Meike Hauschildt

542 total citations
31 papers, 298 citations indexed

About

Meike Hauschildt is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, Meike Hauschildt has authored 31 papers receiving a total of 298 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electronic, Optical and Magnetic Materials, 29 papers in Electrical and Electronic Engineering and 7 papers in Mechanics of Materials. Recurrent topics in Meike Hauschildt's work include Copper Interconnects and Reliability (30 papers), Electronic Packaging and Soldering Technologies (23 papers) and Semiconductor materials and devices (20 papers). Meike Hauschildt is often cited by papers focused on Copper Interconnects and Reliability (30 papers), Electronic Packaging and Soldering Technologies (23 papers) and Semiconductor materials and devices (20 papers). Meike Hauschildt collaborates with scholars based in Germany, United States and Switzerland. Meike Hauschildt's co-authors include Paul S. Ho, M. Gall, Oliver Aubel, Ehrenfried Zschech, Patrick Justison, C. Hennesthal, Martin Gall, H. Kawasaki, G. Talut and Lijuan Zhang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Japanese Journal of Applied Physics.

In The Last Decade

Meike Hauschildt

28 papers receiving 282 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Meike Hauschildt Germany 11 284 249 38 30 26 31 298
K. Motoyama United States 10 203 0.7× 156 0.6× 27 0.7× 37 1.2× 45 1.7× 36 246
D. Restaino United States 6 153 0.5× 134 0.5× 34 0.9× 26 0.9× 26 1.0× 11 175
Soon‐Cheon Seo United States 9 211 0.7× 142 0.6× 91 2.4× 41 1.4× 81 3.1× 17 269
M. Shinosky United States 13 307 1.1× 208 0.8× 19 0.5× 28 0.9× 16 0.6× 22 319
R. Schulz United States 7 296 1.0× 124 0.5× 30 0.8× 29 1.0× 29 1.1× 14 326
A. Leśniewska Belgium 10 314 1.1× 195 0.8× 37 1.0× 73 2.4× 57 2.2× 34 345
D. Louis France 11 269 0.9× 102 0.4× 36 0.9× 22 0.7× 47 1.8× 28 295
S.L. Shue Taiwan 7 116 0.4× 79 0.3× 31 0.8× 26 0.9× 48 1.8× 21 143
M. Kerber Germany 15 590 2.1× 73 0.3× 10 0.3× 25 0.8× 92 3.5× 62 607

Countries citing papers authored by Meike Hauschildt

Since Specialization
Citations

This map shows the geographic impact of Meike Hauschildt's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Meike Hauschildt with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Meike Hauschildt more than expected).

Fields of papers citing papers by Meike Hauschildt

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Meike Hauschildt. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Meike Hauschildt. The network helps show where Meike Hauschildt may publish in the future.

Co-authorship network of co-authors of Meike Hauschildt

This figure shows the co-authorship network connecting the top 25 collaborators of Meike Hauschildt. A scholar is included among the top collaborators of Meike Hauschildt based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Meike Hauschildt. Meike Hauschildt is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hauschildt, Meike, et al.. (2024). A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 47. 10A.4–1. 1 indexed citations
2.
Hauschildt, Meike, et al.. (2021). Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–5. 4 indexed citations
3.
Liao, Zhongquan, Martin Gall, Kong Boon Yeap, et al.. (2015). <em>In Situ</em> Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices. Journal of Visualized Experiments. e52447–e52447. 1 indexed citations
4.
Hauschildt, Meike, M. Gall, C. Hennesthal, et al.. (2014). Electromigration void nucleation and growth analysis using large-scale early failure statistics. AIP conference proceedings. 89–98. 6 indexed citations
5.
Hauschildt, Meike, Martin Gall, Axel Preuße, et al.. (2014). Advanced metallization concepts and impact on reliability. Japanese Journal of Applied Physics. 53(5S2). 05GA11–05GA11. 11 indexed citations
6.
Liao, Zhongquan, Martin Gall, Kong Boon Yeap, et al.. (2014). In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures. Microelectronic Engineering. 137. 47–53. 5 indexed citations
7.
Yeap, Kong Boon, Martin Gall, Zhongquan Liao, et al.. (2014). In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms. Journal of Applied Physics. 115(12). 14 indexed citations
8.
Hauschildt, Meike, C. Hennesthal, G. Talut, et al.. (2013). Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 2C.1.1–2C.1.6. 46 indexed citations
9.
Ganesh, K. J., Lijuan Zhang, Oliver Aubel, et al.. (2013). Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects. Applied Physics Letters. 102(13). 35 indexed citations
10.
Aubel, Oliver, et al.. (2011). Comparison of Process Options for Improving Backend-of-Line Reliability in 28 nm Node Technologies and Beyond. Japanese Journal of Applied Physics. 50(5S1). 05EA01–05EA01. 1 indexed citations
11.
Gall, Martin, et al.. (2010). Large-scale statistical analysis of early failures in Cu electromigration, Part II: Scaling behavior and short-length effects. Journal of Applied Physics. 108(1). 5 indexed citations
12.
Hauschildt, Meike, et al.. (2010). Large-scale statistical analysis of early failures in Cu electromigration, Part I: Dominating mechanisms. Journal of Applied Physics. 108(1). 15 indexed citations
13.
Hauschildt, Meike, et al.. (2009). Large-Scale Electromigration Statistics for Cu Interconnects. MRS Proceedings. 1156. 1 indexed citations
14.
Zschech, Ehrenfried, Paul S. Ho, Dieter Schmeißer, et al.. (2009). Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation. IEEE Transactions on Device and Materials Reliability. 9(1). 20–30. 14 indexed citations
15.
Hauschildt, Meike, et al.. (2009). Large-Scale Statistics for Cu Electromigration. AIP conference proceedings. 31–46. 2 indexed citations
16.
Hauschildt, Meike, et al.. (2008). The influence of process parameters on electromigration lifetime statistics. Journal of Applied Physics. 104(4). 5 indexed citations
17.
Gosset, L.G., P. Brun, E. Petitprez, et al.. (2007). Hybrid punch through approach to address electroless related integration issues of hybrid CoWP/SiCN barriers. Microelectronic Engineering. 84(11). 2629–2633.
18.
Hauschildt, Meike, et al.. (2006). Analysis of electromigration statistics for Cu interconnects. Applied Physics Letters. 88(21). 15 indexed citations
19.
Hauschildt, Meike. (2005). Statistical analysis of electromigration lifetimes and void evolution in copper interconnects. PhDT. 10 indexed citations
20.
Volinsky, Alex A., Meike Hauschildt, Joseph B. Vella, et al.. (2001). Residual Stress and Microstructure of Electroplated Cu Film on Different Barrier Layers. MRS Proceedings. 695. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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