Raj Bhatti
- Mechanical Engineering top 5%
- Electrical and Electronic Engineering top 10%
- Materials Chemistry
- Mechanics of Materials top 10%
- Ceramics and Composites top 10%
- Co-authors
- N.N. EkereSabuj MallikKenny C. OtiabaEmeka H. AmaluChris BestM.O. AlamMichael OkerekeS.M. Lawrence
- Topics
- Electronic Packaging and Soldering Technologies (18 papers)Thermal properties of materials (12 papers)3D IC and TSV technologies (11 papers)
- Journals
- Journal of Materials Processing TechnologyApplied Thermal EngineeringSAE technical papers on CD-ROM/SAE technical paper series
- Partner nations
- United KingdomGhanaHong Kong
In The Last Decade
Raj Bhatti
33 papers receiving 657 citations
Peers
Comparison fields: 5 of 42
- Mechanical Engineering 379
- Electrical and Electronic Engineering 335
- Materials Chemistry 262
- Mechanics of Materials 100
- Ceramics and Composites 80
Countries citing papers authored by Raj Bhatti
This map shows the geographic impact of Raj Bhatti's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Raj Bhatti with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Raj Bhatti more than expected).
Fields of papers citing papers by Raj Bhatti
This network shows the impact of papers produced by Raj Bhatti. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Raj Bhatti. The network helps show where Raj Bhatti may publish in the future.
Co-authorship network of co-authors of Raj Bhatti
This figure shows the co-authorship network connecting the top 25 collaborators of Raj Bhatti. A scholar is included among the top collaborators of Raj Bhatti based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Raj Bhatti. Raj Bhatti is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | Effects of component stand-off height on reliability of solder joints in assembled electronic component | 2 |
| 2 | 7 | |
| 3 | 3 | |
| 4 | Prediction and optimization of design parameters of microelectronic heat sinks | 5 |
| 5 | 47 | |
| 6 | 6 | |
| 7 | 37 | |
| 8 | Effects of thermal interface materials (solders) on thermal performance of a microelectronic package | 10 |
| 9 | 56 | |
| 10 | Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application | 2 |
| 11 | Advanced thermal management materials for heat sinks used in microelectronics | 9 |
| 12 | Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device | 3 |
| 13 | 20 | |
| 14 | 10 | |
| 15 | 123 | |
| 16 | 4 | |
| 17 | 5 | |
| 18 | 174 | |
| 19 | 9 | |
| 20 | 2 |
About Raj Bhatti
Raj Bhatti is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Fluid Flow and Transfer Processes, having authored 33 papers that have together received 692 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), Thermal properties of materials (12 papers) and 3D IC and TSV technologies (11 papers). The work is most often cited by research in Ceramics and Composites (80 citations), Mechanical Engineering (379 citations) and Electrical and Electronic Engineering (335 citations). Raj Bhatti has collaborated with scholars based in United Kingdom, Ghana and Hong Kong. Frequent co-authors include N.N. Ekere, Sabuj Mallik, Kenny C. Otiaba, Emeka H. Amalu, Chris Best, M.O. Alam, Michael Okereke, S.M. Lawrence, M. Dubois and Francisco Chinesta. Their work appears in journals such as Journal of Materials Processing Technology, Applied Thermal Engineering and SAE technical papers on CD-ROM/SAE technical paper series.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.