H. Geisler

588 total citations
53 papers, 464 citations indexed

About

H. Geisler is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, H. Geisler has authored 53 papers receiving a total of 464 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 24 papers in Electronic, Optical and Magnetic Materials and 15 papers in Mechanics of Materials. Recurrent topics in H. Geisler's work include Copper Interconnects and Reliability (21 papers), Electronic Packaging and Soldering Technologies (16 papers) and Metal and Thin Film Mechanics (13 papers). H. Geisler is often cited by papers focused on Copper Interconnects and Reliability (21 papers), Electronic Packaging and Soldering Technologies (16 papers) and Metal and Thin Film Mechanics (13 papers). H. Geisler collaborates with scholars based in Germany, United States and Denmark. H. Geisler's co-authors include K. Samwer, M. Moske, Ehrenfried Zschech, K. O. Schweitz, J. Chevallier, J. B⊘ttiger, U. Herr, Taek‐Soo Kim, Reinhold H. Dauskardt and Naoto Tsuji and has published in prestigious journals such as Physical review. B, Condensed matter, Journal of Applied Physics and Thin Solid Films.

In The Last Decade

H. Geisler

50 papers receiving 446 citations

Peers

Countries citing papers authored by H. Geisler

Since Specialization

Citations

This map shows the geographic impact of H. Geisler's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Geisler with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Geisler more than expected).

Fields of papers citing papers by H. Geisler

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Geisler. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Geisler. The network helps show where H. Geisler may publish in the future.

Co-authorship network of co-authors of H. Geisler

This figure shows the co-authorship network connecting the top 25 collaborators of H. Geisler. A scholar is included among the top collaborators of H. Geisler based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Geisler. H. Geisler is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work	Indexed citations
1	Study on Effect of Microstructure Evolution on Wafer Warpage for High-Temperature Annealed and Self-Annealed Copper Thin Films 2025 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·(unknown), (unknown), H. Geisler, M. Hecker, (unknown), D. Breuer, (unknown), Karsten Meier, (unknown), Karlheinz Bock	0
2	Characterization and Modeling of Solder Interconnects for Wafer Level Packaging Applications Subjected to Low Cycle Fatigue Stress 2025 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·(unknown), (unknown), Karsten Meier, H. Geisler, (unknown), (unknown), Karlheinz Bock	0
3	Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling 2024 ·(unknown), (unknown), Karsten Meier, H. Geisler, (unknown), (unknown), (unknown), Karlheinz Bock	1
4	A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line 2017 ·IMAPSource Proceedings ·(unknown), D. Breuer, H. Geisler, (unknown), (unknown), (unknown), M. Hecker, (unknown), (unknown), (unknown), (unknown), (unknown)	7
5	Improving Accuracy and Precision of Strain Analysis by Energy-Filtered Nanobeam Electron Diffraction 2012 ·Microscopy and Microanalysis ·Angelika Hähnel, Manfred Reiche, Oussama Moutanabbir, H. Blumtritt, H. Geisler, J. Höntschel, (unknown)	6
6	Testing the Mechanical Integrity of On-Chip Interconnects 2012 ·H. Geisler, (unknown), (unknown), (unknown), (unknown), (unknown)	5
7	CPI assessment using a novel characterization technique based on bump-assisted scratch-indentation testing 2011 ·H. Geisler, (unknown), (unknown), (unknown), Ulrich Mayer, Thomas Rößler, (unknown), (unknown), (unknown), (unknown)	2
8	Profiling of the Mechanical Properties of Ultralow-k Films Using Nanoindentation Techniques 2011 ·MRS Proceedings ·H. Geisler, Ulrich Mayer, (unknown), (unknown), (unknown)	0
9	Tuning depth profiles of organosilicate films with ultraviolet curing 2008 ·Journal of Applied Physics ·Taek‐Soo Kim, Naoto Tsuji, (unknown), Nobuyoshi Kobayashi, (unknown), H. Geisler, Ehrenfried Zschech, Reinhold H. Dauskardt	19
10	Extensive investigations of temperature influence on barrier integrity during reliability testing 2008 ·Microelectronic Engineering ·Oliver Aubel, Michael Meyer, (unknown), H. Engelmann, (unknown), (unknown), H. Schmidt, (unknown), H. Geisler, (unknown), (unknown), (unknown), C. Witt, (unknown), (unknown), (unknown), (unknown)	1
11	Nanotwin formation and its physical properties and effect on reliability of copper interconnects 2008 ·Microelectronic Engineering ·Di Xu, V. Sriram, Vidvuds Ozoliņš, Jenn‐Ming Yang, K. N. Tu, Gery R. Stafford, Carlos Beauchamp, (unknown), H. Geisler, (unknown), Ehrenfried Zschech	29
12	Assessing the Effect of Die Sealing in Cu/Low-k Structures 2007 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·(unknown), A. V. Vairagar, H. Geisler, Ehrenfried Zschech, (unknown)	7
13	Chemical Bonding, Permittivity and Elastic Properties in Locally Modified Organosilicate Glass 2006 ·MRS Proceedings ·Ehrenfried Zschech, (unknown), P. Hoffmann, Dieter Schmeißer, Pavel Potapov, (unknown), (unknown), H. Geisler	4
14	The microstructural development of Ag/Ni multilayers during annealing 2000 ·Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties ·K. O. Schweitz, Klaus Rätzke, D. T. Foord, Peter J. Thomas, A.L. Greer, H. Geisler, J. Chevallier, J. B⊘ttiger	16
15	Metastable Phase Formation in Fe-Al Thin Films Cocondensed by Cross-Beam Pulsed Laser Deposition 2000 ·Materials science forum ·H. Geisler, (unknown), Alexander Tselev, (unknown), H. Worch	1
16	Nonconventional transition layer formation during PLD of nanometer-period multilayers 1999 ·Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·A.A. Gorbunov, K.D. Brand, H. Geisler, J. Noetzel, (unknown), Alexander Tselev, (unknown), (unknown), J. H. Thomas, Hannes Lichte, W. Pompe, (unknown), E. Wieser, Hartmut Worch	2
17	Hardness enhancement and elastic modulus behaviour in sputtered Ag/Ni multilayers with different modulation wavelengths 1999 ·Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties ·H. Geisler	1
18	Magnetization, magnetoresistance, and x-ray diffraction measurements of discontinuous [Ni80Fe20/Ag] multilayers (abstract) 1996 ·Journal of Applied Physics ·(unknown), M. Moske, (unknown), H. Geisler, K. Samwer	4
19	Surface Topography of Cocondensed Amorphous ZrCo-Alloy Films Investigated in Situ By UHV-STM 1994 ·MRS Proceedings ·(unknown), M. Moske, H. Geisler, K. Samwer	5
20	Formation of Metastable Phases by Diffusion Reaction 1994 ·Materials science forum ·U. Herr, H. Geisler, K. Samwer	3

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact