Raj Bhatti

862 total citations
33 papers, 692 citations indexed

About

Raj Bhatti is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Raj Bhatti has authored 33 papers receiving a total of 692 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Mechanical Engineering, 19 papers in Electrical and Electronic Engineering and 12 papers in Materials Chemistry. Recurrent topics in Raj Bhatti's work include Electronic Packaging and Soldering Technologies (18 papers), Thermal properties of materials (12 papers) and 3D IC and TSV technologies (11 papers). Raj Bhatti is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), Thermal properties of materials (12 papers) and 3D IC and TSV technologies (11 papers). Raj Bhatti collaborates with scholars based in United Kingdom, Ghana and Hong Kong. Raj Bhatti's co-authors include N.N. Ekere, Sabuj Mallik, Kenny C. Otiaba, Emeka H. Amalu, Chris Best, M.O. Alam, Michael Okereke, S.M. Lawrence, M. Dubois and Francisco Chinesta and has published in prestigious journals such as Journal of Materials Processing Technology, Applied Thermal Engineering and SAE technical papers on CD-ROM/SAE technical paper series.

In The Last Decade

Raj Bhatti

33 papers receiving 657 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Raj Bhatti United Kingdom 11 379 335 262 100 80 33 692
Yong Han Singapore 15 473 1.2× 377 1.1× 259 1.0× 61 0.6× 25 0.3× 75 831
Jeehoon Choi South Korea 17 657 1.7× 107 0.3× 167 0.6× 47 0.5× 65 0.8× 32 796
Hideaki Tsukamoto Japan 14 391 1.0× 218 0.7× 133 0.5× 248 2.5× 167 2.1× 55 659
R. Sidhu United States 16 662 1.7× 575 1.7× 178 0.7× 239 2.4× 44 0.6× 27 937
Majid Samavatian Iran 17 504 1.3× 272 0.8× 213 0.8× 113 1.1× 93 1.2× 32 712
Kenny C. Otiaba United Kingdom 9 189 0.5× 253 0.8× 141 0.5× 65 0.7× 15 0.2× 16 405
K. Siva Kumar United States 14 576 1.5× 239 0.7× 387 1.5× 191 1.9× 49 0.6× 30 885
Ichiro Shiota Japan 10 205 0.5× 85 0.3× 240 0.9× 305 3.0× 132 1.6× 68 647
Yuxiu Hu China 8 545 1.4× 215 0.6× 232 0.9× 212 2.1× 77 1.0× 16 827

Countries citing papers authored by Raj Bhatti

Since Specialization
Citations

This map shows the geographic impact of Raj Bhatti's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Raj Bhatti with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Raj Bhatti more than expected).

Fields of papers citing papers by Raj Bhatti

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Raj Bhatti. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Raj Bhatti. The network helps show where Raj Bhatti may publish in the future.

Co-authorship network of co-authors of Raj Bhatti

This figure shows the co-authorship network connecting the top 25 collaborators of Raj Bhatti. A scholar is included among the top collaborators of Raj Bhatti based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Raj Bhatti. Raj Bhatti is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Mallik, Sabuj, et al.. (2015). Effects of component stand-off height on reliability of solder joints in assembled electronic component. European Microelectronics and Packaging Conference. 2 indexed citations
2.
3.
Gao, James, et al.. (2015). A Modular Product Structure Based Methodology for Seamless Information Flow in PLM System Implementation. Computer-Aided Design and Applications. 12(6). 742–752. 3 indexed citations
4.
Bhatti, Raj, et al.. (2013). Prediction and optimization of design parameters of microelectronic heat sinks. Journal of Emerging Trends in Engineering and Applied Sciences. 4(3). 493–500. 5 indexed citations
5.
Otiaba, Kenny C., Michael Okereke, & Raj Bhatti. (2013). Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering. 64(1-2). 51–63. 47 indexed citations
6.
Bhatti, Raj, et al.. (2013). The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal. 45(2). 159–166. 6 indexed citations
7.
Bhatti, Raj, et al.. (2013). Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability. 54(1). 239–244. 37 indexed citations
8.
Bhatti, Raj, et al.. (2012). Effects of thermal interface materials (solders) on thermal performance of a microelectronic package. 154–159. 10 indexed citations
9.
Otiaba, Kenny C., Raj Bhatti, N.N. Ekere, et al.. (2012). Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability. 52(7). 1409–1419. 56 indexed citations
10.
Otiaba, Kenny C., N.N. Ekere, Raj Bhatti, Sabuj Mallik, & Emeka H. Amalu. (2011). Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. Greenwich Academic Literature Archive (University of Greenwich). 1–8. 2 indexed citations
11.
Bhatti, Raj, et al.. (2011). Advanced thermal management materials for heat sinks used in microelectronics. European Microelectronics and Packaging Conference. 1–8. 9 indexed citations
12.
Otiaba, Kenny C., et al.. (2011). Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. 1–5. 3 indexed citations
13.
Amalu, Emeka H., et al.. (2011). A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering. 88(7). 1610–1617. 20 indexed citations
14.
Otiaba, Kenny C., et al.. (2011). Thermal effects of die-attach voids location and style on performance of chip level package. Greenwich Academic Literature Archive (University of Greenwich). 9. 231–236. 10 indexed citations
15.
Otiaba, Kenny C., N.N. Ekere, Raj Bhatti, et al.. (2011). Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability. 51(12). 2031–2043. 123 indexed citations
16.
Amalu, Emeka H., et al.. (2011). Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Excursion. Advanced materials research. 367. 287–292. 4 indexed citations
17.
Otiaba, Kenny C., N.N. Ekere, Emeka H. Amalu, Raj Bhatti, & Sabuj Mallik. (2011). Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R and D Challenges. Advanced materials research. 367. 301–307. 5 indexed citations
18.
Mallik, Sabuj, N.N. Ekere, Chris Best, & Raj Bhatti. (2010). Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering. 31(2-3). 355–362. 174 indexed citations
19.
Bhatti, Raj, et al.. (2007). Evaluating the process of polishing borosilicate glass capillaries used for fabrication of in-vitro fertilization (iVF) micro-pipettes. Biomedical Microdevices. 10(1). 123–128. 9 indexed citations
20.
Bhatti, Raj, et al.. (1989). Two-Phase Capillary-Pumped Loop: A Potential Heat Transport System. SAE technical papers on CD-ROM/SAE technical paper series. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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