Lih‐Tyng Hwang

648 total citations
59 papers, 481 citations indexed

About

Lih‐Tyng Hwang is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Computer Networks and Communications. According to data from OpenAlex, Lih‐Tyng Hwang has authored 59 papers receiving a total of 481 indexed citations (citations by other indexed papers that have themselves been cited), including 48 papers in Electrical and Electronic Engineering, 21 papers in Aerospace Engineering and 6 papers in Computer Networks and Communications. Recurrent topics in Lih‐Tyng Hwang's work include Antenna Design and Analysis (19 papers), 3D IC and TSV technologies (17 papers) and Electromagnetic Compatibility and Noise Suppression (15 papers). Lih‐Tyng Hwang is often cited by papers focused on Antenna Design and Analysis (19 papers), 3D IC and TSV technologies (17 papers) and Electromagnetic Compatibility and Noise Suppression (15 papers). Lih‐Tyng Hwang collaborates with scholars based in Taiwan, United States and Germany. Lih‐Tyng Hwang's co-authors include I. Turlik, Arnold Reisman, Shunmin Wang, Fa‐Shian Chang, Tzyy‐Sheng Horng, Deepak Kumar Nayak, Robert Darveaux, Fu-Kang Wang, Li Li and Chin‐Jung Chao and has published in prestigious journals such as IEEE Transactions on Antennas and Propagation, Electronics Letters and Journal of Electronic Materials.

In The Last Decade

Lih‐Tyng Hwang

54 papers receiving 457 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Lih‐Tyng Hwang Taiwan 13 354 133 73 73 54 59 481
Siamak Ebadi United States 14 484 1.4× 417 3.1× 54 0.7× 214 2.9× 89 1.6× 51 719
Marcel Jufer Switzerland 13 431 1.2× 40 0.3× 117 1.6× 43 0.6× 168 3.1× 54 545
Satoshi KIKUCHI Japan 9 201 0.6× 131 1.0× 59 0.8× 59 0.8× 91 1.7× 74 389
Daniel Nagy United Kingdom 15 571 1.6× 55 0.4× 68 0.9× 171 2.3× 7 0.1× 51 714
Daiki Ebihara Japan 12 263 0.7× 38 0.3× 91 1.2× 81 1.1× 56 1.0× 63 381
M. Timur Aydemir Türkiye 14 696 2.0× 126 0.9× 67 0.9× 75 1.0× 28 0.5× 64 833
Jae Seung Lee South Korea 7 560 1.6× 123 0.9× 68 0.9× 43 0.6× 20 0.4× 25 660

Countries citing papers authored by Lih‐Tyng Hwang

Since Specialization
Citations

This map shows the geographic impact of Lih‐Tyng Hwang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Lih‐Tyng Hwang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Lih‐Tyng Hwang more than expected).

Fields of papers citing papers by Lih‐Tyng Hwang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Lih‐Tyng Hwang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Lih‐Tyng Hwang. The network helps show where Lih‐Tyng Hwang may publish in the future.

Co-authorship network of co-authors of Lih‐Tyng Hwang

This figure shows the co-authorship network connecting the top 25 collaborators of Lih‐Tyng Hwang. A scholar is included among the top collaborators of Lih‐Tyng Hwang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Lih‐Tyng Hwang. Lih‐Tyng Hwang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Hwang, Lih‐Tyng, et al.. (2022). High Gain and Low Back Radiation and Thin Antenna Designs Using Electromagnetic Bandgap Surface for Radar and Wearable Applications. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2 indexed citations
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Hwang, Lih‐Tyng, et al.. (2018). Wearable Vital Sign Sensor Using a Single-Input Multiple-Output Self-Injection-Locked Oscillator Tag. 248–251. 11 indexed citations
5.
Hwang, Lih‐Tyng & Tzyy‐Sheng Horng. (2017). 3D IC and RF SiPs: advanced stacking and planar solutions for 5G mobility. CERN Document Server (European Organization for Nuclear Research). 3 indexed citations
6.
Chao, Chin‐Jung, et al.. (2017). Design of an adjustable pipeline inspection robot with three belt driven mechanical modules. 1989–1994. 8 indexed citations
7.
Hwang, Lih‐Tyng, et al.. (2016). Design of a high gain and dual polarized transmitarray using FSS of smaller unit cells. International Symposium on Antennas and Propagation. 5 indexed citations
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9.
Hwang, Lih‐Tyng, et al.. (2013). A MIMO antenna with built-in isolation for WLAN USB dongle applications. 1055–1057. 6 indexed citations
10.
Lin, Yu‐Chih, et al.. (2012). Low cost QFN package design for millimeter-wave applications. 6 indexed citations
11.
Hwang, Lih‐Tyng, et al.. (2012). Inductive link design with optimal transfer efficiency and a high CMRR. 1–4. 1 indexed citations
12.
Huang, Chien‐Hsiang, et al.. (2011). Design of compact bandpass filter using transformer-based coupled resonators on integrated passive device glass substrate. Asia-Pacific Microwave Conference. 1921–1924. 5 indexed citations
13.
Lin, Ying‐Chieh, et al.. (2011). Design of UWB RF receiver front-end with heterogeneous chip integration. Asia-Pacific Microwave Conference. 347–350. 3 indexed citations
14.
Hwang, Lih‐Tyng, et al.. (2003). Passivation schemes for copper/polymer thin film interconnections used in multichip modules. 776–782. 6 indexed citations
15.
Hwang, Lih‐Tyng, et al.. (2003). Performance evaluation of RF MEMS packages. 1032–1036. 5 indexed citations
16.
Sommer, G., M. Petras, Rashaunda Henderson, et al.. (2003). Development of a design library for embedded passive RF components in HDI organic substrate material. 78759. 852–855. 2 indexed citations
17.
Hwang, Lih‐Tyng, et al.. (1995). Analysis of a multilayered-metal thin-film transmission line. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 18(2). 381–387. 3 indexed citations
18.
Hwang, Lih‐Tyng & I. Turlik. (1992). A review of the skin effect as applied to thin film interconnections. IEEE Transactions on Components Hybrids and Manufacturing Technology. 15(1). 43–55. 30 indexed citations
19.
Hwang, Lih‐Tyng, Deepak Kumar Nayak, I. Turlik, & Arnold Reisman. (1991). Thin-film pulse propagation analysis using frequency techniques. IEEE Transactions on Components Hybrids and Manufacturing Technology. 14(1). 192–198. 7 indexed citations
20.
Nayak, Deepak Kumar, Lih‐Tyng Hwang, I. Turlik, & Arnold Reisman. (1987). A high-performance thermal module for computer packaging. Journal of Electronic Materials. 16(5). 357–364. 23 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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