Chun‐Wei Chiu
Impact in
- Orthodontics top 10%
- Dental materials and restorations
Papers in
-
- Electronic Packaging and Soldering Technologies 5
- Chalcogenide Semiconductor Thin Films 3
-
- Thermal properties of materials 3
- Advanced Thermoelectric Materials and Devices 3
- Co-authors
- Yung Ting (1 shared paper)Chao-hong Wang (5 shared papers)Jye‐Shane Yang (1 shared paper)H.J. Mueller (1 shared paper)E.H. Greener (1 shared paper)Insic Hong (3 shared papers)Hao Huang (3 shared papers)Chi‐Yuan Lee (5 shared papers)
- Journals
- Journal of Alloys and Compounds (4 papers)Journal of Applied Physics (4 papers)Thin Solid Films (2 papers)Wireless Communications and Mobile Computing (1 paper)Wireless Networks (1 paper)
- Partner nations
- TaiwanUnited StatesRussia
In The Last Decade
Chun‐Wei Chiu
32 papers receiving 367 citations
Peers
Comparison fields: 5 of 65
- Orthodontics 36
- Electronic, Optical and Magnetic Materials 52
- Energy Engineering and Power Technology 8
- Electrical and Electronic Engineering 142
- Materials Chemistry 113
Countries citing papers authored by Chun‐Wei Chiu
This map shows the geographic impact of Chun‐Wei Chiu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chun‐Wei Chiu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chun‐Wei Chiu more than expected).
Fields of papers citing papers by Chun‐Wei Chiu
This network shows the impact of papers produced by Chun‐Wei Chiu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chun‐Wei Chiu. The network helps show where Chun‐Wei Chiu may publish in the future.
Co-authors
The 25 scholars most cited alongside Chun‐Wei Chiu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 35 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 70 | |
| 2 | 1994 | 40 | |
| 3 | 2010 | 34 | |
| 4 | 2014 | 30 | |
| 5 | 2020 | 21 | |
| 6 | 2018 | 20 | |
| 7 | 2022 | 19 | |
| 8 | 2011 | 16 | |
| 9 | 2022 | 10 | |
| 10 | 2004 | 8 | |
| 11 | 2012 | 8 | |
| 12 | 2022 | 8 | |
| 13 | 2007 | 7 | |
| 14 | 2013 | 7 | |
| 15 | 2008 | 6 | |
| 16 | 2015 | 6 | |
| 17 | 2021 | 6 | |
| 18 | 2022 | 5 | |
| 19 | 2014 | 5 | |
| 20 | 2007 | 5 |
About Chun‐Wei Chiu
Chun‐Wei Chiu is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Computer Networks and Communications, Atomic and Molecular Physics, and Optics and Mechanical Engineering, having authored 35 papers that have together received 372 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (5 papers), Magnetic properties of thin films (4 papers), Thermal properties of materials (3 papers), Chalcogenide Semiconductor Thin Films (3 papers), Interconnection Networks and Systems (3 papers), Advanced Thermoelectric Materials and Devices (3 papers), Microstructure and Mechanical Properties of Steels (2 papers) and Vehicle License Plate Recognition (2 papers). The work is most often cited by research in Orthodontics (36 citations), Electronic, Optical and Magnetic Materials (52 citations), Energy Engineering and Power Technology (8 citations), Electrical and Electronic Engineering (142 citations) and Materials Chemistry (113 citations). Chun‐Wei Chiu has collaborated with scholars based in Taiwan, United States and Russia. Frequent co-authors include Yung Ting, Chao-hong Wang, Jye‐Shane Yang, H.J. Mueller, E.H. Greener, Insic Hong, Hao Huang, Chi‐Yuan Lee, Shuo-Jen Lee and Hsiang‐Ting Lin. Their work appears in journals such as Journal of Alloys and Compounds, Journal of Applied Physics, Thin Solid Films, Wireless Communications and Mobile Computing and Wireless Networks.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.