Raghuram V. Pucha

705 total citations
47 papers, 560 citations indexed

About

Raghuram V. Pucha is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Raghuram V. Pucha has authored 47 papers receiving a total of 560 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 10 papers in Materials Chemistry. Recurrent topics in Raghuram V. Pucha's work include Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (19 papers) and Carbon Nanotubes in Composites (6 papers). Raghuram V. Pucha is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (19 papers) and Carbon Nanotubes in Composites (6 papers). Raghuram V. Pucha collaborates with scholars based in United States, India and Morocco. Raghuram V. Pucha's co-authors include Kyriaki Kalaitzidou, Mehdi Karevan, Md. Abu Hashan Bhuiyan, Suresh K. Sitaraman, Rao Tummala, T. D. Marusich, Shreyes N. Melkote, Rui Liu, S. Hegde and Kaya Demir and has published in prestigious journals such as Journal of Materials Processing Technology, Composite Structures and International Journal of Fatigue.

In The Last Decade

Raghuram V. Pucha

43 papers receiving 523 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Raghuram V. Pucha United States 13 206 196 159 153 146 47 560
Matthieu Mulle Saudi Arabia 14 238 1.2× 65 0.3× 223 1.4× 225 1.5× 265 1.8× 21 673
Deepak Kumar India 14 103 0.5× 108 0.6× 234 1.5× 136 0.9× 149 1.0× 62 488
Russell A. Wincheski United States 12 78 0.4× 226 1.2× 152 1.0× 80 0.5× 138 0.9× 40 490
Wei Tan Malaysia 13 89 0.4× 98 0.5× 140 0.9× 171 1.1× 159 1.1× 76 633
Limin Zhou Hong Kong 11 185 0.9× 131 0.7× 53 0.3× 107 0.7× 67 0.5× 15 407
Myung Jin Yim United States 15 673 3.3× 108 0.6× 180 1.1× 118 0.8× 234 1.6× 43 827
Unnati Joshi India 11 48 0.2× 192 1.0× 97 0.6× 108 0.7× 98 0.7× 40 361
Todd Henry United States 14 145 0.7× 94 0.5× 262 1.6× 161 1.1× 77 0.5× 83 601
Hyunsoo Hong South Korea 10 56 0.3× 125 0.6× 288 1.8× 244 1.6× 130 0.9× 33 536
Zejia Zhao China 13 186 0.9× 126 0.6× 280 1.8× 44 0.3× 187 1.3× 31 474

Countries citing papers authored by Raghuram V. Pucha

Since Specialization
Citations

This map shows the geographic impact of Raghuram V. Pucha's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Raghuram V. Pucha with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Raghuram V. Pucha more than expected).

Fields of papers citing papers by Raghuram V. Pucha

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Raghuram V. Pucha. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Raghuram V. Pucha. The network helps show where Raghuram V. Pucha may publish in the future.

Co-authorship network of co-authors of Raghuram V. Pucha

This figure shows the co-authorship network connecting the top 25 collaborators of Raghuram V. Pucha. A scholar is included among the top collaborators of Raghuram V. Pucha based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Raghuram V. Pucha. Raghuram V. Pucha is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Raj, P. Markondeya, Himani Sharma, Raghuram V. Pucha, Mohanalingam Kathaperumal, & Rao Tummala. (2022). Packaging Materials in High-Performance Computing Applications. Journal of the Indian Institute of Science. 102(1). 461–487. 5 indexed citations
2.
Demir, Kaya, Vijay Sukumaran, Yoichiro Sato, et al.. (2018). Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications. Journal of Materials Science Materials in Electronics. 29(15). 12669–12680. 10 indexed citations
3.
Pucha, Raghuram V., et al.. (2015). Computational homogenization in RVE models with material periodic conditions for CNT polymer composites. Composite Structures. 137. 9–17. 50 indexed citations
4.
Liu, Rui, et al.. (2013). An enhanced constitutive material model for machining of Ti–6Al–4V alloy. Journal of Materials Processing Technology. 213(12). 2238–2246. 58 indexed citations
5.
Pucha, Raghuram V., et al.. (2012). Learning-Centered Instruction of Engineering Graphics for Freshman Engineering Students. Journal of STEM education. 13(4). 24–33. 11 indexed citations
6.
Raj, P. Markondeya, Nitesh Kumbhat, Yushu Wang, et al.. (2011). Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections. 916–920. 6 indexed citations
7.
Bhuiyan, Md. Abu Hashan, Raghuram V. Pucha, Mehdi Karevan, & Kyriaki Kalaitzidou. (2011). Tensile modulus of carbon nanotube/polypropylene composites – A computational study based on experimental characterization. Computational Materials Science. 50(8). 2347–2353. 57 indexed citations
8.
Kim, Injoong, Raghuram V. Pucha, Russell S. Peak, & Suresh K. Sitaraman. (2007). System-Design-for-Reliability Tools for Highly Integrated Electronic Packaging Systems. 1809–1814. 2 indexed citations
9.
Kumbhat, Nitesh, et al.. (2007). Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging. IEEE Transactions on Advanced Packaging. 30(4). 641–653.
10.
Kumbhat, Nitesh, P.M. Raj, Raghuram V. Pucha, et al.. (2005). Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications. 2. 1364–1372. 5 indexed citations
11.
Hegde, S., Raghuram V. Pucha, V. Sundaram, et al.. (2004). Materials, processes and reliability of mixed-signal substrates for SOP technology. 1630–1635.
12.
Sundaram, V., Rao Tummala, G. Edward White, et al.. (2004). System-on-a-package (SOP) substrate and module with digital, RF and optical integration. 17–23. 3 indexed citations
13.
Kumbhat, Nitesh, P. Markondeya Raj, Raghuram V. Pucha, et al.. (2004). Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly. 1843–1850. 10 indexed citations
14.
Kumbhat, Nitesh, S. Hegde, P. Markondeya Raj, et al.. (2004). Novel board material technology for next-generation packaging. 247–252. 1 indexed citations
15.
Pucha, Raghuram V., et al.. (2003). Micro-scale plasticity effects in microvia reliability analysis. 1304–1309. 3 indexed citations
16.
Hegde, S., et al.. (2003). Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards. 165–170. 5 indexed citations
17.
Pucha, Raghuram V., et al.. (2002). Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction. 329–335. 6 indexed citations
18.
Pucha, Raghuram V., et al.. (2002). Thermomechanical reliability of underfilled BGA packages. IEEE Transactions on Electronics Packaging Manufacturing. 25(2). 100–106. 13 indexed citations
19.
Pucha, Raghuram V., et al.. (2002). Effect of underfill on BGA reliability. 354–359. 4 indexed citations
20.
Hegde, S., Raghuram V. Pucha, & Suresh K. Sitaraman. (2002). Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials. 283–290. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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