Fengze Hou

928 total citations
52 papers, 658 citations indexed

About

Fengze Hou is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Fengze Hou has authored 52 papers receiving a total of 658 indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 27 papers in Mechanical Engineering and 6 papers in Automotive Engineering. Recurrent topics in Fengze Hou's work include 3D IC and TSV technologies (20 papers), Electronic Packaging and Soldering Technologies (18 papers) and Heat Transfer and Optimization (17 papers). Fengze Hou is often cited by papers focused on 3D IC and TSV technologies (20 papers), Electronic Packaging and Soldering Technologies (18 papers) and Heat Transfer and Optimization (17 papers). Fengze Hou collaborates with scholars based in China, Netherlands and United States. Fengze Hou's co-authors include Liqiang Cao, Tingyu Lin, Guoqi Zhang, Meiying Su, Fengman Liu, Braham Ferreira, Jun Li, Wenbo Wang, Xuejun Fan and Chuan Chen and has published in prestigious journals such as IEEE Transactions on Power Electronics, Scripta Materialia and IEEE Transactions on Electron Devices.

In The Last Decade

Fengze Hou

46 papers receiving 638 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Fengze Hou China 16 447 257 65 63 48 52 658
Douglas DeVoto United States 14 405 0.9× 148 0.6× 98 1.5× 29 0.5× 43 0.9× 38 533
Raj Bhatti United Kingdom 11 335 0.7× 379 1.5× 262 4.0× 80 1.3× 100 2.1× 33 692
Lauren Boteler United States 14 193 0.4× 310 1.2× 168 2.6× 28 0.4× 23 0.5× 41 468
David Bušek Czechia 14 490 1.1× 301 1.2× 66 1.0× 68 1.1× 97 2.0× 82 614
Kenny C. Otiaba United Kingdom 9 253 0.6× 189 0.7× 141 2.2× 27 0.4× 65 1.4× 16 405
P.J. Bolt Netherlands 14 280 0.6× 284 1.1× 279 4.3× 82 1.3× 186 3.9× 38 622
Changsoo Jang United States 12 273 0.6× 107 0.4× 32 0.5× 64 1.0× 133 2.8× 37 384
Olaf Wittler Germany 13 468 1.0× 151 0.6× 57 0.9× 88 1.4× 150 3.1× 97 598
R. Rajoo Singapore 17 746 1.7× 172 0.7× 99 1.5× 93 1.5× 308 6.4× 53 897

Countries citing papers authored by Fengze Hou

Since Specialization
Citations

This map shows the geographic impact of Fengze Hou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fengze Hou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fengze Hou more than expected).

Fields of papers citing papers by Fengze Hou

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fengze Hou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fengze Hou. The network helps show where Fengze Hou may publish in the future.

Co-authorship network of co-authors of Fengze Hou

This figure shows the co-authorship network connecting the top 25 collaborators of Fengze Hou. A scholar is included among the top collaborators of Fengze Hou based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fengze Hou. Fengze Hou is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chen, Junwei, Chao Gu, Huidan Zeng, et al.. (2025). Review of Inorganic Nonmetallic Materials in Power Electronics Packaging Application. IEEE Transactions on Power Electronics. 40(8). 10509–10530. 7 indexed citations
2.
Hou, Fengze, Meiying Su, Jiajie Fan, et al.. (2024). Review of Die-Attach Materials for SiC High-Temperature Packaging. IEEE Transactions on Power Electronics. 39(10). 13471–13486. 15 indexed citations
3.
Feng, Jianyu, Chuan Chen, Rong Fu, et al.. (2024). Embedded cooling to meet the 2kW thermal design power of HPC chips in the future. 1–5. 1 indexed citations
4.
5.
Hou, Fengze, Yunyan Zhou, Meiying Su, et al.. (2024). Sintering Mechanism Analysis of Cu Nanoparticles via Molecular Dynamics. 1–6.
6.
Chen, Min, et al.. (2022). Design and Evaluation of a Face-Down Embedded SiC Power Module With Low Parasitic Inductance and Low Thermal Resistance. IEEE Transactions on Power Electronics. 38(3). 2799–2804. 9 indexed citations
7.
Li, Li, et al.. (2022). Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(6). 956–963. 31 indexed citations
8.
Feng, Jianyu, et al.. (2022). Multi-scale Equivalent Method and Warpage Simulation of Silicon Microchannel Cooler. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). 1–6. 2 indexed citations
9.
Hou, Fengze, et al.. (2021). Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network. IEEE Transactions on Electron Devices. 68(7). 3460–3467. 19 indexed citations
10.
Wang, Jianing, Xiaohui Liu, Qiang Peng, et al.. (2020). Co-Reduction of Common Mode Noise and Loop Current of Three-Level Active Neutral Point Clamped Inverters. IEEE Journal of Emerging and Selected Topics in Power Electronics. 9(1). 1088–1103. 12 indexed citations
11.
Hou, Fengze, Hengyun Zhang, Jiajie Fan, et al.. (2020). Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm2 Heat Dissipation. IEEE Transactions on Power Electronics. 35(10). 10592–10600. 24 indexed citations
12.
Hou, Fengze, Wenbo Wang, Liqiang Cao, et al.. (2019). Review of Packaging Schemes for Power Module. IEEE Journal of Emerging and Selected Topics in Power Electronics. 8(1). 223–238. 99 indexed citations
13.
Chen, Chuan, Fengze Hou, Meiying Su, et al.. (2019). Pressure Drop and Thermal Characteristic Prediction for Staggered Strip Fin Microchannel. IEEE Transactions on Components Packaging and Manufacturing Technology. 10(3). 435–443. 4 indexed citations
14.
Hou, Fengze, et al.. (2017). Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(10). 1721–1728. 56 indexed citations
15.
Lin, Tingyu, Fengze Hou, Haiyan Liu, et al.. (2016). Warpage simulation and experiment for panel level fan-out package. 14 indexed citations
16.
Hou, Fengze, Fengman Liu, Xiaomeng Wu, et al.. (2014). Thermal management of 3D RF PoP based on ceramic substrate. 2008–2013. 6 indexed citations
17.
Zhang, Xia, et al.. (2013). Thermal-mechanical simulation of embedded module based on organic substrate. 126–136. 4 indexed citations
18.
Hou, Fengze, et al.. (2013). Study on thermo-mechanical reliability of 3D stacked chip SiP based on cavity substrate. 878–881. 1 indexed citations
19.
Yang, Daoguo, et al.. (2011). Thermal performance analysis of photoelectric parameters on high-power LEDs packaging modules. 1/5–5/5. 5 indexed citations
20.
Hou, Fengze, et al.. (2011). Thermal transient analysis of LED array system with in-line pin fin heat sink. 1/5–5/5. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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