Min Ding
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in ⓘ
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- Electronic Packaging and Soldering Technologies 21
- 3D IC and TSV technologies 16
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- Advanced Welding Techniques Analysis 4
- Intermetallics and Advanced Alloy Properties 3
- Advanced Materials and Mechanics 2
- Co-authors
- Paul S. Ho (11 shared papers)Peng Su (9 shared papers)Brook Chao (3 shared papers)Guotao Wang (2 shared papers)Kuan-Hsun Lu (3 shared papers)Xuefeng Zhang (3 shared papers)Jay Im (1 shared paper)Xiang Dai (1 shared paper)
- Journals
- Sensors and Actuators A Physical (2 papers)Journal of Applied Physics (2 papers)Journal of Applied Polymer Science (1 paper)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)Journal of Materials Science Materials in Electronics (1 paper)
- Partner nations
- United StatesChinaMalaysia
In The Last Decade
Min Ding
28 papers receiving 501 citations
Peers
Comparison fields: 5 of 38
- Electronic, Optical and Magnetic Materials 173
- Electrical and Electronic Engineering 434
- Mechanical Engineering 220
- General Materials Science 10
- Aerospace Engineering 53
Countries citing papers authored by Min Ding
This map shows the geographic impact of Min Ding's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Min Ding with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Min Ding more than expected).
Fields of papers citing papers by Min Ding
This network shows the impact of papers produced by Min Ding. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Min Ding. The network helps show where Min Ding may publish in the future.
Co-authors
The 25 scholars most cited alongside Min Ding, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 94 | |
| 2 | 2006 | 70 | |
| 3 | 2004 | 59 | |
| 4 | 2022 | 41 | |
| 5 | 2009 | 34 | |
| 6 | 2006 | 31 | |
| 7 | 2006 | 28 | |
| 8 | 2003 | 25 | |
| 9 | 2021 | 17 | |
| 10 | 2005 | 17 | |
| 11 | 2006 | 17 | |
| 12 | 2005 | 16 | |
| 13 | 2022 | 15 | |
| 14 | 2009 | 10 | |
| 15 | 2008 | 9 | |
| 16 | 2005 | 9 | |
| 17 | 2004 | 7 | |
| 18 | 2005 | 5 | |
| 19 | 2024 | 4 | |
| 20 | 2011 | 4 |
About Min Ding
Min Ding is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Mechanics of Materials, having authored 29 papers that have together received 527 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (16 papers), Copper Interconnects and Reliability (7 papers), Advanced Welding Techniques Analysis (4 papers), Dielectric materials and actuators (3 papers), Advanced Sensor and Energy Harvesting Materials (3 papers), Intermetallics and Advanced Alloy Properties (3 papers) and Advanced Materials and Mechanics (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (173 citations), Electrical and Electronic Engineering (434 citations), Mechanical Engineering (220 citations), General Materials Science (10 citations) and Aerospace Engineering (53 citations). Min Ding has collaborated with scholars based in United States, China and Malaysia. Frequent co-authors include Paul S. Ho, Peng Su, Brook Chao, Guotao Wang, Kuan-Hsun Lu, Xuefeng Zhang, Jay Im, Xiang Dai, Jie-Hua Zhao and Qiaohang Guo. Their work appears in journals such as Sensors and Actuators A Physical, Journal of Applied Physics, Journal of Applied Polymer Science, IEEE Transactions on Electronics Packaging Manufacturing and Journal of Materials Science Materials in Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.