 37 papers that have together received 455 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (14 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), Fatigue and fracture mechanics (5 papers), Advanced MEMS and NEMS Technologies (5 papers), Material Properties and Processing (5 papers), Metal Forming Simulation Techniques (3 papers) and Copper Interconnects and Reliability (3 papers). The work is most often cited by research in Mechanics of Materials (167 citations), Electrical and Electronic Engineering (352 citations), Mechanical Engineering (155 citations), Electronic, Optical and Magnetic Materials (29 citations) and Biomedical Engineering (55 citations). V. Sarihan has collaborated with scholars based in United States, France and Germany. Frequent co-authors include L.L. Mercado, Yifan Guo, Subrata Mukherjee, D. R. Frear, I. Dutta, W. W. Gerberich, Joseph B. Vella, Alex A. Volinsky, Betty Leung and Gary Li. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Advanced Packaging, Journal of Electronic Packaging, Journal of Mechanical Design and International Journal of Solids and Structures.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.