Jenn‐Ming Song
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 2%
- Materials Chemistry top 10%
- Electronic, Optical and Magnetic Materials top 10%
- Aerospace Engineering top 5%
- Co-authors
- Hsin-Yi ChuangT. S. LuiIn‐Gann ChenYing-Ta ChiuYi‐Shao LaiKwang‐Lung LinJun-Yen UanJian-Yih Wang
- Topics
- Electronic Packaging and Soldering Technologies (71 papers)3D IC and TSV technologies (36 papers)Advanced Welding Techniques Analysis (27 papers)
- Journals
- SHILAP Revista de lepidopterologíaNano LettersApplied Physics Letters
In The Last Decade
Jenn‐Ming Song
150 papers receiving 2.2k citations
Peers
Comparison fields: 5 of 83
- Electrical and Electronic Engineering 1.4k
- Mechanical Engineering 1.2k
- Materials Chemistry 723
- Electronic, Optical and Magnetic Materials 275
- Aerospace Engineering 264
Countries citing papers authored by Jenn‐Ming Song
This map shows the geographic impact of Jenn‐Ming Song's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jenn‐Ming Song with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jenn‐Ming Song more than expected).
Fields of papers citing papers by Jenn‐Ming Song
This network shows the impact of papers produced by Jenn‐Ming Song. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jenn‐Ming Song. The network helps show where Jenn‐Ming Song may publish in the future.
Co-authorship network of co-authors of Jenn‐Ming Song
This figure shows the co-authorship network connecting the top 25 collaborators of Jenn‐Ming Song. A scholar is included among the top collaborators of Jenn‐Ming Song based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jenn‐Ming Song. Jenn‐Ming Song is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 2 | |
| 3 | 0 | |
| 4 | 0 | |
| 5 | 1 | |
| 6 | 3 | |
| 7 | 1 | |
| 8 | 12 | |
| 9 | 6 | |
| 10 | 3 | |
| 11 | 5 | |
| 12 | 23 | |
| 13 | 3 | |
| 14 | 3 | |
| 15 | 1 | |
| 16 | 18 | |
| 17 | 25 | |
| 18 | 5 | |
| 19 | 71 | |
| 20 | 1 |
About Jenn‐Ming Song
Jenn‐Ming Song is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and General Materials Science, having authored 157 papers that have together received 2.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (71 papers), 3D IC and TSV technologies (36 papers) and Advanced Welding Techniques Analysis (27 papers). The work is most often cited by research in General Materials Science (146 citations), Mechanical Engineering (1.2k citations) and Electrical and Electronic Engineering (1.4k citations). Jenn‐Ming Song has collaborated with scholars based in Taiwan, Japan and China. Frequent co-authors include Hsin-Yi Chuang, T. S. Lui, In‐Gann Chen, Ying-Ta Chiu, Yi‐Shao Lai, Kwang‐Lung Lin, Jun-Yen Uan, Jian-Yih Wang, Lan Chen and Songlin Li. Their work appears in journals such as SHILAP Revista de lepidopterología, Nano Letters and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.