Chang-Lin Yeh

1.4k total citations
67 papers, 1.1k citations indexed

About

Chang-Lin Yeh is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Chang-Lin Yeh has authored 67 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 62 papers in Electrical and Electronic Engineering, 25 papers in Mechanics of Materials and 16 papers in Mechanical Engineering. Recurrent topics in Chang-Lin Yeh's work include Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (30 papers) and Electrostatic Discharge in Electronics (14 papers). Chang-Lin Yeh is often cited by papers focused on Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (30 papers) and Electrostatic Discharge in Electronics (14 papers). Chang-Lin Yeh collaborates with scholars based in Taiwan, Singapore and Greece. Chang-Lin Yeh's co-authors include Yi‐Shao Lai, Ping‐Feng Yang, Y. S. Lai, S.K.W. Seah, E.H. Wong, Chin‐Li Kao, W.D. van Driel, M. Leoni, Xiujuan Zhao and Cheryl Selvanayagam and has published in prestigious journals such as Journal of Alloys and Compounds, Materials Letters and International Journal of Impact Engineering.

In The Last Decade

Chang-Lin Yeh

63 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Chang-Lin Yeh Taiwan	20	996	382	305	203	54	67	1.1k
Tong Yan Tee Singapore	24	1.5k 1.6×	309 0.8×	529 1.7×	94 0.5×	64 1.2×	72	1.6k
Tz-Cheng Chiu Taiwan	13	907 0.9×	435 1.1×	316 1.0×	88 0.4×	60 1.1×	67	1.2k
Yi-Hsin Pao United States	10	594 0.6×	315 0.8×	244 0.8×	41 0.2×	30 0.6×	18	679
Vahid Samavatian Iran	17	465 0.5×	252 0.7×	111 0.4×	100 0.5×	29 0.5×	33	670
J.F.J.M. Caers Netherlands	18	665 0.7×	291 0.8×	202 0.7×	90 0.4×	14 0.3×	67	748
H. D. Solomon United States	17	546 0.5×	846 2.2×	482 1.6×	363 1.8×	72 1.3×	41	1.2k
Q. Jane Wang United States	20	404 0.4×	576 1.5×	592 1.9×	168 0.8×	28 0.5×	37	1.2k
Majid Samavatian Iran	17	272 0.3×	504 1.3×	113 0.4×	213 1.0×	32 0.6×	32	712
W. Engelmaier United States	11	577 0.6×	289 0.8×	196 0.6×	33 0.2×	24 0.4×	20	656
Vladimir Cherman Belgium	19	820 0.8×	351 0.9×	47 0.2×	101 0.5×	20 0.4×	107	1.1k

Countries citing papers authored by Chang-Lin Yeh

Since Specialization

Citations

This map shows the geographic impact of Chang-Lin Yeh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chang-Lin Yeh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chang-Lin Yeh more than expected).

Fields of papers citing papers by Chang-Lin Yeh

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chang-Lin Yeh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chang-Lin Yeh. The network helps show where Chang-Lin Yeh may publish in the future.

Co-authorship network of co-authors of Chang-Lin Yeh

This figure shows the co-authorship network connecting the top 25 collaborators of Chang-Lin Yeh. A scholar is included among the top collaborators of Chang-Lin Yeh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chang-Lin Yeh. Chang-Lin Yeh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Long, Cheng‐Yu, et al.. (2024). The clinical effect of dienogest on urinary and sexual symptoms in endometriosis patients. Journal of the Chinese Medical Association. 87(11). 1011–1017. 2 indexed citations

Long, Cheng‐Yu, et al.. (2023). Tape-Releasing Suture with “Long Loop” on Mid-Urethral Sling: A Novel Procedure for Management of Iatrogenic Urethral Obstruction. Journal of Clinical Medicine. 12(12). 3938–3938. 1 indexed citations

Long, Cheng‐Yu, et al.. (2023). Relationship between Q-Tip Test and Urethral Hypermobility on Perineal Ultrasound. Journal of Clinical Medicine. 12(14). 4863–4863.

Yeh, Chang-Lin, et al.. (2013). Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies. 897–903. 2 indexed citations

Wong, E.H., Cheryl Selvanayagam, S.K.W. Seah, et al.. (2008). Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling. Journal of Electronic Materials. 37(6). 829–836. 64 indexed citations

Yeh, Chang-Lin & Yi‐Shao Lai. (2008). Strain-rate and impact velocity effects on joint adhesion strength. 1–4. 7 indexed citations

Yeh, Chang-Lin, et al.. (2008). Parametric study on board-level electronic test device subjected to JEDEC vibration loads. 1–6. 3 indexed citations

Lai, Yi‐Shao, et al.. (2008). Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. Microelectronics Reliability. 48(5). 757–762. 15 indexed citations

Hsu, Hsiang‐Chen, et al.. (2007). Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process. 1–6. 4 indexed citations

10.

Selvanayagam, Cheryl, E.H. Wong, S.K.W. Seah, et al.. (2007). Constitutive Properties of Bulk Solder at `Drop-Impact' Strain Rates. 8. 360–364. 2 indexed citations

11.

Hsu, Hsiang‐Chen, et al.. (2007). Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer. 29. 297–300.

12.

Lai, Yi‐Shao, et al.. (2007). Effects of different drop test conditions on board-level reliability of chip-scale packages. Microelectronics Reliability. 48(2). 274–281. 39 indexed citations

13.

Yeh, Chang-Lin, et al.. (2006). Correlation Between Package-level Ball Impact Test and Board-level Drop Test. 1. 270–275. 19 indexed citations

14.

Yeh, Chang-Lin, Yi‐Shao Lai, & Chin-Li Kao. (2006). Prediction of Board-level Reliability of Chip-scale Packages Under Consecutive Drops. 1. 73–80. 13 indexed citations

15.

Yeh, Chang-Lin, et al.. (2006). Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. Microelectronics Reliability. 47(12). 2188–2196. 18 indexed citations

16.

Jenq, S.T., et al.. (2006). High-G Drop Impact Response and Failure Analysis of a Chip Packaged Printed Circuit Board. 2. 631–635. 3 indexed citations

17.

Jenq, S.T., et al.. (2006). High-G drop impact response and failure analysis of a chip packaged printed circuit board. International Journal of Impact Engineering. 34(10). 1655–1667. 24 indexed citations

18.

Yeh, Chang-Lin, et al.. (2006). Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. Microelectronics Reliability. 47(8). 1239–1245. 18 indexed citations

19.

Yeh, Chang-Lin, Yi‐Shao Lai, & Chin‐Li Kao. (2005). Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectronics Reliability. 46(7). 1172–1182. 53 indexed citations

20.

Yeh, Chang-Lin & Yi‐Shao Lai. (2005). Design of Drop Test Apparatus for Electronic Packages. Journal of Microelectronics and Electronic Packaging. 2(3). 180–188. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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