Richard Coyle

1.1k total citations
64 papers, 800 citations indexed

About

Richard Coyle is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, Richard Coyle has authored 64 papers receiving a total of 800 indexed citations (citations by other indexed papers that have themselves been cited), including 56 papers in Electrical and Electronic Engineering, 29 papers in Mechanical Engineering and 9 papers in Aerospace Engineering. Recurrent topics in Richard Coyle's work include Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (29 papers) and Aluminum Alloy Microstructure Properties (9 papers). Richard Coyle is often cited by papers focused on Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (29 papers) and Aluminum Alloy Microstructure Properties (9 papers). Richard Coyle collaborates with scholars based in United States, United Kingdom and Japan. Richard Coyle's co-authors include Babak Arfaei, Maurice N. Collins, Jeff Punch, C.M. Gourlay, Jingwei Xian, Anthony Primavera, Fionn P.E. Dunne, Yilun Xu, Charles W. Buffington and Stoyan Stoyanov and has published in prestigious journals such as Nature Communications, Anesthesiology and Journal of Materials Science.

In The Last Decade

Richard Coyle

59 papers receiving 752 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Richard Coyle United States 17 679 440 151 115 95 64 800
B. D. Dunn Netherlands 14 198 0.3× 251 0.6× 179 1.2× 86 0.7× 232 2.4× 49 582
Amit Sarkhel United States 8 674 1.0× 562 1.3× 222 1.5× 65 0.6× 78 0.8× 12 811
E. V. Yakovlev Russia 12 88 0.1× 210 0.5× 69 0.5× 178 1.5× 207 2.2× 64 455
Kei Shinozuka India 17 118 0.2× 652 1.5× 276 1.8× 166 1.4× 507 5.3× 78 812
H. D. Solomon United States 17 546 0.8× 846 1.9× 148 1.0× 482 4.2× 363 3.8× 41 1.2k
G.-X. Wang United States 11 145 0.2× 306 0.7× 148 1.0× 71 0.6× 120 1.3× 41 479
Munshi Basit United States 11 380 0.6× 268 0.6× 145 1.0× 95 0.8× 27 0.3× 20 475
Berndt Brenner Germany 14 53 0.1× 515 1.2× 148 1.0× 97 0.8× 110 1.2× 61 598
Hisao Esaka Japan 19 151 0.2× 919 2.1× 539 3.6× 227 2.0× 836 8.8× 104 1.2k
Jan Boháček Austria 14 91 0.1× 402 0.9× 158 1.0× 43 0.4× 189 2.0× 55 550

Countries citing papers authored by Richard Coyle

Since Specialization
Citations

This map shows the geographic impact of Richard Coyle's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Richard Coyle with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Richard Coyle more than expected).

Fields of papers citing papers by Richard Coyle

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Richard Coyle. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Richard Coyle. The network helps show where Richard Coyle may publish in the future.

Co-authorship network of co-authors of Richard Coyle

This figure shows the co-authorship network connecting the top 25 collaborators of Richard Coyle. A scholar is included among the top collaborators of Richard Coyle based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Richard Coyle. Richard Coyle is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hsieh, Chen-Lin, Richard Coyle, & C.M. Gourlay. (2025). Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling. Journal of Electronic Materials. 54(4). 2657–2671. 3 indexed citations
2.
Xian, Jingwei, Yilun Xu, Stoyan Stoyanov, et al.. (2024). The role of microstructure in the thermal fatigue of solder joints. Nature Communications. 15(1). 4258–4258. 22 indexed citations
3.
4.
Hamid, Muhammad Azmi Abdul, Brunella Franco, Alina M. Allen, et al.. (2024). In Situ Study of Electromigration in Eutectic Tin-Bismuth Planar Solder Joints. 1–6. 2 indexed citations
5.
Pearson, T. J., et al.. (2024). Intermetallic Compounds in Solder Alloys: Common Misconceptions. 37(2). 19–33.
6.
Rafanelli, Anthony J., et al.. (2023). Pb-Free Solders and Aerospace/Defense (A&D) High Performance Considerations. 36(2). 8–31. 5 indexed citations
7.
Xu, Yilun, Jingwei Xian, Stoyan Stoyanov, et al.. (2022). A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity. 155. 103308–103308. 50 indexed citations
8.
9.
Coyle, Richard, Richard D. Parker, Michael Osterman, et al.. (2018). Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys. 20(1). 1 indexed citations
10.
Coyle, Richard, Richard D. Parker, Michael Osterman, et al.. (2018). The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys. 20(1). 1 indexed citations
11.
12.
13.
Collins, Maurice N., et al.. (2011). Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(10). 1594–1600. 39 indexed citations
14.
Coyle, Richard, et al.. (2011). Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(10). 1583–1593. 35 indexed citations
15.
Coyle, Richard, et al.. (2002). Reliability performance and failure mode of high I/O thermally enhanced ball grid array packages. 57. 323–332. 11 indexed citations
16.
Coyle, Richard, et al.. (2000). Electrostatic discharge failure mechanism for cordless phone charge contacts. Journal of Electrostatics. 49(3-4). 215–223. 2 indexed citations
17.
Buffington, Charles W., Richard Coyle, & Seiji Watanabe. (1993). Regional Load Dependence of Postischemic Myocardium. Journal of Cardiac Surgery. 8(S2). 291–294. 2 indexed citations
18.
Buffington, Charles W. & Richard Coyle. (1991). Altered Load Dependence of Postischemic Myocardium. Anesthesiology. 75(3). 464–474. 23 indexed citations
19.
Coyle, Richard, et al.. (1972). Constitution of the tin-rich and bismuth-rich regions of the tin-bismuth-arsenic ternary system. Journal of the Less Common Metals. 26(2). 263–272. 3 indexed citations
20.
Coyle, Richard, et al.. (1972). The ternary subsystem Sn4As3-Bi-SnAs. Journal of Materials Science. 7(9). 989–994. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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