Tae-Kyu Lee

120 total papers · 1.8k total citations
59 papers, 1.1k citations indexed

Tae-Kyu Lee is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, Tae-Kyu Lee has authored 59 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 54 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 9 papers in Aerospace Engineering. Recurrent topics in Tae-Kyu Lee’s work include Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (38 papers) and Integrated Circuits and Semiconductor Failure Analysis (12 papers). Tae-Kyu Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (38 papers) and Integrated Circuits and Semiconductor Failure Analysis (12 papers). Tae-Kyu Lee collaborates with scholars based in United States, South Korea and Taiwan. Tae-Kyu Lee's co-authors include Thomas R. Bieler, Bite Zhou, Kuo-Chuan Liu, S.K. Hwang, Farhang Pourboghrat, Hongtao Ma, Choong-Un Kim, Jenq‐Gong Duh, Woo Seok Kim and Kyungjung Kwon and has published in prestigious journals such as Materials Science and Engineering A, Scripta Materialia and Materials & Design.