Scott Pollard

516 total citations
39 papers, 380 citations indexed

About

Scott Pollard is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Scott Pollard has authored 39 papers receiving a total of 380 indexed citations (citations by other indexed papers that have themselves been cited), including 37 papers in Electrical and Electronic Engineering, 8 papers in Automotive Engineering and 8 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Scott Pollard's work include 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (26 papers) and Copper Interconnects and Reliability (8 papers). Scott Pollard is often cited by papers focused on 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (26 papers) and Copper Interconnects and Reliability (8 papers). Scott Pollard collaborates with scholars based in United States, Taiwan and South Korea. Scott Pollard's co-authors include Chukwudi Okoro, Aric Shorey, Garrett A. Piech, Shrisudersan Jayaraman, Seungbae Park, Ke Pan, Yangyang Lai, Róbert Wágner, Tengfei Jiang and Jiefeng Xu and has published in prestigious journals such as Journal of The Electrochemical Society, ACS Applied Materials & Interfaces and Microelectronics Reliability.

In The Last Decade

Scott Pollard

39 papers receiving 354 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Scott Pollard United States 14 338 84 57 54 33 39 380
Vasarla Nagendra Sekhar Singapore 11 417 1.2× 80 1.0× 65 1.1× 50 0.9× 24 0.7× 64 456
Venkatesh Sundaram United States 13 366 1.1× 77 0.9× 43 0.8× 26 0.5× 49 1.5× 23 407
Chai Tai Chong Singapore 10 422 1.2× 78 0.9× 46 0.8× 67 1.2× 33 1.0× 50 463
Ser Choong Chong Singapore 12 446 1.3× 99 1.2× 60 1.1× 46 0.9× 12 0.4× 96 488
Nitesh Kumbhat United States 11 398 1.2× 109 1.3× 55 1.0× 41 0.8× 19 0.6× 31 475
R. Kahle Germany 13 312 0.9× 63 0.8× 50 0.9× 36 0.7× 16 0.5× 35 372
C. T. Wang Taiwan 10 338 1.0× 62 0.7× 31 0.5× 37 0.7× 10 0.3× 13 379
John Slabbekoorn Belgium 13 373 1.1× 88 1.0× 33 0.6× 69 1.3× 7 0.2× 57 401
Kenneth June Rebibis Belgium 14 513 1.5× 167 2.0× 102 1.8× 43 0.8× 13 0.4× 76 554
Chau‐Jie Zhan Taiwan 14 451 1.3× 75 0.9× 89 1.6× 61 1.1× 15 0.5× 56 475

Countries citing papers authored by Scott Pollard

Since Specialization
Citations

This map shows the geographic impact of Scott Pollard's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Scott Pollard with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Scott Pollard more than expected).

Fields of papers citing papers by Scott Pollard

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Scott Pollard. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Scott Pollard. The network helps show where Scott Pollard may publish in the future.

Co-authorship network of co-authors of Scott Pollard

This figure shows the co-authorship network connecting the top 25 collaborators of Scott Pollard. A scholar is included among the top collaborators of Scott Pollard based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Scott Pollard. Scott Pollard is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Pan, Ke, et al.. (2023). High-Temperature Constitutive Behavior of Electroplated Copper TGV Through Numerical Simulation. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(11). 1861–1867. 4 indexed citations
2.
3.
Pan, Ke, et al.. (2022). A comparative study of the thermomechanical reliability of fully-filled and conformal through-glass via. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1211–1217. 13 indexed citations
4.
5.
Okoro, Chukwudi, et al.. (2021). Elimination of Thermo-Mechanically Driven Circumferential Crack Formation in Copper Through-Glass via Substrate. IEEE Transactions on Device and Materials Reliability. 21(3). 354–360. 14 indexed citations
6.
Okoro, Chukwudi, Shrisudersan Jayaraman, & Scott Pollard. (2021). Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates. Microelectronics Reliability. 120. 114092–114092. 23 indexed citations
7.
Okoro, Chukwudi, et al.. (2021). Time and Temperature Dependence of Copper Protrusion in Metallized Through-Glass Vias (TGVs) Fabricated in Fused Silica Substrate. IEEE Transactions on Device and Materials Reliability. 21(1). 129–136. 14 indexed citations
8.
Okoro, Chukwudi, Shrisudersan Jayaraman, & Scott Pollard. (2021). Monitoring of the Effect of Thermal Shock on Crack Growth in Copper Through-Glass Via Substrates. 7 indexed citations
9.
Okoro, Chukwudi, et al.. (2020). The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study. Multidiscipline Modeling in Materials and Structures. 17(2). 451–464. 13 indexed citations
10.
Pollard, Scott, et al.. (2019). Characterization and Electrical Performance of Glass Diplexer Modules. IMAPSource Proceedings. 2019(1). 393–397. 1 indexed citations
11.
Lombardi, Jack P., James H. Schaffner, Hyok J. Song, et al.. (2018). Copper Transparent Antennas on Flexible Glass by Subtractive and Semi-Additive Fabrication for Automotive Applications. 2107–2115. 17 indexed citations
12.
Lin, Hung‐Yi, et al.. (2018). Communication—Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass. Journal of The Electrochemical Society. 166(1). D3155–D3157. 23 indexed citations
13.
Poliks, Mark D., Jack P. Lombardi, Charles R. Westgate, et al.. (2017). Transparent Antennas for Wireless Systems Based on Patterned Indium Tin Oxide and Flexible Glass. 1443–1448. 15 indexed citations
14.
Chen, Yi‐Jiun, Sean Garner, Scott Pollard, et al.. (2016). 68‐4: Demonstration of the Novel Ultra‐Slim Flexible Glass as Substrate with Metal Meshed Antenna. SID Symposium Digest of Technical Papers. 47(1). 937–939. 1 indexed citations
15.
16.
Shorey, Aric & Scott Pollard. (2014). Progress in Fabrication and Test of Glass Interposer Substrates. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2014(DPC). 1239–1258. 1 indexed citations
17.
Shorey, Aric & Scott Pollard. (2014). Glass Substrates for Advanced Packaging. IMAPSource Proceedings. 2014(1). 388–392. 4 indexed citations
18.
Shorey, Aric, et al.. (2013). Glass Interposer Substrates: Fabrication, Characterization and Modeling. IMAPSource Proceedings. 2013(1). 625–630. 9 indexed citations
19.
Shorey, Aric, et al.. (2012). Development of substrates for through glass vias (TGV) for 3DS-IC integration. 39 indexed citations
20.
Pollard, Scott, et al.. (2004). CpW transmission lines on silicon supporting 10G/40G InP EAM chip on carrier applications. 11. 308–311. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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