J.H. Huang

971 total citations
29 papers, 821 citations indexed

About

J.H. Huang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, J.H. Huang has authored 29 papers receiving a total of 821 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Electrical and Electronic Engineering, 9 papers in Electronic, Optical and Magnetic Materials and 6 papers in Materials Chemistry. Recurrent topics in J.H. Huang's work include Electronic Packaging and Soldering Technologies (12 papers), Electrodeposition and Electroless Coatings (10 papers) and 3D IC and TSV technologies (9 papers). J.H. Huang is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), Electrodeposition and Electroless Coatings (10 papers) and 3D IC and TSV technologies (9 papers). J.H. Huang collaborates with scholars based in Taiwan, United States and France. J.H. Huang's co-authors include Wei He, Mingjie Xu, Guangming Li, Xin Ma, Christopher Huang, Ru‐Shi Liu, P. C. Kuo, Y. Hwu, Michael Hsiao and T. C. Lai and has published in prestigious journals such as Advanced Materials, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

J.H. Huang

28 papers receiving 778 citations

Peers

Countries citing papers authored by J.H. Huang

Since Specialization

Citations

This map shows the geographic impact of J.H. Huang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.H. Huang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.H. Huang more than expected).

Fields of papers citing papers by J.H. Huang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.H. Huang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.H. Huang. The network helps show where J.H. Huang may publish in the future.

Co-authorship network of co-authors of J.H. Huang

This figure shows the co-authorship network connecting the top 25 collaborators of J.H. Huang. A scholar is included among the top collaborators of J.H. Huang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J.H. Huang. J.H. Huang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Improvement of bonding interface in electroless copper-plated joints using a high copper concentration copper–quadrol complex solution 2025 ·Materials Science in Semiconductor Processing ·J.H. Huang, (unknown), (unknown), Vengudusamy Renganathan, (unknown), Ming H. Hsieh, Chin-Li Kao, Yung‐Sheng Lin, (unknown), Andréa Micke Moreno, Tao Jiang, C. R. Kao	0
2	A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications 2024 ·Materials ·J.H. Huang, (unknown), Vengudusamy Renganathan, (unknown), (unknown), Chin-Li Kao, Yung‐Sheng Lin, (unknown), C. R. Kao	1
3	A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging 2023 ·J.H. Huang, (unknown), (unknown), Vengudusamy Renganathan, (unknown), (unknown), Chin‐Li Kao, Yung‐Sheng Lin, (unknown), C. Chiang, C. R. Kao	1
4	Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating using Microfluidic System 2023 ·(unknown), J.H. Huang, (unknown), (unknown), (unknown), Vengudusamy Renganathan, Chin‐Li Kao, Yung‐Sheng Lin, (unknown), C. Chiang, C. R. Kao	1
5	Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study 2023 ·Advanced Materials ·(unknown), J.H. Huang, (unknown), Vengudusamy Renganathan, (unknown), C. R. Kao	1
6	Numerical fluidic-chemical multi-physics simulation of a mass production model for electroless plating of fine-pitch interconnections in a microchannel for chip packaging applications 2022 ·(unknown), J.H. Huang, (unknown), Vengudusamy Renganathan, (unknown), (unknown), Tsao‐Cheng Huang, C.H. Chen, C. R. Kao	2
7	Key steps from laboratory towards mass production: Optimization of electroless plating process through numerical simulation 2022 ·2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ·(unknown), J.H. Huang, (unknown), (unknown), Tsao‐Cheng Huang, C. R. Kao	3
8	Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface 2022 ·2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ·Tsao‐Cheng Huang, (unknown), J.H. Huang, (unknown), (unknown), C. R. Kao	7
9	Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating 2022 ·2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ·(unknown), (unknown), (unknown), (unknown), J.H. Huang, Tsao‐Cheng Huang, C. R. Kao, Yung‐Sheng Lin, (unknown), Chin-Li Kao, David Tarng	2
10	Highly uniform microfluidic electroless interconnections for chip stacking applications 2021 ·Electrochimica Acta ·(unknown), (unknown), (unknown), J.H. Huang, (unknown), (unknown), Vengudusamy Renganathan, Chin-Li Kao, (unknown), C. R. Kao	24
11	Nonlocal optical effects on the Goos–Hänchen shift at an interface of a composite material of metallic nanoparticles 2013 ·Journal of the Optical Society of America A ·J.H. Huang, Paul Leung	8
12	Biocompatibility of Fe₃O₄nanoparticles evaluated byin vitrocytotoxicity assays using normal, glia and breast cancer cells 2010 ·Nanotechnology ·Balaprasad Ankamwar, T. C. Lai, J.H. Huang, Ru‐Shi Liu, Michael Hsiao, (unknown), Y. Hwu	232
13	Array of CdSe QD-Sensitized ZnO Nanorods Serves as Photoanode for Water Splitting 2010 ·Journal of The Electrochemical Society ·Neelu Chouhan, Chai Yeh, (unknown), J.H. Huang, (unknown), Ru‐Shi Liu, (unknown), Kuei‐Hsien Chen	39
14	Annealing effect of polymer bulk heterojunction solar cells based on polyfluorene and fullerene blend 2008 ·Organic Electronics ·J.H. Huang, (unknown), (unknown), Dhananjaya Kekuda, Mengqiang Wu, Fan‐Ching Chien, Ping‐Hung Chen, Chih‐Wei Chu, Kuo–Chuan Ho	88
15	WEEE recovery strategies and the WEEE treatment status in China 2006 ·Journal of Hazardous Materials ·Wei He, Guangming Li, Xin Ma, (unknown), J.H. Huang, Mingjie Xu, Christopher Huang	282
16	Microstructural and magnetic studies of Mn–Al thin films 1997 ·Journal of Applied Physics ·P. C. Kuo, Y. D. Yao, J.H. Huang, Shiyu Shen, Jwo‐Huei Jou	21
17	Preparation and magnetical studies of Mn50Al50/Al bilayer films 1997 ·Journal of Applied Physics ·P. C. Kuo, Y. D. Yao, (unknown), J.H. Huang	6
18	Magnetic properties and microstructure of lanthanum-doped Mn-Al and Mn-Al-C permanent magnets 1994 ·Journal of Materials Science ·J.H. Huang, P. C. Kuo, (unknown)	6
19	Phase transformation of Mn-Al alloy powders 1993 ·Scripta Metallurgica et Materialia ·J.H. Huang, P. C. Kuo	5
20	Effect of quenching temperature on the formation and magnetic properties of the ferromagnetic τ-phase in MnAlC alloys 1993 ·Materials Science and Engineering B ·J.H. Huang, P. C. Kuo	10

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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