Scott Pollard
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor Lasers and Optical Devices
- Microwave Engineering and Waveguides
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in ⓘ
-
- 3D IC and TSV technologies 30
- Electronic Packaging and Soldering Technologies 26
- Semiconductor Lasers and Optical Devices 6
- Thin-Film Transistor Technologies 4
-
- Additive Manufacturing and 3D Printing Technologies 8
- Co-authors
- Chukwudi Okoro (15 shared papers)Aric Shorey (11 shared papers)Garrett A. Piech (4 shared papers)Shrisudersan Jayaraman (2 shared papers)Seungbae Park (5 shared papers)Ke Pan (5 shared papers)Yangyang Lai (5 shared papers)Róbert Wágner (1 shared paper)
- Journals
- Microelectronics Reliability (3 papers)IEEE Transactions on Device and Materials Reliability (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)ACS Applied Materials & Interfaces (1 paper)Journal of The Electrochemical Society (1 paper)
- Partner nations
- United StatesTaiwanSouth Korea
In The Last Decade
Scott Pollard
39 papers receiving 354 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 338
- Automotive Engineering 57
- Electronic, Optical and Magnetic Materials 54
- Biomedical Engineering 84
- Aerospace Engineering 33
Countries citing papers authored by Scott Pollard
This map shows the geographic impact of Scott Pollard's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Scott Pollard with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Scott Pollard more than expected).
Fields of papers citing papers by Scott Pollard
This network shows the impact of papers produced by Scott Pollard. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Scott Pollard. The network helps show where Scott Pollard may publish in the future.
Co-authors
The 25 scholars most cited alongside Scott Pollard, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 39 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 39 | |
| 2 | 2014 | 33 | |
| 3 | 2013 | 26 | |
| 4 | 2021 | 23 | |
| 5 | 2018 | 23 | |
| 6 | 2020 | 23 | |
| 7 | 2021 | 20 | |
| 8 | 2018 | 17 | |
| 9 | 2022 | 17 | |
| 10 | 2017 | 15 | |
| 11 | 2021 | 14 | |
| 12 | 2021 | 14 | |
| 13 | 2022 | 13 | |
| 14 | 2020 | 13 | |
| 15 | 2023 | 11 | |
| 16 | 2013 | 10 | |
| 17 | 2013 | 9 | |
| 18 | 2021 | 8 | |
| 19 | 2021 | 7 | |
| 20 | 2022 | 5 |
About Scott Pollard
Scott Pollard is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Aerospace Engineering, having authored 39 papers that have together received 380 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (30 papers), Electronic Packaging and Soldering Technologies (26 papers), Copper Interconnects and Reliability (8 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Semiconductor Lasers and Optical Devices (6 papers), Thin-Film Transistor Technologies (4 papers), Advanced Antenna and Metasurface Technologies (3 papers) and Nanofabrication and Lithography Techniques (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (338 citations), Automotive Engineering (57 citations), Electronic, Optical and Magnetic Materials (54 citations), Biomedical Engineering (84 citations) and Aerospace Engineering (33 citations). Scott Pollard has collaborated with scholars based in United States, Taiwan and South Korea. Frequent co-authors include Chukwudi Okoro, Aric Shorey, Garrett A. Piech, Shrisudersan Jayaraman, Seungbae Park, Ke Pan, Yangyang Lai, Róbert Wágner, Tengfei Jiang and Jiefeng Xu. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, ACS Applied Materials & Interfaces and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.