Ying-Ta Chiu

590 total citations
37 papers, 493 citations indexed

About

Ying-Ta Chiu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Ying-Ta Chiu has authored 37 papers receiving a total of 493 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electrical and Electronic Engineering, 20 papers in Mechanical Engineering and 11 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Ying-Ta Chiu's work include Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (23 papers) and Advanced Welding Techniques Analysis (14 papers). Ying-Ta Chiu is often cited by papers focused on Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (23 papers) and Advanced Welding Techniques Analysis (14 papers). Ying-Ta Chiu collaborates with scholars based in Taiwan, United States and Australia. Ying-Ta Chiu's co-authors include Yi‐Shao Lai, Jenn‐Ming Song, Jiunn Chen, Chin-Li Kao, Ning-Cheng Lee, Kwang‐Lung Lin, Jun-Yen Uan, Chih-Pin Hung, Ping‐Feng Yang and Chia‐Hao Liu and has published in prestigious journals such as Materials Science and Engineering A, Scripta Materialia and Japanese Journal of Applied Physics.

In The Last Decade

Ying-Ta Chiu

37 papers receiving 486 citations

Peers

Ying-Ta Chiu
G.T. Galyon United States
Chin-Li Kao Taiwan
Brook Chao United States
King-Ning Tu United States
P. Elenius United States
Pilin Liu United States
Ivy Qin United States
Yi-Wun Wang Taiwan
H. Balkan United States
G.T. Galyon United States
Ying-Ta Chiu
Citations per year, relative to Ying-Ta Chiu Ying-Ta Chiu (= 1×) peers G.T. Galyon

Countries citing papers authored by Ying-Ta Chiu

Since Specialization
Citations

This map shows the geographic impact of Ying-Ta Chiu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ying-Ta Chiu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ying-Ta Chiu more than expected).

Fields of papers citing papers by Ying-Ta Chiu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ying-Ta Chiu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ying-Ta Chiu. The network helps show where Ying-Ta Chiu may publish in the future.

Co-authorship network of co-authors of Ying-Ta Chiu

This figure shows the co-authorship network connecting the top 25 collaborators of Ying-Ta Chiu. A scholar is included among the top collaborators of Ying-Ta Chiu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ying-Ta Chiu. Ying-Ta Chiu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Song, Jenn‐Ming, et al.. (2018). Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging. Sensors and Materials. 30(12). 2889–2889. 1 indexed citations
2.
Song, Jenn‐Ming, et al.. (2017). Low temperature direct Cu bonding for MEMS packaging. 57–60. 2 indexed citations
3.
Chiu, Ying-Ta, et al.. (2017). Microcosmic mechanisms of Cu to Cu bonding by molecular dynamic simulation. 2 indexed citations
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Chiu, Ying-Ta, et al.. (2014). The failure behavior of the fine pitch SnAg bump under current stressing. 150–153. 1 indexed citations
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Lin, Yu‐Wei, et al.. (2012). The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation. Materials Science and Engineering A. 543. 152–157. 16 indexed citations
8.
Lai, Yi‐Shao, Chin-Li Kao, Ying-Ta Chiu, & Bernd K. Appelt. (2011). Electromigration reliability of redistribution lines in wafer-level chip-scale packages. 326–331. 9 indexed citations
9.
Song, Jenn‐Ming, et al.. (2011). Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. Microelectronics Reliability. 52(1). 180–189. 19 indexed citations
10.
Song, Jenn‐Ming, et al.. (2010). Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints. Journal of materials research/Pratt's guide to venture capital sources. 25(4). 629–632. 16 indexed citations
11.
Song, Jenn‐Ming, et al.. (2009). Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates. MATERIALS TRANSACTIONS. 50(5). 1231–1234. 36 indexed citations
12.
Chiu, Ying-Ta, Kwang‐Lung Lin, & Yi‐Shao Lai. (2008). Orientation transformation of Pb grains in 5Sn–95Pb/ 63Sn–37Pb composite flip-chip solder joints during electromigration test. Journal of materials research/Pratt's guide to venture capital sources. 23(7). 1877–1881. 6 indexed citations
13.
Song, Jenn‐Ming, et al.. (2008). Alloying modification of Sn–Ag–Cu solders by manganese and titanium. Microelectronics Reliability. 49(3). 235–241. 65 indexed citations
14.
Song, Jenn‐Ming, et al.. (2008). Alloying design of Sn-Ag-Cu solders for the improvement in drop test performance. 35. 33–36. 3 indexed citations
15.
Song, Jenn‐Ming, et al.. (2008). Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders. 1. 1358–1363. 3 indexed citations
16.
Lai, Yi‐Shao, Ying-Ta Chiu, & Jiunn Chen. (2008). Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization. Journal of Electronic Materials. 37(10). 1624–1630. 60 indexed citations
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Lai, Yi‐Shao, et al.. (2007). Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints. Journal of Electronic Materials. 37(2). 201–209. 25 indexed citations
20.
Lai, Yi‐Shao, et al.. (2006). Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectronics Reliability. 47(8). 1273–1279. 58 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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