A. Nishimura
- Mechanics of Materials top 5%
- Material Properties and Processing 7
- Mechanical Behavior of Composites 4
- Fatigue and fracture mechanics 4
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- Electronic Packaging and Soldering Technologies 36
- 3D IC and TSV technologies 23
- Silicon and Solar Cell Technologies 6
- Electrostatic Discharge in Electronics 6
- Thin-Film Transistor Technologies 4
- Co-authors
- Sueo KAWAIKunihiko NISHIMakoto KitanoHideo MiuraHiroki MiuraMasaharu KitanoGen MurakamiTatsuji Sakamoto
- Journals
- Journal of Electronic Packaging (2 papers)IEEE Transactions on Electronics Packaging Manufacturing (2 papers)IEEE Transactions on Magnetics (1 paper)
- Partner nations
- JapanUnited StatesUnited Kingdom
In The Last Decade
A. Nishimura
49 papers receiving 562 citations
Peers
Comparison fields: 5 of 35
- Mechanics of Materials 278
- Electrical and Electronic Engineering 540
- Mechanical Engineering 109
- Biomedical Engineering 78
- Polymers and Plastics 22
Countries citing papers authored by A. Nishimura
This map shows the geographic impact of A. Nishimura's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Nishimura with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Nishimura more than expected).
Fields of papers citing papers by A. Nishimura
This network shows the impact of papers produced by A. Nishimura. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Nishimura. The network helps show where A. Nishimura may publish in the future.
Co-authorship network
The 25 scholars most cited alongside A. Nishimura, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 1 | |
| 2 | 2008 | 5 | |
| 3 | 2003 | 1 | |
| 4 | 2003 | 33 | |
| 5 | 2002 | 1 | |
| 6 | 2002 | 8 | |
| 7 | 1998 | 19 | |
| 8 | 1995 | 3 | |
| 9 | 1995 | 15 | |
| 10 | 1995 | 3 | |
| 11 | 1994 | 22 | |
| 12 | 1993 | 4 | |
| 13 | 1992 | 29 | |
| 14 | 1991 | 1 | |
| 15 | 1990 | 4 | |
| 16 | 1989 | 2 | |
| 17 | 1989 | 33 | |
| 18 | 1989 | 8 | |
| 19 | 1988 | 2 | |
| 20 | 1977 | 4 |
About A. Nishimura
A. Nishimura is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Industrial and Manufacturing Engineering, Mechanical Engineering and Biophysics, having authored 52 papers that have together received 610 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (23 papers), Material Properties and Processing (7 papers), Silicon and Solar Cell Technologies (6 papers), Electrostatic Discharge in Electronics (6 papers), Mechanical Behavior of Composites (4 papers), Thin-Film Transistor Technologies (4 papers) and Fatigue and fracture mechanics (4 papers). The work is most often cited by research in Mechanics of Materials (278 citations), Electrical and Electronic Engineering (540 citations), Mechanical Engineering (109 citations), Biomedical Engineering (78 citations) and Polymers and Plastics (22 citations). A. Nishimura has collaborated with scholars based in Japan, United States and United Kingdom. Frequent co-authors include Sueo KAWAI, Kunihiko NISHI, Makoto Kitano, Hideo Miura, Hiroki Miura, Masaharu Kitano, Gen Murakami, Tatsuji Sakamoto, Tetsuo KUMAZAWA and Haruo Akahoshi. Their work appears in journals such as Journal of Electronic Packaging, IEEE Transactions on Electronics Packaging Manufacturing, IEEE Transactions on Magnetics, IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.