M. Li

645 total citations
10 papers, 557 citations indexed

About

M. Li is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, M. Li has authored 10 papers receiving a total of 557 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 2 papers in Aerospace Engineering. Recurrent topics in M. Li's work include Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (8 papers) and Intermetallics and Advanced Alloy Properties (4 papers). M. Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (8 papers) and Intermetallics and Advanced Alloy Properties (4 papers). M. Li collaborates with scholars based in Singapore, United States and Hong Kong. M. Li's co-authors include K. N. Tu, Andriy Gusak, Chan Choy Chum, Ke Zeng, H. Balkan, P. Elenius, Zhongcai Shao, K. N. Tu, Bavani Balakrisnan and Zhong Chen and has published in prestigious journals such as Journal of Applied Physics, Journal of materials research/Pratt's guide to venture capital sources and Metallurgical and Materials Transactions A.

In The Last Decade

M. Li

9 papers receiving 542 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
M. Li Singapore	9	535	404	61	57	46	10	557
H. K. Kim United States	7	502 0.9×	364 0.9×	38 0.6×	67 1.2×	47 1.0×	9	526
J. K. Lin United States	6	606 1.1×	428 1.1×	54 0.9×	115 2.0×	41 0.9×	8	616
Moon Gi Cho South Korea	15	520 1.0×	381 0.9×	48 0.8×	123 2.2×	53 1.2×	26	554
Guangchen Xu China	13	368 0.7×	232 0.6×	112 1.8×	24 0.4×	31 0.7×	25	390
L. Zavalij United States	12	492 0.9×	351 0.9×	23 0.4×	129 2.3×	45 1.0×	14	523
Chi-Won Hwang Japan	10	489 0.9×	396 1.0×	14 0.2×	95 1.7×	58 1.3×	13	512
N. Kurokawa Japan	9	425 0.8×	455 1.1×	30 0.5×	148 2.6×	82 1.8×	10	560
J. Read Australia	14	630 1.2×	478 1.2×	25 0.4×	147 2.6×	74 1.6×	21	668
King-Ning Tu United States	4	307 0.6×	136 0.3×	107 1.8×	32 0.6×	17 0.4×	6	338
Brook Chao United States	7	431 0.8×	203 0.5×	171 2.8×	48 0.8×	15 0.3×	12	453

Countries citing papers authored by M. Li

Since Specialization

Citations

This map shows the geographic impact of M. Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Li more than expected).

Fields of papers citing papers by M. Li

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Li. The network helps show where M. Li may publish in the future.

Co-authorship network of co-authors of M. Li

This figure shows the co-authorship network connecting the top 25 collaborators of M. Li. A scholar is included among the top collaborators of M. Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Li. M. Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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10 of 10 papers shown

1.

Tsao, L.C., et al.. (2024). Joining of SiO2 glass and substrate using In49Sn active solder in air. Journal of Materials Science Materials in Electronics. 35(1).

2.

Law, C., Chi‐Man Lawrence Wu, Daquan Yu, M. Li, & Dongzhi Chi. (2005). Interfacial microstructure and strength of lead-free Sn-Zn-RE BGA solder bumps. IEEE Transactions on Advanced Packaging. 28(2). 252–258. 16 indexed citations

3.

Balakrisnan, Bavani, et al.. (2003). Fracture toughness of Cu-Sn intermetallic thin films. Journal of Electronic Materials. 32(3). 166–171. 30 indexed citations

4.

Li, M., et al.. (2003). Effects of substrate metallization of solder/under-bump metallization interfacial reactions in flip-chip packages during multiple reflow cycles. Journal of Electronic Materials. 32(3). 123–130. 35 indexed citations

5.

Li, M., et al.. (2003). Interfacial microstructure evolution in Pb-free solder systems. Journal of Electronic Materials. 32(8). 906–912. 25 indexed citations

6.

Li, M., et al.. (2003). Effects of substrate metallizations on solder/underbump metallization interfacial reactions in flip-chip packages during thermal aging. Journal of materials research/Pratt's guide to venture capital sources. 18(6). 1333–1341. 15 indexed citations

7.

Tu, K. N., Andriy Gusak, & M. Li. (2003). Physics and materials challenges for lead-free solders. Journal of Applied Physics. 93(3). 1335–1353. 307 indexed citations

8.

Li, M., et al.. (2002). Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films. Journal of materials research/Pratt's guide to venture capital sources. 17(7). 1612–1621. 77 indexed citations

9.

Li, M., et al.. (2002). Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages. Journal of materials research/Pratt's guide to venture capital sources. 17(11). 2757–2760. 31 indexed citations

10.

Li, M., et al.. (2001). Formation of intermetallic compounds in SnPbAg, SnAg, and SnAgCu solders on Ni/Au metallization. Metallurgical and Materials Transactions A. 32(10). 2666–2668. 21 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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