Yuling Niu

428 total citations
25 papers, 332 citations indexed

About

Yuling Niu is a scholar working on Electrical and Electronic Engineering, Computer Vision and Pattern Recognition and Mechanics of Materials. According to data from OpenAlex, Yuling Niu has authored 25 papers receiving a total of 332 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 7 papers in Computer Vision and Pattern Recognition and 5 papers in Mechanics of Materials. Recurrent topics in Yuling Niu's work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers) and Optical measurement and interference techniques (7 papers). Yuling Niu is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers) and Optical measurement and interference techniques (7 papers). Yuling Niu collaborates with scholars based in United States, China and South Korea. Yuling Niu's co-authors include Seungbae Park, Shuai Shao, Jing Wang, Huayan Wang, Gamal Refai-Ahmed, Huayan Wang, Chin‐Li Kao, Jiefeng Xu, Lin Li and Jing Wang and has published in prestigious journals such as SHILAP Revista de lepidopterología, Sensors and Engineering Fracture Mechanics.

In The Last Decade

Yuling Niu

24 papers receiving 321 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yuling Niu United States 12 247 56 53 48 44 25 332
Jianbiao Pan United States 13 249 1.0× 109 1.9× 65 1.2× 41 0.9× 9 0.2× 37 367
Vempati Srinivasa Rao Singapore 10 288 1.2× 59 1.1× 15 0.3× 30 0.6× 25 0.6× 42 330
Jay Patel United States 7 183 0.7× 41 0.7× 17 0.3× 90 1.9× 39 0.9× 11 312
Laiping Li China 14 131 0.5× 284 5.1× 94 1.8× 33 0.7× 32 0.7× 30 449
Chin‐Li Kao Taiwan 12 435 1.8× 81 1.4× 39 0.7× 61 1.3× 15 0.3× 40 496
Chong Ser Choong Singapore 10 340 1.4× 36 0.6× 18 0.3× 64 1.3× 10 0.2× 47 375
Chengdi Xiao China 9 133 0.5× 127 2.3× 23 0.4× 42 0.9× 12 0.3× 34 299
Chung-Yu Tsai Taiwan 11 89 0.4× 176 3.1× 24 0.5× 105 2.2× 29 0.7× 42 351
Guangxi Dong China 9 105 0.4× 113 2.0× 21 0.4× 104 2.2× 15 0.3× 13 344
Gerard McVicker United States 10 290 1.2× 122 2.2× 17 0.3× 82 1.7× 8 0.2× 15 423

Countries citing papers authored by Yuling Niu

Since Specialization
Citations

This map shows the geographic impact of Yuling Niu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yuling Niu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yuling Niu more than expected).

Fields of papers citing papers by Yuling Niu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yuling Niu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yuling Niu. The network helps show where Yuling Niu may publish in the future.

Co-authorship network of co-authors of Yuling Niu

This figure shows the co-authorship network connecting the top 25 collaborators of Yuling Niu. A scholar is included among the top collaborators of Yuling Niu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yuling Niu. Yuling Niu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Niu, Yuling, Jianhong Wang, Jinfang Zhang, et al.. (2025). Cracking Mechanism of Al-Cu-Mg-Si Alloy during Laser Powder Bed Fusion by Numerical Simulation. 4(3). 200213–200213.
2.
Shao, Shuai, Yuling Niu, Jing Wang, Seungbae Park, & Bongsub Lee. (2020). Accessible determination of die-to-wafer bond strength with the Schwickerath test. Engineering Fracture Mechanics. 229. 106929–106929. 2 indexed citations
3.
Shao, Shuai, et al.. (2020). Design guideline on board-level thermomechanical reliability of 2.5D package. Microelectronics Reliability. 111. 113701–113701. 16 indexed citations
4.
Wang, Jing, Yuling Niu, Shuai Shao, et al.. (2020). A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow. Microelectronics Reliability. 112. 113791–113791. 22 indexed citations
5.
Niu, Yuling, et al.. (2019). Effect of low grade Atropine combined with keratoplasty on middle grade myopia in adolescents. SHILAP Revista de lepidopterología. 2 indexed citations
6.
Niu, Yuling, et al.. (2019). Warpage Variation Analysis and Model Prediction for Molded Packages. 819–824. 4 indexed citations
7.
Li, Lin, et al.. (2018). A comparison of flipped and traditional classroom learning: a case study in mechanical engineering. International journal of engineering education. 34(6). 1876–1887. 21 indexed citations
8.
Xu, Jiefeng, Yuling Niu, Stephen R. Cain, et al.. (2018). The Expermental and Numerical Study of Electromigration in 2.5D Packaging. 483–489. 11 indexed citations
9.
10.
Niu, Yuling, et al.. (2018). An Accurate Experimental Determination of Effective Strain for Heterogeneous Electronic Packages With Digital Image Correlation Method. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(4). 678–688. 10 indexed citations
11.
Lee, Bongsub, Guilian Gao, G. G. Fountain, et al.. (2018). Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications. 954–961. 2 indexed citations
12.
Niu, Yuling, et al.. (2018). A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method. Microelectronics Reliability. 87. 81–88. 28 indexed citations
13.
14.
Oh, Dan, et al.. (2018). Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management. 682–692. 30 indexed citations
15.
Niu, Yuling, Huayan Wang, & Seungbae Park. (2017). A general strategy of in-situ warpage characterization for solder attached packages with digital image correlation method. Optics and Lasers in Engineering. 93. 9–18. 14 indexed citations
16.
Wang, Jing, Yuling Niu, & Seungbae Park. (2017). An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow. 10 indexed citations
17.
Shao, Shuai, et al.. (2017). A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Sensors. 17(2). 322–322. 9 indexed citations
18.
Niu, Yuling, et al.. (2017). A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage Characterization. IEEE Transactions on Components Packaging and Manufacturing Technology. 1–9. 23 indexed citations
19.
20.
Sun, Xiaochen, et al.. (2006). Optimal Control for a Remanufacturing Reverse Logistics System under Buy-Back Policy. 1. 1197–1202. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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