H. Balkan
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Electronic, Optical and Magnetic Materials top 10%
- Aerospace Engineering
- Atomic and Molecular Physics, and Optics
- Topics
- Electronic Packaging and Soldering Technologies (11 papers)3D IC and TSV technologies (9 papers)Copper Interconnects and Reliability (3 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringGeneral Materials Science
- Journals
- Applied Physics LettersInternational Journal of Solids and StructuresJournal of materials research/Pratt's guide to venture capital sources
- Partner nations
- United StatesSwedenItaly
In The Last Decade
H. Balkan
13 papers receiving 519 citations
Peers
Comparison fields: 5 of 27
- Electrical and Electronic Engineering 526
- Mechanical Engineering 229
- Electronic, Optical and Magnetic Materials 205
- Aerospace Engineering 35
- Atomic and Molecular Physics, and Optics 33
Countries citing papers authored by H. Balkan
This map shows the geographic impact of H. Balkan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Balkan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Balkan more than expected).
Fields of papers citing papers by H. Balkan
This network shows the impact of papers produced by H. Balkan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Balkan. The network helps show where H. Balkan may publish in the future.
Co-authorship network of co-authors of H. Balkan
This figure shows the co-authorship network connecting the top 25 collaborators of H. Balkan. A scholar is included among the top collaborators of H. Balkan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Balkan. H. Balkan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 10 | |
| 2 | 22 | |
| 3 | 42 | |
| 4 | 16 | |
| 5 | 14 | |
| 6 | 1 | |
| 7 | 5 | |
| 8 | 13 | |
| 9 | 35 | |
| 10 | 77 | |
| 11 | 301 | |
| 12 | 0 | |
| 13 | 4 | |
| 14 | Thin layer with circular debonding over a substrate under either axisymmetric compression or thermal loading. | 1 |
| 15 | 4 |
About H. Balkan
H. Balkan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Statistics, Probability and Uncertainty, having authored 15 papers that have together received 545 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (9 papers) and Copper Interconnects and Reliability (3 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (205 citations), Electrical and Electronic Engineering (526 citations) and General Materials Science (20 citations). H. Balkan has collaborated with scholars based in United States, Sweden and Italy. Frequent co-authors include P. Elenius, Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu, Henry Y. Lu, K. Y. Simon Ng, K. N. Tu, M. Li, Ke Zeng and Rahul Panat. Their work appears in journals such as Applied Physics Letters, International Journal of Solids and Structures and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.