Yunna Sun

960 total citations
65 papers, 705 citations indexed

About

Yunna Sun is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Yunna Sun has authored 65 papers receiving a total of 705 indexed citations (citations by other indexed papers that have themselves been cited), including 41 papers in Electrical and Electronic Engineering, 21 papers in Biomedical Engineering and 18 papers in Mechanical Engineering. Recurrent topics in Yunna Sun's work include 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (13 papers) and Advanced MEMS and NEMS Technologies (10 papers). Yunna Sun is often cited by papers focused on 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (13 papers) and Advanced MEMS and NEMS Technologies (10 papers). Yunna Sun collaborates with scholars based in China, South Korea and United States. Yunna Sun's co-authors include Guifu Ding, Guilian Wang, Zhuoqing Yang, Yongjin Wu, Ping Cheng, Yan Wang, Yipin Wang, Jinyuan Yao, Yan Wang and Yahui Li and has published in prestigious journals such as Advanced Materials, Journal of The Electrochemical Society and Scientific Reports.

In The Last Decade

Yunna Sun

62 papers receiving 687 citations

Peers

Yunna Sun
Lefeng Wang China
Maik Wiemer Germany
Liqun Du China
Rakesh G. Mote India
Congchun Zhang China
Hyub Lee South Korea
Lin Sun China
Tae‐Jin Je South Korea
Bavani Balakrisnan Singapore
Lefeng Wang China
Yunna Sun
Citations per year, relative to Yunna Sun Yunna Sun (= 1×) peers Lefeng Wang

Countries citing papers authored by Yunna Sun

Since Specialization
Citations

This map shows the geographic impact of Yunna Sun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yunna Sun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yunna Sun more than expected).

Fields of papers citing papers by Yunna Sun

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yunna Sun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yunna Sun. The network helps show where Yunna Sun may publish in the future.

Co-authorship network of co-authors of Yunna Sun

This figure shows the co-authorship network connecting the top 25 collaborators of Yunna Sun. A scholar is included among the top collaborators of Yunna Sun based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yunna Sun. Yunna Sun is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Liang, Chao, et al.. (2024). Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system. Microelectronics Journal. 144. 106089–106089. 6 indexed citations
2.
Zhang, Mingyu, et al.. (2024). An Inertial Switch With Prolonged Contact Time Achieved by Dynamically Asymmetric Design. IEEE Sensors Journal. 24(24). 40454–40462. 1 indexed citations
3.
Zhang, Mingyu, Zhiyuan Hu, Yanxin Zhang, et al.. (2024). Lightweight Inertial Switch with Spiral Separation Mechanism for Extending Contact Time. 733–736. 1 indexed citations
4.
Wu, Yongjin, Shihao Ma, Hu Li, et al.. (2024). High-performance near-substrate heat sink with Tesla-like rotor-wing microchannel for chiplet cooling application. Applied Thermal Engineering. 258. 124775–124775. 6 indexed citations
5.
Cai, Han, Yahui Li, Yongjin Wu, et al.. (2023). Non-Cyanide Thick Silver Electrodeposition Base on Instantaneous Nucleation for 3D Microstructures with High Performance. Journal of The Electrochemical Society. 170(2). 22504–22504. 3 indexed citations
6.
Zhu, Yuanyuan, Yahui Li, Bo Yan, et al.. (2023). High-performance flexible tactile sensor enabled by multi-contact mechanism for normal and shear force measurement. Nano Energy. 117. 108862–108862. 16 indexed citations
7.
Zhang, Congchun, Yahui Li, Nan Zhao, et al.. (2023). Multilayer heterogeneous electrical insulation structure of HfO2/Al2O3 for high-temperature thin-film sensor on superalloy substrate. Applied Surface Science. 642. 158592–158592. 9 indexed citations
8.
Wu, Yongjin, Guifu Ding, Yuan Zhu, et al.. (2023). Preparation of Highly Stable Polymer Microstructure with Enhanced Adhesion Strength by Pushpin-like Nano/Microstructure Array. Polymers. 15(4). 1015–1015. 4 indexed citations
9.
10.
Zhu, Yuanyuan, Yang Liu, Yunna Sun, Yanxin Zhang, & Guifu Ding. (2022). Recent Advances in Resistive Sensor Technology for Tactile Perception: A Review. IEEE Sensors Journal. 22(16). 15635–15649. 35 indexed citations
11.
Zhang, Baoyue, et al.. (2022). High‐Performance Directional Water Transport Using a Two‐Dimensional Periodic Janus Gradient Structure. Small Methods. 6(12). e2200812–e2200812. 24 indexed citations
12.
Sun, Yunna, et al.. (2022). Engineered Switchable‐Wettability Surfaces for Multi‐Path Directional Transportation of Droplets and Subaqueous Bubbles. Advanced Materials. 35(9). e2208645–e2208645. 28 indexed citations
13.
Zhu, Yuanyuan, Yongjin Wu, Yanxin Zhang, et al.. (2022). Highly Sensitive Tactile Sensor With Wide Dynamic Range Based on Multicontact Mechanism. IEEE Sensors Journal. 23(1). 211–218. 3 indexed citations
14.
Sun, Yunna, et al.. (2021). Significant factors affecting heat transfer performance of vapor chamber and strategies to promote it: A critical review. International Journal of Heat and Mass Transfer. 175. 121132–121132. 70 indexed citations
15.
Lai, Liyan, Hongfang Li, Yunna Sun, et al.. (2019). Investigation of Electrodeposition External Conditions on Morphology and Texture of Ni/SiCw Composite Coatings. Applied Sciences. 9(18). 3824–3824. 14 indexed citations
16.
Cheng, Ping, et al.. (2019). A Minimally Invasive Hollow Microneedle With a Cladding Structure: Ultra-Thin but Strong, Batch Manufacturable. IEEE Transactions on Biomedical Engineering. 66(12). 3480–3485. 20 indexed citations
17.
Dai, Xuhan, et al.. (2019). A Customized Nonlinear Micro-Flexure for Extending the Stable Travel Range of MEMS Electrostatic Actuator. Journal of Microelectromechanical Systems. 28(2). 199–208. 9 indexed citations
18.
19.
Xu, Qiu, Zhuoqing Yang, Yunna Sun, et al.. (2017). Shock-Resistibility of MEMS-Based Inertial Microswitch under Reverse Directional Ultra-High g Acceleration for IoT Applications. Scientific Reports. 7(1). 45512–45512. 25 indexed citations
20.
Huang, Qiang, et al.. (2014). Impurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives. Journal of The Electrochemical Society. 161(9). D388–D394. 28 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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