Ho‐Ming Tong
- Electrical and Electronic Engineering
- Biomedical Engineering
- Mechanical Engineering
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Co-authors
- Yi‐Shao LaiC.P. WongCarl C. GryteIsao NodaKuan‐Neng ChenWei HwangJin‐Chern ChiouChing-Te Chuang
- Topics
- 3D IC and TSV technologies (18 papers)Electronic Packaging and Soldering Technologies (14 papers)Neuroscience and Neural Engineering (5 papers)
- Cited by
- Electrical and Electronic EngineeringAutomotive EngineeringElectronic, Optical and Magnetic Materials
- Partner nations
- TaiwanUnited StatesHong Kong
In The Last Decade
Ho‐Ming Tong
30 papers receiving 441 citations
Peers
Comparison fields: 5 of 66
- Electrical and Electronic Engineering 302
- Biomedical Engineering 96
- Mechanical Engineering 79
- Electronic, Optical and Magnetic Materials 69
- Mechanics of Materials 58
Countries citing papers authored by Ho‐Ming Tong
This map shows the geographic impact of Ho‐Ming Tong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ho‐Ming Tong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ho‐Ming Tong more than expected).
Fields of papers citing papers by Ho‐Ming Tong
This network shows the impact of papers produced by Ho‐Ming Tong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ho‐Ming Tong. The network helps show where Ho‐Ming Tong may publish in the future.
Co-authorship network of co-authors of Ho‐Ming Tong
This figure shows the co-authorship network connecting the top 25 collaborators of Ho‐Ming Tong. A scholar is included among the top collaborators of Ho‐Ming Tong based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ho‐Ming Tong. Ho‐Ming Tong is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 4 | |
| 3 | 6 | |
| 4 | 8 | |
| 5 | 10 | |
| 6 | 1 | |
| 7 | 2 | |
| 8 | 3 | |
| 9 | 2 | |
| 10 | 3 | |
| 11 | 42 | |
| 12 | 4 | |
| 13 | 4 | |
| 14 | 1 | |
| 15 | 2 | |
| 16 | 17 | |
| 17 | 6 | |
| 18 | 11 | |
| 19 | 11 | |
| 20 | 48 |
About Ho‐Ming Tong
Ho‐Ming Tong is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Polymers and Plastics, having authored 32 papers that have together received 464 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (14 papers) and Neuroscience and Neural Engineering (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (302 citations), Automotive Engineering (47 citations) and Electronic, Optical and Magnetic Materials (69 citations). Ho‐Ming Tong has collaborated with scholars based in Taiwan, United States and Hong Kong. Frequent co-authors include Yi‐Shao Lai, C.P. Wong, Carl C. Gryte, Isao Noda, Kuan‐Neng Chen, Wei Hwang, Jin‐Chern Chiou, Ching-Te Chuang, Chih-Pin Hung and K. L. Saenger. Their work appears in journals such as Water Research, IEEE Transactions on Electron Devices and Journal of Applied Polymer Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.