Yi-Shao Lai

953 total citations
41 papers, 787 citations indexed

About

Yi-Shao Lai is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Yi-Shao Lai has authored 41 papers receiving a total of 787 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 15 papers in Mechanics of Materials and 10 papers in Mechanical Engineering. Recurrent topics in Yi-Shao Lai's work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (16 papers) and Metal and Thin Film Mechanics (9 papers). Yi-Shao Lai is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (16 papers) and Metal and Thin Film Mechanics (9 papers). Yi-Shao Lai collaborates with scholars based in Taiwan, United States and Italy. Yi-Shao Lai's co-authors include K. N. Tu, Andriy Gusak, K. N. Tu, Sheng‐Rui Jian, Jenh‐Yih Juang, J.S.C. Jang, Tz-Cheng Chiu, Tong Hong Wang, Kwang‐Lung Lin and Luhua Xu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Materials Science and Engineering A.

In The Last Decade

Yi-Shao Lai

41 papers receiving 761 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yi-Shao Lai Taiwan 18 555 248 224 211 162 41 787
Jesus N. Calata United States 20 1.2k 2.2× 604 2.4× 90 0.4× 160 0.8× 209 1.3× 38 1.4k
Zahabul Islam United States 17 302 0.5× 182 0.7× 58 0.3× 213 1.0× 392 2.4× 40 697
Takashi Kawakubo Japan 16 298 0.5× 124 0.5× 147 0.7× 252 1.2× 671 4.1× 69 931
Harald Köstenbauer Austria 13 182 0.3× 111 0.4× 251 1.1× 81 0.4× 230 1.4× 33 452
E. Ristolainen Finland 15 620 1.1× 265 1.1× 139 0.6× 45 0.2× 183 1.1× 63 799
E. Vancoille Belgium 14 298 0.5× 344 1.4× 424 1.9× 67 0.3× 389 2.4× 33 845
A. J. Griffin United States 14 144 0.3× 212 0.9× 278 1.2× 128 0.6× 433 2.7× 30 653
Cyril Buttay France 21 1.6k 2.9× 515 2.1× 51 0.2× 290 1.4× 384 2.4× 91 2.0k
P. Juliet France 14 258 0.5× 124 0.5× 358 1.6× 62 0.3× 361 2.2× 24 594
Yan Peng China 15 308 0.6× 90 0.4× 81 0.4× 159 0.8× 354 2.2× 77 647

Countries citing papers authored by Yi-Shao Lai

Since Specialization
Citations

This map shows the geographic impact of Yi-Shao Lai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yi-Shao Lai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yi-Shao Lai more than expected).

Fields of papers citing papers by Yi-Shao Lai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yi-Shao Lai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yi-Shao Lai. The network helps show where Yi-Shao Lai may publish in the future.

Co-authorship network of co-authors of Yi-Shao Lai

This figure shows the co-authorship network connecting the top 25 collaborators of Yi-Shao Lai. A scholar is included among the top collaborators of Yi-Shao Lai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yi-Shao Lai. Yi-Shao Lai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chen, Dao-Long, et al.. (2014). Using DMA to Simultaneously Acquire Young's Relaxation Modulus and Time-dependent Poisson's Ratio of a Viscoelastic Material. Procedia Engineering. 79. 153–159. 14 indexed citations
2.
Chen, Dao-Long, et al.. (2014). A new representation for anisotropic viscoelastic functions. Mathematics and Mechanics of Solids. 21(6). 685–708. 5 indexed citations
3.
Chen, Dao-Long, et al.. (2013). On non-monotonicity of linear viscoelastic functions. Mathematics and Mechanics of Solids. 20(5). 600–613. 3 indexed citations
4.
5.
Jang, Wei-Luen, et al.. (2012). The performance and fracture mechanism of solder joints under mechanical reliability test. Microelectronics Reliability. 52(7). 1428–1434. 8 indexed citations
6.
Chiu, Tz-Cheng, Hongwei Huang, & Yi-Shao Lai. (2011). Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. Microelectronics Reliability. 51(12). 2263–2273. 20 indexed citations
7.
Jian, Sheng‐Rui, et al.. (2010). Mechanical properties of the hexagonal HoMnO3 thin films by nanoindentation. Journal of Alloys and Compounds. 508(2). 523–527. 24 indexed citations
8.
9.
Liang, Shuqi, Hsiang‐Yao Hsiao, Chih Chen, et al.. (2009). Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints. Journal of Electronic Materials. 38(12). 2443–2448. 4 indexed citations
10.
11.
Wu, Albert T., Chin-Li Kao, Meng-Kai Shih, et al.. (2009). In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays. Journal of Electronic Materials. 38(11). 2308–2313. 9 indexed citations
12.
Cheng, Chun‐Hu, et al.. (2009). Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate. Microelectronics Reliability. 50(1). 63–69. 21 indexed citations
13.
Chen, Dao-Long, et al.. (2009). New Bending Algorithm for Field-Driven Molecular Dynamics. Nanoscale Research Letters. 5(2). 315–22. 2 indexed citations
14.
Chen, Jiunn, Yi-Shao Lai, & Ping‐Feng Yang. (2009). First-Principles Calculations of Elastic Properties of Cu$_{3}$Sn and Cu$_{6}$Sn$_{5}$ Intermetallics. IEEE Transactions on Advanced Packaging. 32(4). 754–757. 8 indexed citations
15.
Jian, Sheng‐Rui, Jenh‐Yih Juang, & Yi-Shao Lai. (2008). Cross-sectional transmission electron microscopy observations of structural damage in Al0.16Ga0.84N thin film under contact loading. Journal of Applied Physics. 103(3). 32 indexed citations
16.
Lai, Yi-Shao, Tong Hong Wang, & Chang-Chi Lee. (2008). Thermal–Mechanical Coupling Analysis for Coupled Power- and Thermal-Cycling Reliability of Board-Level Electronic Packages. IEEE Transactions on Device and Materials Reliability. 8(1). 122–128. 17 indexed citations
17.
Wang, Tong Hong & Yi-Shao Lai. (2008). Optimization of Thermomechanical Reliability of Board-Level Flip-Chip Packages Implemented With Organic or Silicon Substrates. IEEE Transactions on Electronics Packaging Manufacturing. 31(2). 174–179. 3 indexed citations
18.
Tu, K. N., et al.. (2007). Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints. Applied Physics Letters. 90(21). 19 indexed citations
19.
Tu, K. N., et al.. (2006). Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration. Applied Physics Letters. 89(22). 52 indexed citations
20.
Lai, Yi-Shao, et al.. (2004). A study of cyclic bending reliability of bare-die-type chip-scale packages. 23. 313–316. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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