Ke Pan
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering
- Mechanics of Materials top 10%
- Industrial and Manufacturing Engineering top 10%
- Biomedical Engineering
- Co-authors
- Seungbae ParkJiefeng XuYangyang LaiHuayan WangChukwudi OkoroScott PollardJing WangWenting Zhao
- Topics
- Electronic Packaging and Soldering Technologies (22 papers)3D IC and TSV technologies (21 papers)Integrated Circuits and Semiconductor Failure Analysis (5 papers)
- Cited by
- Industrial and Manufacturing EngineeringElectrical and Electronic EngineeringMechanics of Materials
- Journals
- IEEE Journal of Emerging and Selected Topics in Power ElectronicsMicroelectronics ReliabilityGeotechnical and Geological Engineering
- Partner nations
- United StatesChina
In The Last Decade
Ke Pan
40 papers receiving 449 citations
Peers
Comparison fields: 5 of 45
- Electrical and Electronic Engineering 331
- Mechanical Engineering 116
- Mechanics of Materials 94
- Industrial and Manufacturing Engineering 59
- Biomedical Engineering 45
Countries citing papers authored by Ke Pan
This map shows the geographic impact of Ke Pan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ke Pan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ke Pan more than expected).
Fields of papers citing papers by Ke Pan
This network shows the impact of papers produced by Ke Pan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ke Pan. The network helps show where Ke Pan may publish in the future.
Co-authorship network of co-authors of Ke Pan
This figure shows the co-authorship network connecting the top 25 collaborators of Ke Pan. A scholar is included among the top collaborators of Ke Pan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ke Pan. Ke Pan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 10 | |
| 2 | 4 | |
| 3 | 8 | |
| 4 | 19 | |
| 5 | 13 | |
| 6 | 10 | |
| 7 | 16 | |
| 8 | 3 | |
| 9 | 25 | |
| 10 | 14 | |
| 11 | 21 | |
| 12 | 12 | |
| 13 | 5 | |
| 14 | 0 | |
| 15 | 0 | |
| 16 | Application of SVM in Safety Evaluation for Oilery Railway Siding and Ancillary Facilities | 0 |
| 17 | Heat Transfer Numerical Simulation of Groundwater Heat Source Wells under Coupled Thermal Conduction and Groundwater Advection Conditions | 3 |
| 18 | Development and Application of the Software on Flammable,Explosive & Toxic cloud Diffusion Based on JAVA Technique | 1 |
| 19 | Breakthrough in early safety warning system for civil aviation airport based on BP neural network | 2 |
| 20 | Application of weight-variable theory and the relative difference functions to construction fire risk assessment | 1 |
About Ke Pan
Ke Pan is a scholar working on Ecological Modeling, General Engineering and Safety, Risk, Reliability and Quality, having authored 43 papers that have together received 461 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (21 papers) and Integrated Circuits and Semiconductor Failure Analysis (5 papers). The work is most often cited by research in Industrial and Manufacturing Engineering (59 citations), Electrical and Electronic Engineering (331 citations) and Mechanics of Materials (94 citations). Ke Pan has collaborated with scholars based in United States and China. Frequent co-authors include Seungbae Park, Jiefeng Xu, Yangyang Lai, Huayan Wang, Chukwudi Okoro, Scott Pollard, Jing Wang, Wenting Zhao, Shengcai Liao and Wenhui Zhu. Their work appears in journals such as IEEE Journal of Emerging and Selected Topics in Power Electronics, Microelectronics Reliability and Geotechnical and Geological Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.