Chi-Won Hwang

580 total citations
13 papers, 512 citations indexed

About

Chi-Won Hwang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Chi-Won Hwang has authored 13 papers receiving a total of 512 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 2 papers in Mechanics of Materials. Recurrent topics in Chi-Won Hwang's work include Electronic Packaging and Soldering Technologies (11 papers), Intermetallics and Advanced Alloy Properties (8 papers) and Advanced Welding Techniques Analysis (4 papers). Chi-Won Hwang is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Intermetallics and Advanced Alloy Properties (8 papers) and Advanced Welding Techniques Analysis (4 papers). Chi-Won Hwang collaborates with scholars based in Japan, United States and South Korea. Chi-Won Hwang's co-authors include Katsuaki Suganuma, Keun‐Soo Kim, Young‐Sun Kim, Shigeo Hashimoto, Jung-Goo Lee, H. Mori, Hirotaro Mori, Taek‐Sung Hwang, Jong‐Min Kim and Mi‐Suk Shin and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and Journal of materials research/Pratt's guide to venture capital sources.

In The Last Decade

Chi-Won Hwang

12 papers receiving 492 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chi-Won Hwang Japan 10 489 396 95 58 25 13 512
Zhong Sheng China 11 534 1.1× 476 1.2× 105 1.1× 38 0.7× 28 1.1× 15 575
H. K. Kim United States 7 502 1.0× 364 0.9× 67 0.7× 47 0.8× 39 1.6× 9 526
J. K. Lin United States 6 606 1.2× 428 1.1× 115 1.2× 41 0.7× 30 1.2× 8 616
M. Li Singapore 9 535 1.1× 404 1.0× 57 0.6× 46 0.8× 23 0.9× 10 557
L. Zavalij United States 12 492 1.0× 351 0.9× 129 1.4× 45 0.8× 61 2.4× 14 523
G.Y. Li Singapore 8 298 0.6× 261 0.7× 71 0.7× 20 0.3× 28 1.1× 12 352
Moon Gi Cho South Korea 15 520 1.1× 381 1.0× 123 1.3× 53 0.9× 42 1.7× 26 554
J. W. Jang United States 5 385 0.8× 292 0.7× 74 0.8× 28 0.5× 31 1.2× 6 396
Sang-Won Kim South Korea 7 510 1.0× 430 1.1× 44 0.5× 32 0.6× 9 0.4× 11 517
Polina Snugovsky Canada 12 344 0.7× 212 0.5× 88 0.9× 21 0.4× 33 1.3× 30 372

Countries citing papers authored by Chi-Won Hwang

Since Specialization
Citations

This map shows the geographic impact of Chi-Won Hwang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chi-Won Hwang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chi-Won Hwang more than expected).

Fields of papers citing papers by Chi-Won Hwang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chi-Won Hwang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chi-Won Hwang. The network helps show where Chi-Won Hwang may publish in the future.

Co-authorship network of co-authors of Chi-Won Hwang

This figure shows the co-authorship network connecting the top 25 collaborators of Chi-Won Hwang. A scholar is included among the top collaborators of Chi-Won Hwang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chi-Won Hwang. Chi-Won Hwang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

13 of 13 papers shown
1.
Hwang, Chi-Won, et al.. (2014). Synthesis of a quaternarized poly(vinylimidazole-co-trifluoroethylmethacrylate-co-divinylbenzene) anion-exchange membrane for nitrate removal. Journal of environmental chemical engineering. 2(4). 2162–2169. 10 indexed citations
2.
3.
Suh, Daewoong, et al.. (2007). A novel low-temperature solder based on intermetallic-compound phases with superior high-homologous temperature properties. Materials Letters. 62(12-13). 2017–2020. 1 indexed citations
4.
Han, Chang-Hyun, et al.. (2006). Effectiveness of Hwang-gu acupuncture treatment in hypertension patients; case report. Korean Journal of Acupuncture. 23(3). 37–50. 2 indexed citations
5.
Hwang, Chi-Won & Katsuaki Suganuma. (2004). Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS. 45(3). 714–720. 17 indexed citations
6.
Kim, Keun‐Soo, Katsuaki Suganuma, Chi-Won Hwang, & Jong‐Min Kim. (2004). The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging. JOM. 56(6). 39–43. 9 indexed citations
7.
Hwang, Chi-Won, et al.. (2004). Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating. Journal of Electronic Materials. 33(10). 1200–1209. 21 indexed citations
8.
Hwang, Chi-Won & Katsuaki Suganuma. (2004). Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates. Materials Science and Engineering A. 373(1-2). 187–194. 22 indexed citations
9.
Hwang, Chi-Won, et al.. (2003). Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders. Journal of materials research/Pratt's guide to venture capital sources. 18(11). 2540–2543. 77 indexed citations
10.
Hwang, Chi-Won, Jung-Goo Lee, Katsuaki Suganuma, & Hirotaro Mori. (2003). Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating. Journal of Electronic Materials. 32(2). 52–62. 45 indexed citations
11.
Kim, Young‐Sun, Keun‐Soo Kim, Chi-Won Hwang, & Katsuaki Suganuma. (2003). Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys. Journal of Alloys and Compounds. 352(1-2). 237–245. 204 indexed citations
12.
Hwang, Chi-Won, Keun‐Soo Kim, & Katsuaki Suganuma. (2003). Interfaces in lead-free soldering. Journal of Electronic Materials. 32(11). 1249–1256. 59 indexed citations
13.
Hwang, Chi-Won, Katsuaki Suganuma, Jung-Goo Lee, & H. Mori. (2003). Interface microstructure between Fe-42Ni alloy and pure Sn. Journal of materials research/Pratt's guide to venture capital sources. 18(5). 1202–1210. 45 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Zhong Sheng Breakdown of academic impact, for papers by H. K. Kim Breakdown of academic impact, for papers by J. K. Lin Breakdown of academic impact, for papers by M. Li Breakdown of academic impact, for papers by L. Zavalij Breakdown of academic impact, for papers by G.Y. Li Breakdown of academic impact, for papers by Moon Gi Cho Breakdown of academic impact, for papers by J. W. Jang Breakdown of academic impact, for papers by Sang-Won Kim Breakdown of academic impact, for papers by Polina Snugovsky
Rankless by CCL
2026