Fengman Liu
- Electrical and Electronic Engineering
- Mechanical Engineering
- Atomic and Molecular Physics, and Optics
- Biomedical Engineering
- Mechanics of Materials
- Topics
- Photonic and Optical Devices (31 papers)Semiconductor Lasers and Optical Devices (23 papers)3D IC and TSV technologies (18 papers)
- Partner nations
- ChinaSingaporeNetherlands
In The Last Decade
Fengman Liu
47 papers receiving 251 citations
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 222
- Mechanical Engineering 60
- Atomic and Molecular Physics, and Optics 34
- Biomedical Engineering 29
- Mechanics of Materials 21
Countries citing papers authored by Fengman Liu
This map shows the geographic impact of Fengman Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fengman Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fengman Liu more than expected).
Fields of papers citing papers by Fengman Liu
This network shows the impact of papers produced by Fengman Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fengman Liu. The network helps show where Fengman Liu may publish in the future.
Co-authorship network of co-authors of Fengman Liu
This figure shows the co-authorship network connecting the top 25 collaborators of Fengman Liu. A scholar is included among the top collaborators of Fengman Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fengman Liu. Fengman Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 1 | |
| 5 | 2 | |
| 6 | 1 | |
| 7 | 8 | |
| 8 | 19 | |
| 9 | 7 | |
| 10 | 1 | |
| 11 | 2 | |
| 12 | 1 | |
| 13 | 1 | |
| 14 | 1 | |
| 15 | 1 | |
| 16 | 56 | |
| 17 | 1 | |
| 18 | 0 | |
| 19 | 0 | |
| 20 | 1 |
About Fengman Liu
Fengman Liu is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Atomic and Molecular Physics, and Optics, having authored 62 papers that have together received 264 indexed citations. Recurring topics across this work include Photonic and Optical Devices (31 papers), Semiconductor Lasers and Optical Devices (23 papers) and 3D IC and TSV technologies (18 papers). The work is most often cited by research in Electrical and Electronic Engineering (222 citations), Mechanical Engineering (60 citations) and Automotive Engineering (14 citations). Fengman Liu has collaborated with scholars based in China, Singapore and Netherlands. Frequent co-authors include Liqiang Cao, Fengze Hou, Xuejun Fan, Liqiang Cao, Tingyu Lin, Lixi Wan, Haiyun Xue, Huimin He, Siwei Sun and Yi He. Their work appears in journals such as Carbon, IEEE Transactions on Power Electronics and Optics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.