S.A. Gee

573 total citations
16 papers, 429 citations indexed

About

S.A. Gee is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, S.A. Gee has authored 16 papers receiving a total of 429 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 3 papers in Mechanics of Materials. Recurrent topics in S.A. Gee's work include Electronic Packaging and Soldering Technologies (11 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers) and Electrostatic Discharge in Electronics (5 papers). S.A. Gee is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers) and Electrostatic Discharge in Electronics (5 papers). S.A. Gee collaborates with scholars based in United States, Netherlands and Italy. S.A. Gee's co-authors include Luu Nguyen, Chris van Kessel, Jeremiah G. Murphy, K. N. Tu, King-Ning Tu, M. R. Johnson, J. F. Gibbons, R.C. Jaeger, R. Falster and Jeffrey C. Suhling and has published in prestigious journals such as Applied Physics Letters, Journal of Electronic Packaging and IEEE Transactions on Components Packaging and Manufacturing Technology Part A.

In The Last Decade

S.A. Gee

15 papers receiving 407 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
S.A. Gee United States	10	391	122	86	69	51	16	429
S. Nunes United States	7	256 0.7×	73 0.6×	51 0.6×	129 1.9×	33 0.6×	16	417
I. Turlik United States	15	381 1.0×	57 0.5×	142 1.7×	48 0.7×	52 1.0×	35	464
Stephanie Golmon United States	5	346 0.9×	48 0.4×	47 0.5×	29 0.4×	20 0.4×	6	406
Justin Henrie United States	8	189 0.5×	84 0.7×	216 2.5×	95 1.4×	69 1.4×	11	345
Paresh Limaye Belgium	13	480 1.2×	51 0.4×	177 2.1×	64 0.9×	44 0.9×	30	523
K. Matsunaga Japan	10	165 0.4×	55 0.5×	64 0.7×	32 0.5×	70 1.4×	22	349
Tai Chong Chai Singapore	12	450 1.2×	38 0.3×	111 1.3×	42 0.6×	68 1.3×	56	474
G. G. Harman United States	8	226 0.6×	33 0.3×	137 1.6×	76 1.1×	42 0.8×	13	300
Su‐Tsai Lu Taiwan	11	322 0.8×	37 0.3×	103 1.2×	48 0.7×	51 1.0×	32	369
S. Orain France	10	247 0.6×	40 0.3×	55 0.6×	68 1.0×	55 1.1×	24	352

Countries citing papers authored by S.A. Gee

Since Specialization

Citations

This map shows the geographic impact of S.A. Gee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S.A. Gee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S.A. Gee more than expected).

Fields of papers citing papers by S.A. Gee

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S.A. Gee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S.A. Gee. The network helps show where S.A. Gee may publish in the future.

Co-authorship network of co-authors of S.A. Gee

This figure shows the co-authorship network connecting the top 25 collaborators of S.A. Gee. A scholar is included among the top collaborators of S.A. Gee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S.A. Gee. S.A. Gee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

16 of 16 papers shown

Tu, K. N., et al.. (2006). Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints. Applied Physics Letters. 88(1). 138 indexed citations

Gee, S.A., et al.. (2005). The Design And Calibration Of A Semiconductor Strain Gauge Array. 185–191. 8 indexed citations

Gee, S.A., et al.. (2005). Lead-Free and PbSn Bump Electromigration Testing. 1313–1321. 36 indexed citations

Gee, S.A., et al.. (2002). Effect of material interactions during thermal shock testing on IC package reliability. 693–700. 9 indexed citations

Gee, S.A., et al.. (2002). Stress related offset voltage shift in a precision operational amplifier. 755–764. 5 indexed citations

Gee, S.A.. (1997). Water-borne coatings for steel. 80(7). 316–320. 17 indexed citations

Suhling, Jeffrey C., et al.. (1997). Characterization of Plastic Packages Using (100) Silicon Stress Test Chips. 15–21. 3 indexed citations

Gee, S.A., et al.. (1995). A test chip design for detecting thin-film cracking in integrated circuits. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 18(3). 478–484. 9 indexed citations

Nguyen, Luu, et al.. (1995). Effects of die coatings, mold compounds, and test conditions on temperature cycling failures. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 18(1). 15–22. 16 indexed citations

10.

Nguyen, Luu, et al.. (1993). Effect of material interactions during thermal shock testing on IC package reliability. IEEE Transactions on Components Hybrids and Manufacturing Technology. 16(8). 932–939. 16 indexed citations

11.

Nguyen, Luu, et al.. (1991). Effects of Configuration on Plastic Package Stresses. Journal of Electronic Packaging. 113(4). 397–404. 32 indexed citations

12.

Gee, S.A., et al.. (1989). Strain-gauge mapping of die surface stresses. IEEE Transactions on Components Hybrids and Manufacturing Technology. 12(4). 587–593. 54 indexed citations

13.

Gee, S.A. & Chris van Kessel. (1987). Stiffness and Yielding in the PLCC "J" Lead. IEEE Transactions on Components Hybrids and Manufacturing Technology. 10(3). 379–390. 8 indexed citations

14.

Kessel, Chris van, S.A. Gee, & Jeremiah G. Murphy. (1983). The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-Cracking. IEEE Transactions on Components Hybrids and Manufacturing Technology. 6(4). 414–420. 73 indexed citations

15.

Gee, S.A., et al.. (1982). Thermal annealing of microcracks produced by backside laser irradiation of silicon. Applied Physics Letters. 41(12). 1133–1135. 3 indexed citations

16.

Gee, S.A., et al.. (1981). Characterization of Laser Induced Backside Damage for Gettering Purposes. MRS Proceedings. 4. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact