Chin-Li Kao
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- Copper Interconnects and Reliability 10
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- Electronic Packaging and Soldering Technologies 33
- 3D IC and TSV technologies 29
- Integrated Circuits and Semiconductor Failure Analysis 5
- Electrodeposition and Electroless Coatings 5
- Electrostatic Discharge in Electronics 4
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- Aluminum Alloys Composites Properties 3
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- Microstructure and mechanical properties 2
- Co-authors
- Yi‐Shao LaiFan-Yi OuyangYing-Ta ChiuChang-Lin YehYung‐Sheng LinC. R. KaoYi‐Sheng LaiDavid Tarng
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringMechanical Engineering
- Journals
- Applied Physics Letters (1 paper)Journal of Applied Physics (1 paper)Electrochimica Acta (2 papers)
- Partner nations
- TaiwanUnited StatesItaly
In The Last Decade
Chin-Li Kao
34 papers receiving 466 citations
Peers
Comparison fields: 5 of 32
- Electronic, Optical and Magnetic Materials 187
- Electrical and Electronic Engineering 452
- Mechanical Engineering 136
- General Materials Science 7
- Mechanics of Materials 31
Countries citing papers authored by Chin-Li Kao
This map shows the geographic impact of Chin-Li Kao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chin-Li Kao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chin-Li Kao more than expected).
Fields of papers citing papers by Chin-Li Kao
This network shows the impact of papers produced by Chin-Li Kao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chin-Li Kao. The network helps show where Chin-Li Kao may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Chin-Li Kao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2024 | 1 | |
| 3 | 2024 | 1 | |
| 4 | 2024 | 0 | |
| 5 | 2024 | 1 | |
| 6 | 2022 | 7 | |
| 7 | 2021 | 17 | |
| 8 | 2021 | 24 | |
| 9 | 2018 | 8 | |
| 10 | 2014 | 1 | |
| 11 | Copper pillar shape and related stress simulation studies in flip chip packages | 2014 | 3 |
| 12 | 2013 | 15 | |
| 13 | 2011 | 9 | |
| 14 | 2010 | 2 | |
| 15 | 2009 | 9 | |
| 16 | 2007 | 19 | |
| 17 | 2006 | 13 | |
| 18 | 2006 | 58 | |
| 19 | 2006 | 35 | |
| 20 | 2005 | 43 |
About Chin-Li Kao
Chin-Li Kao is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Hardware and Architecture, having authored 38 papers that have together received 475 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (29 papers), Copper Interconnects and Reliability (10 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Electrodeposition and Electroless Coatings (5 papers), Electrostatic Discharge in Electronics (4 papers), Aluminum Alloys Composites Properties (3 papers) and Microstructure and mechanical properties (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (187 citations), Electrical and Electronic Engineering (452 citations) and Mechanical Engineering (136 citations). Chin-Li Kao has collaborated with scholars based in Taiwan, United States and Italy. Frequent co-authors include Yi‐Shao Lai, Fan-Yi Ouyang, Ying-Ta Chiu, Chang-Lin Yeh, Yung‐Sheng Lin, C. R. Kao, Yi‐Sheng Lai, David Tarng, Kwang‐Lung Lin and Yi-Shao Lai. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and Electrochimica Acta.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.