Yi-Shao Lai
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Mechanics of Materials top 5%
- Electronic, Optical and Magnetic Materials top 10%
- Materials Chemistry
- Co-authors
- K. N. TuAndriy GusakSheng‐Rui JianJenh‐Yih JuangKwang‐Lung LinTz-Cheng ChiuJ.S.C. JangTong Hong Wang
- Topics
- Electronic Packaging and Soldering Technologies (23 papers)3D IC and TSV technologies (16 papers)Metal and Thin Film Mechanics (9 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringMechanics of Materials
- Partner nations
- TaiwanUnited StatesItaly
In The Last Decade
Yi-Shao Lai
41 papers receiving 761 citations
Peers
Comparison fields: 5 of 35
- Electrical and Electronic Engineering 555
- Mechanical Engineering 248
- Mechanics of Materials 224
- Electronic, Optical and Magnetic Materials 211
- Materials Chemistry 162
Countries citing papers authored by Yi-Shao Lai
This map shows the geographic impact of Yi-Shao Lai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yi-Shao Lai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yi-Shao Lai more than expected).
Fields of papers citing papers by Yi-Shao Lai
This network shows the impact of papers produced by Yi-Shao Lai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yi-Shao Lai. The network helps show where Yi-Shao Lai may publish in the future.
Co-authorship network of co-authors of Yi-Shao Lai
This figure shows the co-authorship network connecting the top 25 collaborators of Yi-Shao Lai. A scholar is included among the top collaborators of Yi-Shao Lai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yi-Shao Lai. Yi-Shao Lai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 14 | |
| 2 | 5 | |
| 3 | 3 | |
| 4 | 23 | |
| 5 | 8 | |
| 6 | 20 | |
| 7 | 24 | |
| 8 | 8 | |
| 9 | 9 | |
| 10 | 21 | |
| 11 | 4 | |
| 12 | 4 | |
| 13 | 2 | |
| 14 | 26 | |
| 15 | 32 | |
| 16 | 41 | |
| 17 | 22 | |
| 18 | 19 | |
| 19 | 52 | |
| 20 | 5 |
About Yi-Shao Lai
Yi-Shao Lai is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 41 papers that have together received 787 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (16 papers) and Metal and Thin Film Mechanics (9 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (211 citations), Electrical and Electronic Engineering (555 citations) and Mechanics of Materials (224 citations). Yi-Shao Lai has collaborated with scholars based in Taiwan, United States and Italy. Frequent co-authors include K. N. Tu, Andriy Gusak, K. N. Tu, Sheng‐Rui Jian, Jenh‐Yih Juang, Kwang‐Lung Lin, Tz-Cheng Chiu, J.S.C. Jang, Tong Hong Wang and Luhua Xu. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and Materials Science and Engineering A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.