Jing‐Cheng Lin

472 total citations
17 papers, 402 citations indexed

About

Jing‐Cheng Lin is a scholar working on Electronic, Optical and Magnetic Materials, Mechanics of Materials and Electrical and Electronic Engineering. According to data from OpenAlex, Jing‐Cheng Lin has authored 17 papers receiving a total of 402 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electronic, Optical and Magnetic Materials, 11 papers in Mechanics of Materials and 10 papers in Electrical and Electronic Engineering. Recurrent topics in Jing‐Cheng Lin's work include Copper Interconnects and Reliability (12 papers), Metal and Thin Film Mechanics (11 papers) and Semiconductor materials and devices (8 papers). Jing‐Cheng Lin is often cited by papers focused on Copper Interconnects and Reliability (12 papers), Metal and Thin Film Mechanics (11 papers) and Semiconductor materials and devices (8 papers). Jing‐Cheng Lin collaborates with scholars based in Taiwan and United States. Jing‐Cheng Lin's co-authors include Chiapyng Lee, Yu‐Lin Kuo, Chuei-Tang Wang, Cheng‐Chieh Hsieh, Feng-Wei Kuo, Tzu-Jin Yeh, Shin-Puu Jeng, Chewn-Pu Jou, Douglas Yu and Yee‐Wen Yen and has published in prestigious journals such as Journal of The Electrochemical Society, Applied Surface Science and Journal of Physics D Applied Physics.

In The Last Decade

Jing‐Cheng Lin

17 papers receiving 385 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jing‐Cheng Lin Taiwan 10 308 177 171 102 42 17 402
S. Kadomura Japan 11 499 1.6× 68 0.4× 170 1.0× 75 0.7× 34 0.8× 43 542
K. Kubota Japan 10 323 1.0× 226 1.3× 71 0.4× 224 2.2× 19 0.5× 42 545
James G. Ryan United States 10 224 0.7× 82 0.5× 142 0.8× 117 1.1× 66 1.6× 25 352
W. Robl Germany 11 172 0.6× 159 0.9× 111 0.6× 138 1.4× 67 1.6× 26 345
Christine Hau-Riege United States 13 526 1.7× 75 0.4× 444 2.6× 76 0.7× 62 1.5× 29 583
Ennis T. Ogawa United States 10 303 1.0× 67 0.4× 263 1.5× 49 0.5× 27 0.6× 20 358
W. Cote United States 8 334 1.1× 43 0.2× 170 1.0× 71 0.7× 49 1.2× 15 411
R. Scholl United States 9 203 0.7× 218 1.2× 64 0.4× 170 1.7× 46 1.1× 20 323
Jeff Gambino United States 10 310 1.0× 27 0.2× 108 0.6× 62 0.6× 60 1.4× 59 344
I. Vervoort Belgium 5 315 1.0× 75 0.4× 251 1.5× 103 1.0× 24 0.6× 19 365

Countries citing papers authored by Jing‐Cheng Lin

Since Specialization
Citations

This map shows the geographic impact of Jing‐Cheng Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jing‐Cheng Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jing‐Cheng Lin more than expected).

Fields of papers citing papers by Jing‐Cheng Lin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jing‐Cheng Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jing‐Cheng Lin. The network helps show where Jing‐Cheng Lin may publish in the future.

Co-authorship network of co-authors of Jing‐Cheng Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Jing‐Cheng Lin. A scholar is included among the top collaborators of Jing‐Cheng Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jing‐Cheng Lin. Jing‐Cheng Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

17 of 17 papers shown
1.
Lin, Jing‐Cheng, et al.. (2023). Reading and Walking with Smart Glasses: Effects of Display and Control Modes on Safety. International Journal of Human-Computer Interaction. 40(23). 7875–7891. 3 indexed citations
2.
Huang, Chenglin, et al.. (2014). Thermal stability, adhesion and electrical studies on (Ti,Zr)N x thin films as low resistive diffusion barriers between Cu and Si. Electronic Materials Letters. 10(3). 551–556. 4 indexed citations
3.
Huang, Chenglin, et al.. (2013). Growth, Thermal Stability and Cu Diffusivity of Reactively Sputtered NbN Thin Films as Diffusion Barriers between Cu and Si. ECS Journal of Solid State Science and Technology. 2(7). N152–N158. 3 indexed citations
4.
Huang, Chenglin, et al.. (2013). Characteristics of reactively sputtered niobium nitride thin films as diffusion barriers for Cu metallization. Electronic Materials Letters. 9(5). 593–597. 13 indexed citations
5.
Kuo, Feng-Wei, Cheng‐Chieh Hsieh, Tzu-Jin Yeh, et al.. (2012). High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration. 14.1.1–14.1.4. 101 indexed citations
6.
7.
Kuo, Yu‐Lin, et al.. (2005). Evaluation of the thermal stability of reactively sputtered (Ti, Zr)Nx nano-thin films as diffusion barriers between Cu and Silicon. Thin Solid Films. 484(1-2). 265–271. 24 indexed citations
8.
Kuo, Yu‐Lin, et al.. (2004). Diffusion of Copper in Titanium Zirconium Nitride Thin Films. Electrochemical and Solid-State Letters. 7(3). C35–C35. 26 indexed citations
9.
Kuo, Yu‐Lin, Chiapyng Lee, Jing‐Cheng Lin, et al.. (2003). Characteristics of DC Reactively Sputtered (Ti,Zr)N Thin Films as Diffusion Barriers for Cu Metallization. Electrochemical and Solid-State Letters. 6(9). C123–C123. 8 indexed citations
10.
Lin, Jing‐Cheng, et al.. (2001). Characterization of tantalum nitride films deposited by reactive sputtering of Ta in N2/Ar gas mixtures. Materials Chemistry and Physics. 68(1-3). 266–271. 62 indexed citations
11.
Lin, Jing‐Cheng & Chiapyng Lee. (2000). Growth of Tantalum Nitride Films on Si by Radio Frequency Reactive Sputtering of Ta in N[sub 2]/Ar Gas Mixtures: Effect of Bias. Journal of The Electrochemical Society. 147(2). 713–713. 16 indexed citations
12.
Lin, Jing‐Cheng & Chiapyng Lee. (1999). Grain Boundary Diffusion of Copper in Tantalum Nitride Thin Films. Journal of The Electrochemical Society. 146(9). 3466–3471. 53 indexed citations
13.
Lin, Jing‐Cheng. (1999). A Study on the Grain Boundary Diffusion of Copper in Tantalum Nitride Thin Films. Electrochemical and Solid-State Letters. 2(4). 181–181. 5 indexed citations
14.
Lin, Jing‐Cheng, et al.. (1999). Growth of Tantalum Nitride Films on Si by Radio Frequency Reactive Sputtering: Effect of  N 2 / Ar Flow Ratio. Journal of The Electrochemical Society. 146(5). 1835–1839. 30 indexed citations
15.
Lin, Jing‐Cheng, et al.. (1998). Nucleation and growth of highly oriented lead titanate thin films prepared by a sol-gel method. Applied Surface Science. 125(1). 51–57. 34 indexed citations
16.
Lin, Jing‐Cheng & Chiapyng Lee. (1997). Nucleation and growth of Cu thin films on silicon wafers deposited by radio frequency sputtering. Thin Solid Films. 307(1-2). 96–99. 13 indexed citations
17.
Lin, Jing‐Cheng, et al.. (1996). Interdiffusion and reactions in the Cu/TiN/Si thin film system. Applied Surface Science. 92. 335–339. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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