Fengman Liu

532 total citations
62 papers, 264 citations indexed

About

Fengman Liu is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Mechanical Engineering. According to data from OpenAlex, Fengman Liu has authored 62 papers receiving a total of 264 indexed citations (citations by other indexed papers that have themselves been cited), including 59 papers in Electrical and Electronic Engineering, 7 papers in Atomic and Molecular Physics, and Optics and 7 papers in Mechanical Engineering. Recurrent topics in Fengman Liu's work include Photonic and Optical Devices (31 papers), Semiconductor Lasers and Optical Devices (23 papers) and 3D IC and TSV technologies (18 papers). Fengman Liu is often cited by papers focused on Photonic and Optical Devices (31 papers), Semiconductor Lasers and Optical Devices (23 papers) and 3D IC and TSV technologies (18 papers). Fengman Liu collaborates with scholars based in China, Singapore and Netherlands. Fengman Liu's co-authors include Liqiang Cao, Fengze Hou, Xuejun Fan, Liqiang Cao, Tingyu Lin, Lixi Wan, Haiyun Xue, Huimin He, Siwei Sun and Yi He and has published in prestigious journals such as Carbon, IEEE Transactions on Power Electronics and Optics Letters.

In The Last Decade

Fengman Liu

47 papers receiving 251 citations

Peers

Fengman Liu

EEE

AMPO

Cuong Huynh United States

A. Sharma United States

Sam Gu United States

S. Haque United States

Josef Weber Germany

Arie Nawawi Singapore

Maximilian Schmid Germany

Xiaopeng Xu United States

Ho‐Yun Lee South Korea

Cuong Huynh United States

Fengman Liu

278 ×1.3

EEE

63 ×1.1

19 ×0.6

AMPO

29 ×1.0

13 ×0.6

Citations per year, relative to Fengman Liu Fengman Liu (= 1×) peers Cuong Huynh

Countries citing papers authored by Fengman Liu

Since Specialization

Citations

This map shows the geographic impact of Fengman Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fengman Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fengman Liu more than expected).

Fields of papers citing papers by Fengman Liu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fengman Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fengman Liu. The network helps show where Fengman Liu may publish in the future.

Co-authorship network of co-authors of Fengman Liu

This figure shows the co-authorship network connecting the top 25 collaborators of Fengman Liu. A scholar is included among the top collaborators of Fengman Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fengman Liu. Fengman Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Liu, Yunting, et al.. (2025). Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures. Microelectronics Journal. 161. 106714–106714.

Yang, Peng, Siwei Sun, Rui Cao, et al.. (2025). DAC-less PAM-4 signal generation using a thin-film lithium niobate dual-drive MZI modulator. Optics Letters. 50(11). 3509–3509.

Liu, Fengman, et al.. (2024). Multifunctional MEMS Sensors for Measuring Force and Acceleration Dependent on Graphene-Induced Nonradiative Transitions. ACS Applied Nano Materials. 7(24). 28448–28456. 1 indexed citations

Yang, Peng, Siwei Sun, Yuqiang Zhang, et al.. (2024). High-Bandwidth Lumped Mach-Zehnder Modulators Based on Thin-Film Lithium Niobate. Photonics. 11(5). 399–399. 1 indexed citations

He, Huimin, et al.. (2024). Enhanced Fabrication and Assembly of 3-D Chiplets Based on Active Interposer With Frontside Via-Last TSVs. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(9). 1692–1700. 2 indexed citations

Wang, Linfang, et al.. (2024). A 2T P-Channel Logic Flash Cell for Reconfigurable Interconnection in Chiplet-Based Computing-In-Memory Accelerators. 1–4. 1 indexed citations

Liu, Fengman, et al.. (2023). High-sensitivity MEMS force and acceleration sensor based on graphene-induced non-radiative transition. Carbon. 209. 118001–118001. 8 indexed citations

Lu, Donglai, Haiyun Xue, Han Liu, et al.. (2022). Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects. IEEE Transactions on Circuits and Systems I Regular Papers. 69(11). 4345–4357. 19 indexed citations

He, Huimin, et al.. (2022). Design and Realization of Multi-Channel and High-Bandwidth 2.5D Transmitter Integrated With Silicon Photonic MZM. Journal of Lightwave Technology. 40(15). 5201–5215. 7 indexed citations

10.

Wu, Yue, et al.. (2022). The high‐efficiency co‐design and the measurement verification of high‐bandwidth silicon photonic microring modulator. IET Optoelectronics. 16(6). 257–265. 1 indexed citations

11.

Xue, Haiyun, Fengman Liu, Liqiang Cao, et al.. (2022). Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer. Processes. 10(11). 2342–2342. 2 indexed citations

12.

Bai, Lijuan, et al.. (2020). The Collaborative Design for the Package of High - speed Interface Chip. 1–4. 1 indexed citations

13.

Chen, Ying, Fengman Liu, Juan Wei, et al.. (2020). Segmented Mach-Zehnder Modulator for High-level PAM Generation. 15. 1–4. 1 indexed citations

14.

Liu, Fengman, et al.. (2020). Segmented Mach-Zehnder Modulator for High-level PAM Generation. 15. 1–4. 1 indexed citations

15.

Wei, Juan, et al.. (2018). The Signal Integrity Design And Optimization of High Speed RF Optical Receiver Module. 2. 1123–1126. 1 indexed citations

16.

Hou, Fengze, et al.. (2017). Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(10). 1721–1728. 56 indexed citations

17.

Liu, Fengman, Yi He, Huimin He, et al.. (2014). Analysis on electromagnetic isolation issues among multi-chips in system in package. 53–57. 1 indexed citations

18.

Li, Zhihua, Baoxia Li, Wei Gao, et al.. (2012). A 10-Gbps × 12-Channel Pluggable Parallel Optical Transceiver Based on CXP Interface Specifications. Fiber & Integrated Optics. 31(3). 164–177.

19.

Liu, Fengman, Zhihua Li, Lixi Wan, et al.. (2011). A 9pJ/bit SOP optical transceiver with 80 Gbps two-way bandwidth. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8309. 83092I–83092I.

20.

Li, Baoxia, Wei Gao, Fengman Liu, et al.. (2010). Optimization of broadband characterization for pluggable parallel optical transceiver modules on multilayer substrates. 22. 834–838. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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