Ke Pan

670 total citations
43 papers, 461 citations indexed

About

Ke Pan is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Ke Pan has authored 43 papers receiving a total of 461 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 8 papers in Mechanical Engineering. Recurrent topics in Ke Pan's work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (21 papers) and Integrated Circuits and Semiconductor Failure Analysis (5 papers). Ke Pan is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (21 papers) and Integrated Circuits and Semiconductor Failure Analysis (5 papers). Ke Pan collaborates with scholars based in United States and China. Ke Pan's co-authors include Seungbae Park, Jiefeng Xu, Yangyang Lai, Huayan Wang, Chukwudi Okoro, Scott Pollard, Jing Wang, Wenting Zhao, Shengcai Liao and Wenhui Zhu and has published in prestigious journals such as IEEE Journal of Emerging and Selected Topics in Power Electronics, Microelectronics Reliability and Geotechnical and Geological Engineering.

In The Last Decade

Ke Pan

40 papers receiving 449 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Ke Pan United States	15	331	116	94	59	45	43	461
Jianbiao Pan United States	13	249 0.8×	109 0.9×	65 0.7×	51 0.9×	41 0.9×	37	367
Qiangqiang Zhao China	15	125 0.4×	169 1.5×	58 0.6×	49 0.8×	37 0.8×	51	513
Chuang Zhang China	12	204 0.6×	143 1.2×	111 1.2×	24 0.4×	22 0.5×	65	416
Ziwei Zhang China	7	130 0.4×	131 1.1×	57 0.6×	26 0.4×	9 0.2×	16	368
Junci Cao China	13	445 1.3×	301 2.6×	64 0.7×	41 0.7×	35 0.8×	66	656
You Zhao China	14	228 0.7×	239 2.1×	41 0.4×	57 1.0×	172 3.8×	44	464
Michael Masuch Germany	9	218 0.7×	177 1.5×	66 0.7×	73 1.2×	24 0.5×	25	425
Gamal Refai-Ahmed United States	13	275 0.8×	183 1.6×	43 0.5×	13 0.2×	33 0.7×	77	459
S. Taib Malaysia	9	242 0.7×	52 0.4×	84 0.9×	32 0.5×	13 0.3×	25	355
Sung‐Il Kim South Korea	12	407 1.2×	212 1.8×	61 0.6×	38 0.6×	16 0.4×	46	591

Countries citing papers authored by Ke Pan

Since Specialization

Citations

This map shows the geographic impact of Ke Pan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ke Pan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ke Pan more than expected).

Fields of papers citing papers by Ke Pan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ke Pan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ke Pan. The network helps show where Ke Pan may publish in the future.

Co-authorship network of co-authors of Ke Pan

This figure shows the co-authorship network connecting the top 25 collaborators of Ke Pan. A scholar is included among the top collaborators of Ke Pan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ke Pan. Ke Pan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Lai, Yangyang, Ke Pan, & Seungbae Park. (2024). Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review. Microelectronics Reliability. 161. 115477–115477. 10 indexed citations

Pan, Ke, et al.. (2023). High-Temperature Constitutive Behavior of Electroplated Copper TGV Through Numerical Simulation. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(11). 1861–1867. 4 indexed citations

Zhu, Wenhui, et al.. (2022). Investigation of Vehicle-Oriented Double-Sided Cooling Power Module With BGA Technology. IEEE Journal of Emerging and Selected Topics in Power Electronics. 10(5). 6171–6179. 8 indexed citations

Lai, Yangyang, et al.. (2022). Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(3). 562–569. 19 indexed citations

Pan, Ke, et al.. (2022). A comparative study of the thermomechanical reliability of fully-filled and conformal through-glass via. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1211–1217. 13 indexed citations

Lai, Yangyang, et al.. (2022). Shape Dependency of Fatigue Life in Solder Joints of Chip Resistors. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1489–1494. 10 indexed citations

Huang, Qiang, Qin Fang, Ke Pan, et al.. (2021). Investigation on the Reliability of Die-Attach Structures for Double-Sided Cooling Power Module. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(5). 793–801. 16 indexed citations

Zhao, Wenting, et al.. (2021). Research on Meso-mechanism of Failure Mode of Tunnel in Jointed Rock Mass. Geotechnical and Geological Engineering. 39(6). 4329–4339. 3 indexed citations

Pan, Ke, et al.. (2020). An Analysis of Solder Joint Formation and Self-Alignment of Chip Capacitors. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(1). 161–168. 25 indexed citations

10.

Pan, Ke, et al.. (2020). The Effect of Misaligned Passive Component on Fatigue Life of Solder Joints and Solder Shape. 12 1. 1029–1034. 14 indexed citations

11.

Pan, Ke, et al.. (2020). Comparative Analysis of Package Warpage Using Confocal Method and Digital Image Correlation. 945–949. 21 indexed citations

12.

Zhao, Wenting, et al.. (2019). Analysis of fracture evolution characteristics of coplanar double fracture rock under uniaxial compression. Geotechnical and Geological Engineering. 38(1). 343–352. 12 indexed citations

13.

Shen, Jie, et al.. (2018). Detection of Water-Stains Defects in TFT-LCD Based on Machine Vision. 1–5. 5 indexed citations

14.

Yu, Bin, et al.. (2018). Entity Relation Extraction Method Based on Improved K-means Clustering. 1–1.

15.

Chen, Wei, et al.. (2011). The Investigation of Multi-Stage Sheet Metal Stamping Process for Deep Drawing. Advanced materials research. 189-193. 2675–2679.

16.

Pan, Ke. (2010). Application of SVM in Safety Evaluation for Oilery Railway Siding and Ancillary Facilities.

17.

Pan, Ke. (2010). Heat Transfer Numerical Simulation of Groundwater Heat Source Wells under Coupled Thermal Conduction and Groundwater Advection Conditions. Water Resources and Power. 3 indexed citations

18.

Pan, Ke, et al.. (2009). Development and Application of the Software on Flammable,Explosive & Toxic cloud Diffusion Based on JAVA Technique. Zhongguo anquan kexue xuebao. 1 indexed citations

19.

Pan, Ke. (2008). Breakthrough in early safety warning system for civil aviation airport based on BP neural network. Applied Mechanics and Materials. 2 indexed citations

20.

Pan, Ke. (2008). Application of weight-variable theory and the relative difference functions to construction fire risk assessment. Applied Mechanics and Materials. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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