Chun‐Wei Chiu

455 total citations
35 papers, 362 citations indexed

About

Chun‐Wei Chiu is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Computer Networks and Communications. According to data from OpenAlex, Chun‐Wei Chiu has authored 35 papers receiving a total of 362 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 12 papers in Materials Chemistry and 6 papers in Computer Networks and Communications. Recurrent topics in Chun‐Wei Chiu's work include Electronic Packaging and Soldering Technologies (5 papers), Magnetic properties of thin films (4 papers) and Thermal properties of materials (3 papers). Chun‐Wei Chiu is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Magnetic properties of thin films (4 papers) and Thermal properties of materials (3 papers). Chun‐Wei Chiu collaborates with scholars based in Taiwan, United States and Russia. Chun‐Wei Chiu's co-authors include Chao-hong Wang, Yung Ting, E.H. Greener, H.J. Mueller, Jye‐Shane Yang, Hao Huang, Insic Hong, Chi‐Yuan Lee, Shuo-Jen Lee and Gee-Sern Hsu and has published in prestigious journals such as Journal of Applied Physics, International Journal of Hydrogen Energy and Journal of Alloys and Compounds.

In The Last Decade

Chun‐Wei Chiu

32 papers receiving 356 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chun‐Wei Chiu Taiwan 9 139 112 82 72 52 35 362
Guanting Chen Taiwan 7 98 0.7× 122 1.1× 98 1.2× 118 1.6× 25 0.5× 22 410
Young-Joo Lee South Korea 12 304 2.2× 96 0.9× 185 2.3× 100 1.4× 36 0.7× 28 606
Seokmoo Hong South Korea 10 182 1.3× 111 1.0× 171 2.1× 71 1.0× 20 0.4× 68 419
Peng Shao United States 11 211 1.5× 25 0.2× 57 0.7× 220 3.1× 8 0.2× 34 462
Yoonjae Lee South Korea 13 273 2.0× 64 0.6× 81 1.0× 86 1.2× 46 0.9× 36 498
Guangyao Liu China 15 464 3.3× 58 0.5× 62 0.8× 94 1.3× 130 2.5× 41 691
Haixia Cui China 13 302 2.2× 157 1.4× 112 1.4× 140 1.9× 33 0.6× 81 696
Alireza Grayeli Korpi Iran 7 112 0.8× 97 0.9× 38 0.5× 34 0.5× 19 0.4× 16 295
Jaemyung Chang United States 14 1.4k 10.0× 141 1.3× 56 0.7× 332 4.6× 33 0.6× 18 1.5k

Countries citing papers authored by Chun‐Wei Chiu

Since Specialization
Citations

This map shows the geographic impact of Chun‐Wei Chiu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chun‐Wei Chiu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chun‐Wei Chiu more than expected).

Fields of papers citing papers by Chun‐Wei Chiu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chun‐Wei Chiu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chun‐Wei Chiu. The network helps show where Chun‐Wei Chiu may publish in the future.

Co-authorship network of co-authors of Chun‐Wei Chiu

This figure shows the co-authorship network connecting the top 25 collaborators of Chun‐Wei Chiu. A scholar is included among the top collaborators of Chun‐Wei Chiu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chun‐Wei Chiu. Chun‐Wei Chiu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wang, Chao-hong, et al.. (2024). Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material. Materials. 17(9). 2158–2158.
2.
3.
Lee, Chi‐Yuan, et al.. (2022). Real-time microscopic monitoring of temperature and strain on the surface of magnesium hydrogen storage tank by high temperature resistant flexible integrated microsensor. International Journal of Hydrogen Energy. 47(25). 12815–12821. 19 indexed citations
4.
Lee, Chi‐Yuan, et al.. (2022). Real-Time Monitoring of HT-PEMFC. Membranes. 12(1). 94–94. 9 indexed citations
5.
Lee, Chi‐Yuan, et al.. (2022). Real-Time Monitoring of the Temperature, Flow, and Pressure Inside High-Temperature Proton Exchange Membrane Fuel Cells. Micromachines. 13(7). 1040–1040. 4 indexed citations
6.
Wang, Chao-hong, et al.. (2020). Liquid-State Interfacial Reactions of Sn and Sn-Ag-Cu Solders with p-Type (Bi,Sb)2Te3 Thermoelectric Material. JOM. 72(10). 3558–3566. 5 indexed citations
7.
Lee, Chi‐Yuan, et al.. (2020). Internal real-time microscopic diagnosis of vanadium redox flow battery. Sensors and Actuators A Physical. 314. 112259–112259. 5 indexed citations
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Wang, Chao-hong, et al.. (2014). Cruciform Pattern of Ni5Zn21 Formed in Interfacial Reactions Between Ni and Sn–Zn Solders. Journal of Electronic Materials. 43(5). 1362–1369. 5 indexed citations
10.
11.
Lin, Chih‐Hung, Tzung‐Her Chen, & Chun‐Wei Chiu. (2012). Color image authentication with tamper detection and remedy based on BCH and Bayer Pattern. Displays. 34(1). 59–68. 8 indexed citations
12.
Lin, Cheng‐Huang, et al.. (2011). Structures and magnetic properties of Co and CoFe films prepared by magnetron sputtering. Thin Solid Films. 519(23). 8379–8383. 16 indexed citations
13.
Wang, Hung‐Yu, et al.. (2010). A Modified Pipeline FFT Architecture. 29. 4611–4614. 4 indexed citations
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15.
Yang, Shun‐Ren, et al.. (2009). Soft handoff support for SIP‐NEMO: design, implementation, and performance evaluation. Wireless Communications and Mobile Computing. 11(4). 542–555. 3 indexed citations
16.
Yang, Shun‐Ren, et al.. (2008). Design and implementation of soft handoff support for SIP-NEMO. 1–1. 1 indexed citations
17.
Chiu, Chun‐Wei, et al.. (2008). Deformation behaviour and formability of LZ90 Mg alloy. Materials Science and Technology. 24(5). 607–611. 2 indexed citations
18.
Chang, H. W., et al.. (2007). Coercivity enhancement of melt spun FePt ribbons by Au addition. Journal of Applied Physics. 101(9). 7 indexed citations
19.
Chou, Chi‐Chung, et al.. (2004). A novel memoryless AES cipher architecture for networking applications. IV–333. 8 indexed citations
20.
Greener, E.H., et al.. (1994). Effect of food and oral simulating fluids on dentine bond and composite strength. Journal of Dentistry. 22(6). 352–359. 40 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026