Tae-Kyu Lee

1.8k total citations
86 papers, 1.4k citations indexed

About

Tae-Kyu Lee is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Tae-Kyu Lee has authored 86 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 80 papers in Electrical and Electronic Engineering, 37 papers in Mechanical Engineering and 10 papers in Mechanics of Materials. Recurrent topics in Tae-Kyu Lee's work include Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (57 papers) and Integrated Circuits and Semiconductor Failure Analysis (19 papers). Tae-Kyu Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (57 papers) and Integrated Circuits and Semiconductor Failure Analysis (19 papers). Tae-Kyu Lee collaborates with scholars based in United States, South Korea and China. Tae-Kyu Lee's co-authors include Thomas R. Bieler, Bite Zhou, Kuo-Chuan Liu, Hongtao Ma, S.K. Hwang, Choong-Un Kim, Farhang Pourboghrat, Jenq‐Gong Duh, Jie Xue and Kyungjung Kwon and has published in prestigious journals such as Materials Science and Engineering A, Scripta Materialia and Materials & Design.

In The Last Decade

Tae-Kyu Lee

81 papers receiving 1.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tae-Kyu Lee United States 22 1.1k 949 260 243 228 86 1.4k
Ikuo Shohji Japan 15 861 0.8× 678 0.7× 120 0.5× 151 0.6× 95 0.4× 174 1.0k
Jianyun Shen China 20 254 0.2× 984 1.0× 412 1.6× 244 1.0× 154 0.7× 55 1.2k
M.O. Alam Hong Kong 22 1.4k 1.3× 784 0.8× 185 0.7× 109 0.4× 170 0.7× 52 1.5k
Zhipeng Cai China 18 207 0.2× 976 1.0× 402 1.5× 155 0.6× 335 1.5× 94 1.2k
Donald Francis Susan United States 16 245 0.2× 514 0.5× 273 1.1× 195 0.8× 84 0.4× 49 800
Bo Pan China 17 182 0.2× 491 0.5× 449 1.7× 201 0.8× 120 0.5× 45 901
Jijin Xu China 22 219 0.2× 1.2k 1.3× 292 1.1× 213 0.9× 208 0.9× 76 1.4k
K. Siva Kumar United States 14 239 0.2× 576 0.6× 387 1.5× 50 0.2× 191 0.8× 30 885
Sirous Asgari Iran 21 310 0.3× 1.2k 1.2× 664 2.6× 289 1.2× 374 1.6× 41 1.5k
Chung-Yun Kang South Korea 18 121 0.1× 927 1.0× 378 1.5× 247 1.0× 195 0.9× 102 1.1k

Countries citing papers authored by Tae-Kyu Lee

Since Specialization
Citations

This map shows the geographic impact of Tae-Kyu Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tae-Kyu Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tae-Kyu Lee more than expected).

Fields of papers citing papers by Tae-Kyu Lee

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tae-Kyu Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tae-Kyu Lee. The network helps show where Tae-Kyu Lee may publish in the future.

Co-authorship network of co-authors of Tae-Kyu Lee

This figure shows the co-authorship network connecting the top 25 collaborators of Tae-Kyu Lee. A scholar is included among the top collaborators of Tae-Kyu Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tae-Kyu Lee. Tae-Kyu Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lee, Tae-Kyu, Hanry Yang, & I. Dutta. (2023). Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration. Journal of Electronic Materials. 53(3). 1214–1222. 3 indexed citations
2.
Chang, Simon, et al.. (2022). Edgebond adhesive enhances the reliability of low-temperature solder in board-level assembly (IMPACT 2022). PDXScholar (Portland State University). 1–4.
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Kim, Woo Seok, et al.. (2021). The Corrosion of Stainless Steel Made by Additive Manufacturing: A Review. Metals. 11(3). 516–516. 73 indexed citations
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Chen, Wei‐Yu, et al.. (2015). The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test. Journal of Materials Science Materials in Electronics. 26(12). 10055–10061. 8 indexed citations
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Lee, Tae-Kyu, Thomas R. Bieler, Choong-Un Kim, & Hongtao Ma. (2014). Fundamentals of Lead-Free Solder Interconnect Technology. CERN Document Server (European Organization for Nuclear Research). 76 indexed citations
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Lee, Tae-Kyu, et al.. (2013). Enhancing Mechanical Shock Performance Using Edgebond Technology. 15(1). 3 indexed citations
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Kim, Choong-Un, et al.. (2013). Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing. JOM. 65(10). 1362–1373. 23 indexed citations
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Kim, Sung Min, et al.. (2011). Process Design Program for Multistage Profile Drawing from Round Material. Journal of the Korean Society for Precision Engineering. 28(3). 377–382. 2 indexed citations
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Xie, Weidong, Tae-Kyu Lee, Kuo-Chuan Liu, & Jie Xue. (2010). Pb-free solder joint reliability of fine pitch chip-scale packages. 1587–1590. 11 indexed citations
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Lee, Tae-Kyu, et al.. (2003). Detecting incipient fatigue damage with scanning SQUID microscopy. APS. 2003. 1 indexed citations
20.
Lee, Tae-Kyu, et al.. (2000). Effect of Inclusion Size on the Nucleation of Acicular Ferrite in Welds.. ISIJ International. 40(12). 1260–1268. 181 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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