H. K. Kim
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 5%
- Aerospace Engineering
- General Materials Science top 2%
- Materials Chemistry
- Topics
- Electronic Packaging and Soldering Technologies (9 papers)Intermetallics and Advanced Alloy Properties (4 papers)3D IC and TSV technologies (4 papers)
- Journals
- Applied Physics LettersJournal of Applied PhysicsJournal of materials research/Pratt's guide to venture capital sources
- Partner nations
- United StatesItaly
In The Last Decade
H. K. Kim
8 papers receiving 505 citations
Peers
Comparison fields: 5 of 18
- Electrical and Electronic Engineering 502
- Mechanical Engineering 364
- Aerospace Engineering 67
- General Materials Science 47
- Materials Chemistry 39
Countries citing papers authored by H. K. Kim
This map shows the geographic impact of H. K. Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. K. Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. K. Kim more than expected).
Fields of papers citing papers by H. K. Kim
This network shows the impact of papers produced by H. K. Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. K. Kim. The network helps show where H. K. Kim may publish in the future.
Co-authorship network of co-authors of H. K. Kim
This figure shows the co-authorship network connecting the top 25 collaborators of H. K. Kim. A scholar is included among the top collaborators of H. K. Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. K. Kim. H. K. Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 41 | |
| 3 | 88 | |
| 4 | 110 | |
| 5 | 44 | |
| 6 | 57 | |
| 7 | 3 | |
| 8 | 12 | |
| 9 | 171 |
About H. K. Kim
H. K. Kim is a scholar working on General Materials Science, Mechanical Engineering and Electrical and Electronic Engineering, having authored 9 papers that have together received 526 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (9 papers), Intermetallics and Advanced Alloy Properties (4 papers) and 3D IC and TSV technologies (4 papers). The work is most often cited by research in General Materials Science (47 citations), Mechanical Engineering (364 citations) and Electrical and Electronic Engineering (502 citations). H. K. Kim has collaborated with scholars based in United States and Italy. Frequent co-authors include K. N. Tu, H. K. Liou, P. A. Totta, K. N. Tu, C. Y. Liu, G. Z. Pan, Youngwoo Lee, Choong-Un Kim, Seulgi Lee and Tae-Kyu Lee. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.