Tae-Kyu Lee
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 2%
- Materials Chemistry
- Aerospace Engineering top 5%
- Mechanics of Materials top 5%
- Co-authors
- Thomas R. BielerBite ZhouKuo-Chuan LiuHongtao MaS.K. HwangChoong-Un KimFarhang PourboghratJenq‐Gong Duh
- Topics
- Electronic Packaging and Soldering Technologies (76 papers)3D IC and TSV technologies (57 papers)Integrated Circuits and Semiconductor Failure Analysis (19 papers)
- Partner nations
- United StatesSouth KoreaChina
In The Last Decade
Tae-Kyu Lee
81 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 42
- Electrical and Electronic Engineering 1.1k
- Mechanical Engineering 949
- Materials Chemistry 260
- Aerospace Engineering 243
- Mechanics of Materials 228
Countries citing papers authored by Tae-Kyu Lee
This map shows the geographic impact of Tae-Kyu Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tae-Kyu Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tae-Kyu Lee more than expected).
Fields of papers citing papers by Tae-Kyu Lee
This network shows the impact of papers produced by Tae-Kyu Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tae-Kyu Lee. The network helps show where Tae-Kyu Lee may publish in the future.
Co-authorship network of co-authors of Tae-Kyu Lee
This figure shows the co-authorship network connecting the top 25 collaborators of Tae-Kyu Lee. A scholar is included among the top collaborators of Tae-Kyu Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tae-Kyu Lee. Tae-Kyu Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 0 | |
| 3 | 73 | |
| 4 | 1 | |
| 5 | 2 | |
| 6 | 1 | |
| 7 | 1 | |
| 8 | 1 | |
| 9 | 8 | |
| 10 | 5 | |
| 11 | 76 | |
| 12 | 3 | |
| 13 | 2 | |
| 14 | 23 | |
| 15 | 2 | |
| 16 | Process Design Program for Multistage Profile Drawing from Round Material | 2 |
| 17 | 11 | |
| 18 | 1 | |
| 19 | Detecting incipient fatigue damage with scanning SQUID microscopy | 1 |
| 20 | 181 |
About Tae-Kyu Lee
Tae-Kyu Lee is a scholar working on Electrical and Electronic Engineering, General Materials Science and Mechanical Engineering, having authored 86 papers that have together received 1.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (57 papers) and Integrated Circuits and Semiconductor Failure Analysis (19 papers). The work is most often cited by research in Mechanical Engineering (949 citations), Metals and Alloys (65 citations) and Electrical and Electronic Engineering (1.1k citations). Tae-Kyu Lee has collaborated with scholars based in United States, South Korea and China. Frequent co-authors include Thomas R. Bieler, Bite Zhou, Kuo-Chuan Liu, Hongtao Ma, S.K. Hwang, Choong-Un Kim, Farhang Pourboghrat, Jenq‐Gong Duh, Jie Xue and Kyungjung Kwon. Their work appears in journals such as Materials Science and Engineering A, Scripta Materialia and Materials & Design.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.